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M2S090T-FCS325I

Microchip Technology

M2S090T-FCS325I by Microchip Technology

FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;

Median Price

$198.220

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 431 parts In-Stock

1+ parts

$198.220

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431

$198.220

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Microchip Technology

USA . 13 parts In-Stock

1+ parts

$198.220

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$195.350

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$103.690

10k+ parts

$94.270

13

$198.220

$195.350

$103.690

$94.270

Master Electronics

USA . 149 parts In-Stock

1+ parts

-

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$256.100

1k+ parts

$170.840

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149

-

$256.100

$170.840

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Distributors (In-Stock)

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Digiode

USA . 330 parts In-Stock

1+ parts

$188.309

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330

$188.309

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Vyrian

USA . 111 parts In-Stock

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$198.220

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111

$198.220

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 295 parts In-Stock

1+ parts

$168.490

100+ parts

$164.278

1k+ parts

$163.435

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295

$168.490

$164.278

$163.435

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Corphita

USA . 116 parts In-Stock

1+ parts

$178.398

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116

$178.398

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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LMD Electronica

Estonia . 6,878 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,624 parts In-Stock

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5,624

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Montano Global Distributors

Canada . 2,253 parts In-Stock

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NIA Electronics

USA . 509 parts In-Stock

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509

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Ledger Components

France . 509 parts In-Stock

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509

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Technical Specifications

Field Programmable Gate Arrays (FPGA) M2S090T-FCS325I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

86184

No. of Inputs:

180

No. of Outputs:

180

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

240 °C (464 °F)

Peak Reflow Time:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

13.5 mm

Width:

11 mm

Maximum Seated Height:

1.16 mm

Package Equivalence Code:

BGA325,21X21,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

.5 mm

No. of Terminals:

325

Standards

JESD-30 Code:

R-PBGA-B325

Trade Compliance

M2S090T-FCS325I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

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