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XC7A200T-L1FBG676I

Xilinx

XC7A200T-L1FBG676I by Xilinx

Xilinx XC7A200T-L1FBG676I is a FPGA with 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Operating b/w -40 to 100 °C, it's ideal for applications requiring high-speed processing like telecommunications and industrial automation. With a grid array package style and moisture sensitivity level of 4, it offers versatile programmability in compact designs.

Median Price

$393.350

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Farnell

UK . 20 parts In-Stock

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Mouser Electronics

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Element14

Singapore . 20 parts In-Stock

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Digiode

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VNN

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Nova Conductors

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Vyrian

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Modulus Dynamics

Lithuania . 1,584 parts In-Stock

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AZTECH Wire

Italy . 245 parts In-Stock

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Advanced Electronics

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MARBEL Systems

Belgium . 1,237 parts In-Stock

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Texas Native Microelectronics

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Kenton Components

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Aztec Data Supply Inc.

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Corohmni

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Vigor

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Ampacity Inc.

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Semicontronic

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Corphita

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Argo Parts USA

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Continental Prestige Electronics

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Netroflash

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One Stop Electronics

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QUARKTWIN TECHNOLOGY LTD

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Qasali Group International

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Overview

Unlock limitless possibilities with the Xilinx XC7A200T-L1FBG676I FPGA, a cutting-edge technology that empowers you to innovate and create with ease. Manufactured by Xilinx, a trusted industry leader, this Field Programmable Gate Array boasts 215360 logic cells, 16825 CLBs, and 400 inputs/outputs. Perfect for a wide range of applications, from telecommunications to aerospace, this FPGA offers unparalleled performance and flexibility. Experience the value and benefits of this high-quality product and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 215360

Large number of logic cells allow for complex designs and high functionality in the FPGA.

Surface Mount: YES

Surface mount capability makes it easy to integrate and assemble in circuit boards efficiently.

Maximum Supply Voltage: 0.98 V

Low maximum supply voltage reduces power consumption and heat dissipation, increasing energy efficiency.

No. of CLBs: 16825

Abundance of Configurable Logic Blocks (CLBs) provide versatility in designing custom logic functions.

No. of Inputs: 400

Large number of inputs allow for multiple data sources to be processed simultaneously.

Package Shape: SQUARE

Square shape package enables easier mounting and alignment on circuit boards.

Form Of Terminal: BALL

Ball terminals allow for better solder joint reliability and mechanical strength.

Nominal Supply Voltage (V): 0.95

Stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

No. of Terminals: 676

Adequate number of terminals for connectivity and interface with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, it offers flexibility in configuration and reprogramming for different applications.

Package Style (Meter): GRID ARRAY

Grid array packaging provides high density and efficient use of space on PCBs, allowing for more functionality in a smaller footprint.

Minimum Supply Voltage: 0.92 V

Low minimum supply voltage ensures compatibility with a wide range of power sources and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature tolerance ensures reliability in harsh environments and under heavy load conditions.

Pitch Of Terminal: 1 mm

1mm terminal pitch allows for sufficient spacing between terminals for easy soldering and assembly.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low combinatorial delay of Configurable Logic Blocks enables fast data processing and high-speed operations.

Organization: 16825 CLBS

Well-organized Configurable Logic Blocks make it easier to design and implement complex logic functions efficiently.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for use in extreme cold conditions without compromising performance.

Finishing Of Terminal Used: TIN SILVER COPPER

Terminal finishing with tin, silver, and copper ensures good conductivity, corrosion resistance, and solderability.

Position Of Terminal: BOTTOM

Bottom positioning of terminals makes it easier to mount and connect the FPGA on circuit boards.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates it can withstand standard lead-free reflow soldering processes without damage.

Maximum Seated Height: 2.54 mm

Low seated height allows for slim and compact design, ideal for space-constrained applications.

Width: 27 mm

Compact width makes it suitable for applications where space is limited or a smaller form factor is required.

No. of Outputs: 400

Large number of outputs allow the FPGA to drive multiple devices or components simultaneously.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds maximum time at peak reflow temperature ensures proper soldering without damaging the FPGA.

Peak Reflow Temperature °C: 250

High peak reflow temperature tolerance allows for standard lead-free soldering processes without overheating the FPGA.

Length: 27 mm

Compact length allows for efficient use of space in PCB layouts and compact electronic designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7A200T-L1FBG676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

215360

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

16825

CLB Maximum Delay:

1.27 ns

Organization:

16825 CLBS

Power Characteristics

Nominal Supply Voltage:

.95

Minimum Supply Voltage:

.92 V

Maximum Supply Voltage:

.98 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

2.54 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XC7A200T-L1FBG676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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