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LCMXO3LF-6900C-6BG256C

Lattice Semiconductor

LCMXO3LF-6900C-6BG256C by Lattice Semiconductor

LCMXO3LF-6900C-6BG256C by Lattice Semiconductor is a 2.5V FPGA with 858 CLBs, operating b/w 0-85°C. It features a grid array package style, 0.8mm terminal pitch, and is ideal for applications requiring high-performance programmable ICs in compact designs.

Median Price

$26.950

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Arrow

USA . 99 parts In-Stock

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$20.150

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$19.250

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DigiKey

USA . 22 parts In-Stock

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$26.950

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$21.725

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Verical

USA . 595 parts In-Stock

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$45.000

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Nova Conductors

Japan . 46 parts In-Stock

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Vyrian

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Ampacity Inc.

Singapore . 3,615 parts In-Stock

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$16.680

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Continental Prestige Electronics

USA . 6,921 parts In-Stock

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$18.218

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Microchip USA

USA . 1,007 parts In-Stock

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$22.700

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$21.700

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$21.200

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Semicontronic

India . 3,419 parts In-Stock

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$35.392

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Aztec Data Supply Inc.

USA . 2,033 parts In-Stock

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Advanced Electronics

New Zealand . 1,536 parts In-Stock

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Corohmni

South Africa . 597 parts In-Stock

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Argo Parts USA

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Netroflash

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Robosynatics

Brazil . 2,000 parts In-Stock

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Lucentia Tech

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$1.871

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Overview

Unlock the power of advanced technology with the LCMXO3LF-6900C-6BG256C by Lattice Semiconductor. As a leading manufacturer in the industry, Lattice Semiconductor delivers top-notch quality in Field Programmable Gate Arrays (FPGA) like no other. This versatile product offers endless possibilities for applications in various industries, providing customers with unmatched value and benefits. Say goodbye to limitations and hello to innovation with the LCMXO3LF-6900C-6BG256C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and reducing errors during assembly.

Maximum Supply Voltage: 3.465 V

Can handle higher supply voltages, offering flexibility in power requirements for different applications.

No. of CLBs: 858

Large number of CLBs provide ample resources for complex logic designs and processing tasks.

Package Shape: SQUARE

Compact and space-saving design for efficient PCB layout and integration.

Nominal Supply Voltage (V): 2.5

Stable supply voltage ensures reliable performance and consistent operation.

No. of Terminals: 256

Sufficient number of terminals for connectivity and interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Offers flexibility and customization for implementing different logic functions and algorithms.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enhanced electrical performance and signal integrity with fine pitch terminals and low profile package.

Minimum Supply Voltage: 2.375 V

Supports lower supply voltages for power-efficient operation in battery-powered devices.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, suitable for industrial and harsh environmental conditions.

Pitch Of Terminal: 0.8 mm

Fine pitch terminals enable high-density mounting and smaller PCB footprint.

Organization: 858 CLBS

Organized structure with 858 CLBs for effective utilization and management of logic resources.

Minimum Operating Temperature: 0 °C

Can operate in cold environments without risk of damage or performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

Provides reliable electrical connections and resistance to corrosion for long-lasting performance.

Position Of Terminal: BOTTOM

Bottom terminal position for easy access and convenient board-level connections.

Moisture Sensitivity Level (MSL): 3

Moderate MSL level indicates resilience to moisture exposure during storage and handling.

Maximum Seated Height: 1.7 mm

Low profile design for space-constrained applications and compact system integration.

Width: 14 mm

Compact width dimension for efficient PCB layout and space optimization.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for specified duration during assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for robust soldering and assembly reliability.

Length: 14 mm

Compact length dimension for space-saving integration and efficient board design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) LCMXO3LF-6900C-6BG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Lattice Semiconductor

IC Features

Programmable IC Type:

No. of CLBs:

858

Organization:

858 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

2.5

Minimum Supply Voltage:

2.375 V

Maximum Supply Voltage:

3.465 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.7 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Trade Compliance

LCMXO3LF-6900C-6BG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.

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