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10M50DAF256C7G

Intel

10M50DAF256C7G by Intel

Intel's 10M50DAF256C7G FPGA features 50000 logic cells, 3125 CLBs, and 500 inputs. Ideal for applications requiring high-speed processing and programmable ICs in a compact square package with a max supply voltage of 1.25 V.

Median Price

$215.010

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Mouser Electronics

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DigiKey

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Verical

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Nova Conductors

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Digiode

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AZTECH Wire

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Modulus Dynamics

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Aranea Global

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Aztec Data Supply Inc.

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Continental Prestige Electronics

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Microchip USA

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Texas Native Microelectronics

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Kenton Components

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Overview

Unlock the power of cutting-edge technology with the 10M50DAF256C7G by Intel. This Field Programmable Gate Array (FPGA) boasts 50,000 logic cells and 3125 CLBs, making it a versatile and powerful solution for a wide range of applications. With a maximum supply voltage of 1.25 V and a package shape of SQUARE, this FPGA is designed to deliver top-notch performance. Trust Intel's reputation for quality and innovation to bring you a product that exceeds expectations. Experience the value and benefits of the 10M50DAF256C7G and take your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the FPGA lightweight and cost-effective.

No. of Logic Cells: 50000

With a high number of logic cells, this FPGA offers ample capacity for complex designs and processing tasks.

Surface Mount: YES

Being surface mountable makes it easier to integrate this FPGA onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.25 V

The maximum supply voltage of 1.25 V ensures safe and efficient operation of the FPGA within specified parameters.

No. of CLBs: 3125

A high number of Configurable Logic Blocks (CLBs) allows for flexible customization and logic implementation in the FPGA design.

No. of Inputs: 500

With 500 inputs, this FPGA can handle a large number of data inputs for processing and manipulation.

Package Shape: SQUARE

The square package shape provides a uniform footprint for easy PCB layout and integration.

Form Of Terminal: BALL

The use of ball terminals offers reliable connections and simplifies the soldering process during installation.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2 V ensures stable and consistent performance of the FPGA in various operating conditions.

Power Supplies (V): 1.2

Having a single power supply voltage simplifies the overall design and power management of the FPGA system.

No. of Terminals: 256

Having 256 terminals provides sufficient connectivity options for interfacing with other components and peripherals in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for reconfigurability and flexibility for adapting to changing system requirements and designs.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and efficient layout for optimizing space on the PCB.

Minimum Supply Voltage: 1.15 V

The minimum supply voltage of 1.15 V ensures compatibility with lower voltage systems and provides a wide operating voltage range.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can withstand high temperature environments and maintain reliable performance.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals allows for fine pitch soldering and compact design integration on the PCB.

Organization: 3125 CLBS

The organization of 3125 Configurable Logic Blocks (CLBs) provides a structured framework for implementing complex logic functions and algorithms.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable operation even in low-temperature environments.

Finishing Of Terminal Used: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin/silver/copper finishing on terminals ensures good conductivity, corrosion resistance, and reliable solder joints for long-term durability.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies the assembly process and allows for efficient heat dissipation.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this FPGA is suitable for a wide range of environmental conditions and storage requirements.

Maximum Seated Height: 1.55 mm

The low maximum seated height of 1.55 mm allows for a compact and slim profile for the overall system design.

Width: 17 mm

With a width of 17 mm, this FPGA offers a compact form factor for space-constrained applications and PCB layouts.

No. of Outputs: 500

Having 500 outputs provides ample signaling options for transmitting processed data and control signals to other system components.

Length: 17 mm

With a length of 17 mm, this FPGA maintains a square form factor for uniformity and easy integration into standard PCB designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M50DAF256C7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

50000

No. of Inputs:

500

No. of Outputs:

500

No. of CLBs:

3125

Sub-Category:

Field Programmable Gate Arrays

Organization:

3125 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Power Supplies:

1.2 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin/Silver/Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

10M50DAF256C7G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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