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XC3SD1800A-4CSG484C

Xilinx

XC3SD1800A-4CSG484C by Xilinx

The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.

Median Price

$106.425

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Overview

Unleash the power of innovation with Xilinx's XC3SD1800A-4CSG484C Field Programmable Gate Array. Built with cutting-edge CMOS technology, this FPGA boasts 1800000 equivalent gates and 37440 logic cells, offering unparalleled performance and versatility. Ideal for a wide range of applications, from telecommunications to automotive electronics, this FPGA delivers maximum supply voltage of 1.26V at a maximum clock frequency of 250MHz. With Xilinx's reputation for quality and reliability, customers can trust in the value and benefits that the XC3SD1800A-4CSG484C brings to their projects, ensuring success and satisfaction every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the product is able to withstand various environmental conditions.

No. of Logic Cells: 37440

The high number of logic cells allows for complex programmability and customization in designs.

Surface Mount: YES

Surface mount capability makes it easier for integration into circuit boards and reduces assembly time.

Maximum Supply Voltage: 1.26 V

Efficient power consumption at a moderate supply voltage.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity, making it energy-efficient.

No. of Inputs: 309

Plenty of input options for versatile connectivity and input signal processing.

Package Shape: SQUARE

Square shape provides ease of handling and integration into standard PCB layouts.

No. of Equivalent Gates: 1800000

Large number of equivalent gates enable complex logic operations and processing capabilities.

Nominal Supply Voltage (V): 1.2

Stable supply voltage for consistent performance and operation.

Power Supplies (V): 1.2,2.5/3.3

Support for multiple power supply options for flexibility in system design and compatibility.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array allows for customization and reprogramming without the need for hardware changes.

Package Style (Meter): GRID ARRAY

Grid array package style enables secure mounting and reliability in harsh environments.

Maximum Combinatorial Delay of a CLB: 0.71 ns

Low combinatorial delay ensures fast processing and response times in logic operations.

Minimum Operating Temperature: 0 °C

Wide operating temperature range allows for use in various environments without performance degradation.

Finishing Of Terminal Used: TIN SILVER COPPER

High-quality terminal finishing ensures reliable connections and long-term durability.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for robust soldering and assembly processes.

Grading Of Temperature: COMMERCIAL EXTENDED

Extended temperature grading ensures the product can operate in extended commercial temperature ranges.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3SD1800A-4CSG484C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

37440

No. of Inputs:

309

No. of Outputs:

249

No. of CLBs:

4160

No. of Equivalent Gates:

1800000

Maximum Clock Frequency:

250 MHz

CLB Maximum Delay:

0.71 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

4160 CLBS, 1800000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,2.5/3.3 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3SD1800A-4CSG484C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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