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XC3S400-4FTG256C

Xilinx

XC3S400-4FTG256C by Xilinx

The Xilinx XC3S400-4FTG256C FPGA features 8064 logic cells, 896 CLBs, and a max clock frequency of 630 MHz. Ideal for applications requiring high-speed processing and programmable logic capabilities in a compact package.

Median Price

$75.260

Lifecycle Status

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Mouser Electronics

USA . 4,553 parts In-Stock

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DigiKey

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Digiode

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Nova Conductors

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LIBRA Elektronik GmbH

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Vigor

Singapore . 892 parts In-Stock

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Modulus Dynamics

Lithuania . 972 parts In-Stock

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Semicontronic

India . 4,401 parts In-Stock

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Ampacity Inc.

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MARBEL Systems

Belgium . 2,132 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Netroflash

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Microchip USA

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Texas Native Microelectronics

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Kenton Components

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Advanced Electronics

New Zealand . 4,013 parts In-Stock

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Overview

Unlock the potential of your designs with the XC3S400-4FTG256C by Xilinx, a top-quality Field Programmable Gate Array that offers unparalleled flexibility and performance. Manufactured by Xilinx, a renowned leader in FPGA technology, this versatile product is perfect for a wide range of applications. With its cutting-edge features and high reliability, the XC3S400-4FTG256C delivers exceptional value and benefits to customers looking to optimize their projects. Experience the advantages of this innovative FPGA and take your designs to the next level with Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 8064

With a high number of logic cells, this FPGA offers more flexibility and capability to handle complex designs efficiently.

Surface Mount: YES

Being surface mountable allows for easier and more efficient PCB assembly, saving time and resources during manufacturing.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it suitable for energy-efficient designs.

No. of CLBs: 896

The large number of Configurable Logic Blocks (CLBs) provides ample resources for implementing various logic functions, enabling versatile design possibilities.

Technology Used: CMOS

CMOS technology offers high noise immunity, low power consumption, and high speed operation, ensuring reliable performance in different applications.

No. of Inputs: 173

With a sufficient number of inputs, this FPGA can accommodate multiple external signals and data inputs, making it suitable for diverse applications.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate, optimizing the layout and integration of the FPGA in the system design.

Form Of Terminal: BALL

The ball form of terminal enables easy and reliable connection to the PCB, ensuring good signal integrity and robust performance.

No. of Equivalent Gates: 400000

The large number of equivalent gates offers ample resources for implementing complex digital circuits, making this FPGA suitable for high-density designs.

Nominal Supply Voltage (V): 1.2

The nominal supply voltage of 1.2V provides a stable operating voltage for the FPGA, ensuring consistent and reliable performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S400-4FTG256C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

8064

No. of Inputs:

173

No. of Outputs:

173

No. of CLBs:

896

No. of Equivalent Gates:

400000

Maximum Clock Frequency:

630 MHz

CLB Maximum Delay:

0.61 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

896 CLBS, 400000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Package Equivalence Code:

BGA256,16X16,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S400-4FTG256C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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