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XC3S500E-4FGG320C

Xilinx

XC3S500E-4FGG320C by Xilinx

Xilinx XC3S500E-4FGG320C FPGA offers 10476 logic cells, 1164 CLBs, and 500000 gates. With a max clock frequency of 572 MHz, it is ideal for high-speed applications in industries like telecommunications and aerospace. Operating temperature ranges from 0 to 85°C with a package style of grid array.

Median Price

$125.110

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AZTECH Wire

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Overview

Unlock the power of cutting-edge technology with the Xilinx XC3S500E-4FGG320C Field Programmable Gate Array. Manufactured by industry leader Xilinx, this FPGA boasts unparalleled quality and reliability. With a myriad of applications in industries ranging from telecommunications to aerospace, this versatile FPGA offers customers unmatched value and benefits. Experience seamless performance, flexibility, and efficiency like never before with the XC3S500E-4FGG320C by Xilinx.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body is lightweight and durable, making it a cost-effective choice for applications requiring portability and reliability.

No. of Logic Cells: 10476

With a high number of logic cells, this FPGA can handle complex algorithms and calculations, making it suitable for advanced digital signal processing and high-speed networking applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and reducing assembly time for streamlined manufacturing processes.

Maximum Supply Voltage: 1.26 V

The low maximum supply voltage ensures energy efficiency and reduces power consumption, making it ideal for battery-powered devices or applications where heat dissipation is a concern.

No. of CLBs: 1164

The large number of configurable logic blocks (CLBs) provides flexibility in design and allows for customization to meet specific project requirements.

Technology Used: CMOS

The CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making this FPGA suitable for a wide range of applications requiring high performance and reliability.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC3S500E-4FGG320C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

10476

No. of Inputs:

232

No. of Outputs:

176

No. of CLBs:

1164

No. of Equivalent Gates:

500000

Maximum Clock Frequency:

572 MHz

CLB Maximum Delay:

0.76 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1164 CLBS, 500000 Gates

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.14 V

Maximum Supply Voltage:

1.26 V

Power Supplies:

1.2,1.2/3.3,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2 mm

Package Equivalence Code:

BGA320,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

320

Standards

JESD-30 Code:

S-PBGA-B320

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC3S500E-4FGG320C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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