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XCAU15P-2FFVB676I

Xilinx

XCAU15P-2FFVB676I by Xilinx

Xilinx XCAU15P-2FFVB676I FPGA offers 170100 logic cells, 9720 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing in a compact form factor. Operating temperature range from -40 to 100°C makes it versatile for various environments.

Median Price

$320.320

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DigiKey

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Digiode

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VNN

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Nova Conductors

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AZTECH Wire

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Modulus Dynamics

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Advanced Electronics

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$34.599

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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One Stop Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Overview

Unlock unparalleled performance and versatility with the XCAU15P-2FFVB676I by Xilinx, a cutting-edge Field Programmable Gate Array (FPGA) that redefines innovation. Built with precision and expertise, this FPGA boasts 170100 logic cells and 9720 CLBs, offering endless possibilities for customization and optimization. From telecommunications to automotive industries, the XCAU15P-2FFVB676I delivers unmatched value and flexibility to meet your unique needs. Elevate your projects with the power of Xilinx and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for various applications.

No. of Logic Cells: 170100

With a large number of logic cells, this FPGA can handle complex logic functions and tasks efficiently.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.876 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making it energy-efficient.

No. of CLBs: 9720

The high number of Configurable Logic Blocks (CLBs) provides flexibility and customization for various applications.

No. of Inputs: 228

With a large number of inputs, this FPGA can accommodate multiple data sources and signals effectively.

Package Shape: SQUARE

The square shape of the package allows for efficient use of board space and easy alignment during assembly.

Form Of Terminal: BALL

The use of ball terminals simplifies soldering and ensures secure connections.

Nominal Supply Voltage (V): 0.85

The nominal supply voltage of 0.85V offers a stable operating environment for the FPGA.

No. of Terminals: 676

With numerous terminals, this FPGA can support multiple connections and interfaces.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this product offers the flexibility of reprogramming and adapting to different tasks, making it versatile.

Package Style (Meter): GRID ARRAY

The grid array package style provides a stable and reliable mounting solution for the FPGA.

Minimum Supply Voltage: 0.825 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch allows for precise and compact connections on the FPGA.

Organization: 9720 CLBS

The organized layout of 9720 CLBs enhances the efficiency and performance of this FPGA.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliability even in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on the terminals provides excellent conductivity and durability.

Position Of Terminal: BOTTOM

The placement of terminals on the bottom allows for easy access and connection in circuit designs.

Moisture Sensitivity Level (MSL): 4

With an MSL of 4, this FPGA is suitable for usage in moderate humidity environments.

Maximum Seated Height: 3.52 mm

The low maximum seated height ensures compatibility with compact electronic devices and designs.

Width: 27 mm

The 27mm width of this FPGA offers a balance between compact size and functionality.

No. of Outputs: 228

With a high number of outputs, this FPGA can transmit data and signals efficiently to external components.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and mounting during assembly.

Peak Reflow Temperature °C: 250

With a peak reflow temperature of 250°C, this FPGA can withstand high-temperature soldering processes effectively.

Length: 27 mm

The 27mm length of this FPGA complements its square shape, optimizing board space usage.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XCAU15P-2FFVB676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

170100

No. of Inputs:

228

No. of Outputs:

228

No. of CLBs:

9720

Organization:

9720 CLBS

Power Characteristics

Nominal Supply Voltage:

0.85

Minimum Supply Voltage:

.825 V

Maximum Supply Voltage:

.876 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3.52 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e1

Trade Compliance

XCAU15P-2FFVB676I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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