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MPF300T-1FCG784E

Microchip Technology

MPF300T-1FCG784E by Microchip Technology

MPF300T-1FCG784E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 388 inputs/outputs, operates b/w 0-100°C, and uses plastic/epoxy package for surface mount applications.

Median Price

$404.770

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 1 parts In-Stock

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$404.770

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1

$404.770

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Digiode

USA . 117 parts In-Stock

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$354.692

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$354.692

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Nova Conductors

Japan . 42 parts In-Stock

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$551.750

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Vyrian

USA . 2,504 parts In-Stock

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Chip Stock

USA . 1,468 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 317 parts In-Stock

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$5.677

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Corohmni

South Africa . 2 parts In-Stock

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$25.551

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$67.256

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$63.893

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$63.893

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$67.256

$63.893

$63.893

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Aztec Data Supply Inc.

USA . 73 parts In-Stock

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$105.680

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$317.360

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Semicontronic

India . 1 parts In-Stock

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$317.360

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$309.426

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$307.839

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$307.839

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Corphita

USA . 309 parts In-Stock

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$336.024

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Vigor

Singapore . 643 parts In-Stock

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$453.810

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Continental Prestige Electronics

USA . 766 parts In-Stock

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$551.750

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$540.715

766

$551.750

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$540.715

Argo Parts USA

USA . 405 parts In-Stock

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$551.750

100+ parts

$546.232

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$540.715

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$535.198

405

$551.750

$546.232

$540.715

$535.198

Netroflash

USA . 100 parts In-Stock

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$551.750

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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NIA Electronics

USA . 4,017 parts In-Stock

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Ledger Components

France . 4,017 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,969 parts In-Stock

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LMD Electronica

Estonia . 2,071 parts In-Stock

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Montano Global Distributors

Canada . 158 parts In-Stock

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Overview

Elevate your projects with the MPF300T-1FCG784E from Microchip Technology. As a leading manufacturer in the industry, this Field Programmable Gate Array offers unparalleled quality and reliability. With 300000 logic cells and 388 inputs and outputs, this FPGA is versatile and powerful. Whether you're designing industrial automation systems or cutting-edge digital signal processing applications, the MPF300T-1FCG784E delivers exceptional performance. Trust Microchip Technology to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protection for the FPGA, ensuring a longer lifespan.

No. of Logic Cells: 300000

Having 300,000 logic cells allows for complex logic operations and designs to be implemented in the FPGA, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes the FPGA easy to integrate into circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V provides flexibility in power requirements and helps in managing power consumption efficiently.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable in various operating conditions.

No. of Inputs: 388

With 388 inputs, the FPGA can handle a large number of input signals, enabling complex data processing and manipulation.

Package Shape: SQUARE

The square package shape facilitates easier mounting and alignment in circuit board designs, improving overall manufacturability.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections and enable efficient heat dissipation, ensuring stable performance of the FPGA.

No. of Terminals: 784

Having 784 terminals allows for multiple connections and interfaces, enhancing the versatility and connectivity of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this product offers flexibility in logic design and customization, making it suitable for prototyping and development purposes.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout for the terminals, optimizing PCB space utilization and signal routing.

Minimum Supply Voltage: 0.97 V

The minimum supply voltage of 0.97 V allows for operation in low power scenarios, contributing to energy efficiency and reduced heat generation.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, the FPGA can withstand elevated temperatures without compromising performance, suitable for demanding environments.

Pitch Of Terminal: 1 mm

The 1 mm pitch of the terminals enables precise placement and soldering on the PCB, ensuring a secure and reliable electrical connection.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C indicates that the FPGA can function reliably in a wide range of temperature conditions, ensuring consistent performance.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easy soldering and rework processes during assembly, enhancing manufacturability and serviceability.

Maximum Seated Height: 3.47 mm

The maximum seated height of 3.47 mm allows for low-profile PCB designs, reducing overall system size and improving space efficiency.

Width: 29 mm

A width of 29 mm provides a compact form factor for the FPGA, making it suitable for applications with limited space constraints or size requirements.

No. of Outputs: 388

Having 388 outputs allows the FPGA to drive multiple external devices or components, enabling complex signal routing and communication capabilities.

Length: 29 mm

A length of 29 mm contributes to the compact design of the FPGA, facilitating easier integration into circuit board layouts and system configurations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-1FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF300T-1FCG784E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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