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MPF300T-FCG1152E

Microchip Technology

MPF300T-FCG1152E by Microchip Technology

MPF300T-FCG1152E by Microchip Tech is a 300K logic cell FPGA with CMOS tech. It has 512 inputs/outputs, operates b/w 0-100°C, and uses a grid array package style. Ideal for applications requiring high-density programmable logic in compact form factors.

Median Price

$505.720

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 100 parts In-Stock

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$500.580

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$500.580

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$500.580

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$500.580

100

$500.580

$500.580

$500.580

$500.580

Mouser Electronics

USA . 3 parts In-Stock

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$505.720

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$505.720

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DigiKey

USA . 2 parts In-Stock

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$505.720

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2

$505.720

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Digiode

USA . 61 parts In-Stock

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$475.551

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61

$475.551

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Vyrian

USA . 4,073 parts In-Stock

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4,073

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Chip Stock

USA . 565 parts In-Stock

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Nova Conductors

Japan . 76 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 308 parts In-Stock

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$5.477

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$5.477

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Corohmni

South Africa . 36 parts In-Stock

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$20.744

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Aztec Data Supply Inc.

USA . 286 parts In-Stock

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$27.960

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$27.960

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Ampacity Inc.

Singapore . 40 parts In-Stock

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$425.490

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Semicontronic

India . 40 parts In-Stock

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$425.490

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$414.853

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$412.725

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40

$425.490

$414.853

$412.725

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Corphita

USA . 65 parts In-Stock

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$450.522

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Montano Global Distributors

Canada . 6,782 parts In-Stock

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Argo Parts USA

USA . 4,108 parts In-Stock

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LMD Electronica

Estonia . 3,706 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Continental Prestige Electronics

USA . 693 parts In-Stock

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LOOK Integrated Logistics

Peru . 452 parts In-Stock

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452

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Bastille Electronics

Australia . 300 parts In-Stock

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NIA Electronics

USA . 57 parts In-Stock

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Ledger Components

France . 57 parts In-Stock

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Overview

Unleash the power of innovation with the MPF300T-FCG1152E by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) offers unmatched quality and reliability, perfect for a wide range of applications. With 300,000 logic cells and 512 inputs/outputs, this FPGA provides flexibility and scalability for your project needs. Experience the benefits of advanced CMOS technology, high-performance design, and easy programmability. Elevate your designs with the MPF300T-FCG1152E and unlock endless possibilities for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for portable and rugged applications.

No. of Logic Cells: 300000

With a large number of logic cells, this FPGA offers high flexibility and processing power for complex designs and algorithms.

Surface Mount: YES

The surface mount option allows for easy and efficient integration onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03V ensures compatibility with a wide range of power sources, making it versatile for different applications.

Technology Used: CMOS

The CMOS technology used in this FPGA provides low power consumption and high noise immunity, making it efficient and reliable in various environments.

No. of Inputs: 512

With 512 inputs, this FPGA can accommodate a large number of external signals and data inputs for processing and manipulation.

Package Shape: SQUARE

The square shape of the package offers efficient use of space on a PCB, optimizing layout design and reducing signal interference.

Form Of Terminal: BALL

The ball terminals provide secure connections and allow for reliable soldering, ensuring stable performance in demanding conditions.

No. of Terminals: 1152

The high number of terminals offers ample connectivity options for interfacing with other components and devices in a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this IC provides customizable logic functions, allowing for quick prototyping and flexibility in design implementation.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and efficient layout of terminals, simplifying PCB routing and assembly processes.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage of 0.97V allows for efficient power consumption and operation in low-power applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA is suitable for use in harsh environmental conditions or industrial settings.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals offers compatibility with standard PCB layout requirements, making it easy to integrate into existing designs.

Minimum Operating Temperature: 0 °C

The FPGA can operate in temperatures as low as 0°C, making it suitable for a wide range of temperature-controlled environments.

Position Of Terminal: BOTTOM

The bottom terminal position allows for easy and secure placement on a PCB, ensuring stable connections and efficient signal routing.

Maximum Seated Height: 3.47 mm

The low maximum seated height of 3.47mm minimizes the overall profile of the FPGA, making it suitable for compact or space-constrained designs.

Width: 35 mm

The width of 35mm provides a compact form factor for the FPGA, allowing for efficient use of space on a PCB.

No. of Outputs: 512

With 512 outputs, this FPGA can handle a large number of processed signals and data outputs, making it suitable for demanding applications.

Length: 35 mm

The length of 35mm offers a balanced and symmetrical design for the FPGA, ensuring easy integration into various systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-FCG1152E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300T-FCG1152E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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