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MPF300T-1FCVG484E

Microchip Technology

MPF300T-1FCVG484E by Microchip Technology

MPF300T-1FCVG484E by Microchip Technology is a CMOS FPGA with 300K logic cells, 284 inputs/outputs, and operates b/w 0-100°C. It features a grid array package with 0.8mm pitch terminals suitable for various applications requiring high-density programmable ICs.

Median Price

$542.498

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 279 parts In-Stock

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$542.498

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279

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Vyrian

USA . 7,979 parts In-Stock

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Chip Stock

USA . 598 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 880 parts In-Stock

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$6.308

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880

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$59.419

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$54.071

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$48.724

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50

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$54.071

$48.724

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Corohmni

South Africa . 436 parts In-Stock

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$74.091

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436

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Aztec Data Supply Inc.

USA . 3,938 parts In-Stock

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$98.080

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Vigor

Singapore . 281 parts In-Stock

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$469.710

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Ampacity Inc.

Singapore . 20 parts In-Stock

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$485.390

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20

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Semicontronic

India . 1 parts In-Stock

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$485.390

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$473.255

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$470.828

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1

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$470.828

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Corphita

USA . 213 parts In-Stock

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$513.945

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Montano Global Distributors

Canada . 8,365 parts In-Stock

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NIA Electronics

USA . 6,462 parts In-Stock

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Ledger Components

France . 6,462 parts In-Stock

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LMD Electronica

Estonia . 4,659 parts In-Stock

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Argo Parts USA

USA . 1,281 parts In-Stock

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Authorized Procurement Solutions

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LOOK Integrated Logistics

Peru . 830 parts In-Stock

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Continental Prestige Electronics

USA . 672 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the MPF300T-1FCVG484E by Microchip Technology. This Field Programmable Gate Array (FPGA) boasts 300,000 logic cells and 284 inputs and outputs, offering unparalleled flexibility and performance. With a maximum supply voltage of 1.03V and a package style of GRID ARRAY, FINE PITCH, this FPGA is perfect for a wide range of applications. Trust in Microchip Technology's reputation for quality and innovation, and revolutionize your projects with the MPF300T-1FCVG484E today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and cost-effective, making the product easy to handle and affordable.

No. of Logic Cells: 300000

With a large number of logic cells, this FPGA can handle complex logic functions and calculations efficiently.

Surface Mount: YES

Surface mount technology allows for easy installation and integration onto circuit boards, saving time and effort.

Maximum Supply Voltage: 1.03 V

With a high maximum supply voltage, this FPGA can support a wide range of applications and power requirements.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

No. of Inputs: 284

A high number of inputs allows for versatile input connectivity, enabling the FPGA to interface with a variety of devices and sensors.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, ideal for densely populated circuit boards.

Form Of Terminal: BALL

Ball terminals offer reliable electrical connections and solder joints, enhancing the durability and longevity of the product.

No. of Terminals: 484

Having a large number of terminals allows for extensive connectivity options, facilitating complex circuit designs and configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product offers flexibility and customization options, making it suitable for a wide range of applications and prototyping purposes.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array with fine pitch design enables high-density mounting and precise alignment, enhancing overall performance and reliability.

Minimum Supply Voltage: 0.97 V

With a low minimum supply voltage, this FPGA can operate efficiently even with limited power resources, making it suitable for portable and low-power devices.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the FPGA to withstand extreme environmental conditions, ensuring operational reliability in harsh environments.

Pitch Of Terminal: 0.8 mm

The small pitch of the terminals enables high-density packaging and space optimization, making the product suitable for compact electronic devices.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, expanding the range of potential applications for this FPGA.

Position Of Terminal: BOTTOM

Having terminals on the bottom side facilitates easy assembly and integration onto circuit boards, ensuring convenient installation and maintenance.

Maximum Seated Height: 3.32 mm

The low maximum seated height allows for slim and compact device designs, making the product suitable for applications with limited space constraints.

Width: 19 mm

The compact width of the FPGA enables efficient PCB layout and integration, optimizing overall system performance and functionality.

No. of Outputs: 284

A high number of outputs provides versatile output connectivity options, allowing the FPGA to drive multiple devices and components simultaneously.

Length: 19 mm

The compact length of the FPGA contributes to a space-saving and efficient design, making it ideal for small form-factor devices and applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-1FCVG484E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300T-1FCVG484E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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