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MPF300TS-FCS536M

Microchip Technology

MPF300TS-FCS536M by Microchip Technology

MPF300TS-FCS536M by Microchip Tech is a 300K logic cell FPGA with CMOS tech, 300 inputs, and 300 outputs. It operates b/w -55 to 125°C, has a low profile grid array package style, and is suitable for military-grade applications.

Median Price

$1,130.925

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

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$907.140

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Digiode

USA . 115 parts In-Stock

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$1,354.710

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Vyrian

USA . 4,336 parts In-Stock

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Chip Stock

USA . 1,085 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 204 parts In-Stock

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$6.426

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$6.426

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Aztec Data Supply Inc.

USA . 2,875 parts In-Stock

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$48.510

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$48.510

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Corohmni

South Africa . 756 parts In-Stock

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$85.424

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Continental Prestige Electronics

USA . 5,181 parts In-Stock

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$907.140

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$888.997

5,181

$907.140

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$888.997

Argo Parts USA

USA . 2,296 parts In-Stock

1+ parts

$907.140

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$898.069

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$888.997

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$879.926

2,296

$907.140

$898.069

$888.997

$879.926

Netroflash

USA . 100 parts In-Stock

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$907.140

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$888.997

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$888.997

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Ampacity Inc.

Singapore . 131 parts In-Stock

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$1,212.110

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Semicontronic

India . 125 parts In-Stock

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$1,212.110

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$1,181.807

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$1,175.747

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125

$1,212.110

$1,181.807

$1,175.747

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Corphita

USA . 79 parts In-Stock

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$1,283.409

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LOOK Integrated Logistics

Peru . 6,307 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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LMD Electronica

Estonia . 2,987 parts In-Stock

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Microchip USA

USA . 1,714 parts In-Stock

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Montano Global Distributors

Canada . 1,088 parts In-Stock

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NIA Electronics

USA . 572 parts In-Stock

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Ledger Components

France . 572 parts In-Stock

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Overview

Unlock limitless potential with the MPF300TS-FCS536M by Microchip Technology. Crafted with precision and expertise, this FPGA offers unparalleled quality and reliability. Ideal for a wide range of applications, this innovative product provides customers with a competitive edge in today's fast-paced market. Experience the value and benefits of cutting-edge technology with the MPF300TS-FCS536M - your key to success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product reliable.

No. of Logic Cells: 300000

Having a high number of logic cells allows for complex designs and efficient processing.

Surface Mount: YES

Surface mounting capability enables easy and convenient integration into circuit boards.

Maximum Supply Voltage: 1.03 V

Operating at a higher supply voltage provides more power for processing tasks.

Technology Used: CMOS

CMOS technology is known for its low power consumption and high speed performance.

No. of Inputs: 300

Having a high number of inputs allows for more data to be processed simultaneously.

Package Shape: SQUARE

A square shape is efficient for space utilization and easy placement on circuit boards.

Form Of Terminal: BALL

Ball terminals provide good connectivity and reliability in the circuit.

No. of Terminals: 536

Having a high number of terminals allows for versatile connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for flexibility in configuring and reconfiguring the device for various applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor and precise terminal spacing for efficient circuit design.

Minimum Supply Voltage: 0.97 V

Operating at a low minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

Being able to operate at high temperatures makes the product suitable for demanding environments.

Pitch Of Terminal: 0.5 mm

A small pitch of terminals allows for more terminals to be packed in a small space, increasing connectivity options.

Minimum Operating Temperature: -55 °C

Being able to operate at low temperatures makes the product suitable for a wide range of environments.

Position Of Terminal: BOTTOM

Terminal placement at the bottom allows for easy and secure connections on the PCB.

Maximum Seated Height: 1.45 mm

A low seated height allows for a slim profile and efficient use of space in the circuit design.

Width: 16 mm

Having a compact width allows for easy integration into different circuit board layouts.

No. of Outputs: 300

Having a high number of outputs allows for processing and transmitting a large amount of data.

Length: 16 mm

Having a compact length allows for efficient use of space on the circuit board.

Grading Of Temperature: MILITARY

Being graded for military temperature standards indicates high reliability and durability under extreme conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TS-FCS536M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

300

No. of Outputs:

300

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

16 mm

Width:

16 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA536,30X30,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

536

Standards

JESD-30 Code:

S-PBGA-B536

Trade Compliance

MPF300TS-FCS536M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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