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MPF300T-FCVG484I

Microchip Technology

MPF300T-FCVG484I by Microchip Technology

MPF300T-FCVG484I by Microchip is a 300K logic cell FPGA with CMOS tech. It has 284 inputs/outputs, operates b/w -40 to 100°C, and uses 0.97-1.03 V supply voltage. Ideal for industrial applications requiring high-density programmable logic solutions in a compact grid array package.

Median Price

$481.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 5 parts In-Stock

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$465.190

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DigiKey

USA . 47 parts In-Stock

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$481.020

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47

$481.020

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Microchip Technology

USA . 2 parts In-Stock

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$481.020

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$437.290

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$303.800

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2

$481.020

$437.290

$303.800

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Distributors (In-Stock)

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Digiode

USA . 301 parts In-Stock

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$542.498

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Vyrian

USA . 2,755 parts In-Stock

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Chip Stock

USA . 746 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 650 parts In-Stock

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$15.985

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650

$15.985

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Corohmni

South Africa . 27 parts In-Stock

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$72.362

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Aztec Data Supply Inc.

USA . 1,887 parts In-Stock

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$76.930

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Advanced Electronics

New Zealand . 33 parts In-Stock

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$100.843

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$95.801

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$95.801

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$100.843

$95.801

$95.801

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Vigor

Singapore . 815 parts In-Stock

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$469.700

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Ampacity Inc.

Singapore . 8 parts In-Stock

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$485.390

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Semicontronic

India . 8 parts In-Stock

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$485.390

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$473.255

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$470.828

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8

$485.390

$473.255

$470.828

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Corphita

USA . 168 parts In-Stock

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$513.945

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NIA Electronics

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Ledger Components

France . 4,448 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,091 parts In-Stock

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Argo Parts USA

USA . 3,468 parts In-Stock

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Continental Prestige Electronics

USA . 2,409 parts In-Stock

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LMD Electronica

Estonia . 2,205 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Montano Global Distributors

Canada . 606 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Experience the cutting-edge technology and reliability of Microchip Technology with the MPF300T-FCVG484I Field Programmable Gate Array. This FPGA offers unmatched performance and flexibility for a wide range of applications, from industrial automation to communications systems. Trust in the quality of Microchip's products and unleash the full potential of your designs with this versatile and high-quality solution. Elevate your projects with the value and benefits that only Microchip can provide. Choose the MPF300T-FCVG484I and see your ideas come to life like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this FPGA lightweight and durable, ideal for applications where weight is a concern.

No. of Logic Cells: 300000

With a high number of logic cells, this FPGA offers ample capacity for complex designs and processing tasks.

Surface Mount: YES

Being surface mountable, this FPGA is easy to solder onto PCBs, making it suitable for compact and space-constrained designs.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage of 1.03 V helps in reducing power consumption and heat dissipation in the system.

Technology Used: CMOS

The CMOS technology used in this FPGA ensures low power consumption and high noise immunity, making it suitable for battery-powered devices.

No. of Inputs: 284

With a large number of inputs, this FPGA can accommodate multiple data sources or sensors, making it versatile for various applications.

Package Shape: SQUARE

The square package shape provides uniformity in design layout and simplifies PCB routing for an efficient and organized system.

Form Of Terminal: BALL

The ball terminal form ensures secure connections and makes it easier to place and solder the FPGA onto the PCB, reducing assembly time.

No. of Terminals: 484

The high number of terminals allows for ample connectivity options, making this FPGA suitable for complex circuits and signal routing.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, it offers flexibility in design customization and rapid prototyping, making it ideal for development and testing purposes.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style offers high pin density and compact size, ideal for designs requiring a large number of I/O connections in a small footprint.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage of 0.97 V allows for operation in low-power environments and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA is suitable for industrial applications where extreme temperatures may be encountered.

Pitch Of Terminal: 0.8 mm

The narrow pitch of 0.8 mm between terminals allows for high-density packaging, making this FPGA suitable for space-constrained designs.

Minimum Operating Temperature: -40 °C

With a low minimum operating temperature of -40°C, this FPGA can withstand cold environments, making it suitable for outdoor or harsh conditions.

Position Of Terminal: BOTTOM

The bottom position of the terminals simplifies PCB layout and routing, enhancing the overall design efficiency and manufacturability.

Maximum Seated Height: 3.32 mm

The low maximum seated height of 3.32 mm enables a slim profile and compact design, making this FPGA suitable for slim devices or applications with height restrictions.

Width: 19 mm

The width of 19 mm provides a compact form factor, making this FPGA suitable for space-constrained designs or applications where size matters.

No. of Outputs: 284

With a high number of outputs, this FPGA can drive multiple loads or communicate with various peripherals, offering flexibility in system connectivity.

Length: 19 mm

The length of 19 mm contributes to the compact size of this FPGA, making it suitable for applications where space is limited.

Grading Of Temperature: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh conditions, making this FPGA suitable for industrial automation and control applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-FCVG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300T-FCVG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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