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MPF300TS-1FCG784NI

Microchip Technology

MPF300TS-1FCG784NI by Microchip Technology

MPF300TS-1FCG784NI by Microchip is a CMOS FPGA with 300K logic cells, 388 inputs/outputs, and operates b/w -40 to 100°C. Its grid array package style makes it suitable for applications requiring high-density programmable ICs in compact spaces.

Median Price

$735.600

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4 parts In-Stock

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$735.600

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4

$735.600

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Distributors (In-Stock)

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Digiode

USA . 492 parts In-Stock

1+ parts

$758.774

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492

$758.774

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Nova Conductors

Japan . 40 parts In-Stock

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$787.155

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40

$787.155

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Vyrian

USA . 2,781 parts In-Stock

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2,781

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Chip Stock

USA . 904 parts In-Stock

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904

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Distributors (Availability)

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AZTECH Wire

Italy . 558 parts In-Stock

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$16.839

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558

$16.839

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Corohmni

South Africa . 1,208 parts In-Stock

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$24.222

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$24.222

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Aztec Data Supply Inc.

USA . 3,344 parts In-Stock

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$48.010

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3,344

$48.010

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Ampacity Inc.

Singapore . 4 parts In-Stock

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$678.900

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4

$678.900

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Semicontronic

India . 4 parts In-Stock

1+ parts

$678.900

100+ parts

$661.928

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$658.533

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4

$678.900

$661.928

$658.533

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Corphita

USA . 453 parts In-Stock

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$718.839

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453

$718.839

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Continental Prestige Electronics

USA . 4,285 parts In-Stock

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$735.660

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$720.947

4,285

$735.660

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$720.947

Argo Parts USA

USA . 3,342 parts In-Stock

1+ parts

$735.660

100+ parts

$728.303

1k+ parts

$720.947

10k+ parts

$713.590

3,342

$735.660

$728.303

$720.947

$713.590

Netroflash

USA . 100 parts In-Stock

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$787.155

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100

$787.155

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Montano Global Distributors

Canada . 7,504 parts In-Stock

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LMD Electronica

Estonia . 4,387 parts In-Stock

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NIA Electronics

USA . 3,390 parts In-Stock

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Ledger Components

France . 3,390 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,233 parts In-Stock

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Vigor

Singapore . 476 parts In-Stock

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Overview

Experience the cutting-edge technology of Microchip Technology with the MPF300TS-1FCG784NI Field Programmable Gate Array (FPGA). This high-quality product offers unmatched performance and reliability, making it ideal for a wide range of applications. With its advanced features and innovative design, customers can trust that they are getting the best value for their investment. Upgrade your projects with the MPF300TS-1FCG784NI and unlock limitless possibilities in the world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers durability and protection to the internal components of the FPGA.

No. of Logic Cells: 300000

High number of logic cells allows for complex logic operations and designs to be implemented.

Surface Mount: YES

Enables easy and efficient PCB assembly process.

Maximum Supply Voltage: 1.03 V

Provides stable power supply for the FPGA.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 388

Large number of inputs allow for versatile input configurations.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

Form Of Terminal: BALL

Ball terminals provide reliable electrical connections.

No. of Terminals: 784

High number of terminals allows for versatile interconnections.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA flexibility enables reprogrammability for different applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers secure and organized terminal layout.

Minimum Supply Voltage: 0.97 V

Allows for operation at lower power consumption levels.

Maximum Operating Temperature: 100 °C

Wide operating temperature range makes it suitable for various environments.

Pitch Of Terminal: 1 mm

Provides standard spacing for easy interfacing with other components.

Minimum Operating Temperature: -40 °C

Ensures reliable operation even in extreme cold environments.

Position Of Terminal: BOTTOM

Bottom terminal positioning enables easy PCB mounting.

Maximum Seated Height: 3.47 mm

Low profile design saves space in the overall system.

Width: 29 mm

Compact width allows for efficient PCB layout.

No. of Outputs: 388

Equal number of outputs as inputs allow for balanced signal processing.

Length: 29 mm

Square shape provides a compact form factor for the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TS-1FCG784NI attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF300TS-1FCG784NI Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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