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MPF300TS-1FCG1152I

Microchip Technology

MPF300TS-1FCG1152I by Microchip Technology

MPF300TS-1FCG1152I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 300,000 logic cells. It has a package body material of PLASTIC/EPOXY and features surface mount technology. This FPGA is suitable for applications requiring high-performance programmable ICs.

Median Price

$809.140

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 5 parts In-Stock

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$774.310

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$774.310

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$774.310

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$774.310

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$774.310

$774.310

$774.310

$774.310

DigiKey

USA . 1 parts In-Stock

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$809.140

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Microchip Technology

USA . 1 parts In-Stock

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$809.140

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$735.590

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$511.040

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1

$809.140

$735.590

$511.040

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Distributors (In-Stock)

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NAC Semi

USA . 150 parts In-Stock

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$647.320

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$606.860

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Digiode

USA . 110 parts In-Stock

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$735.594

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Nova Conductors

Japan . 10 parts In-Stock

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$815.953

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Vyrian

USA . 2,532 parts In-Stock

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Chip Stock

USA . 691 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 214 parts In-Stock

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$16.462

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$16.462

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$110.999

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$105.449

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$105.449

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$110.999

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Aztec Data Supply Inc.

USA . 96 parts In-Stock

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$122.150

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Corohmni

South Africa . 65 parts In-Stock

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$123.448

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Ampacity Inc.

Singapore . 7 parts In-Stock

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$658.160

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Semicontronic

India . 7 parts In-Stock

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$658.160

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$641.706

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$638.415

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$658.160

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$638.415

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Vigor

Singapore . 172 parts In-Stock

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$665.600

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Corphita

USA . 162 parts In-Stock

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$696.879

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Continental Prestige Electronics

USA . 3,023 parts In-Stock

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$809.230

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$793.045

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$793.045

Argo Parts USA

USA . 661 parts In-Stock

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$809.230

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$801.138

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$793.045

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$784.953

661

$809.230

$801.138

$793.045

$784.953

Netroflash

USA . 100 parts In-Stock

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$815.953

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NIA Electronics

USA . 6,364 parts In-Stock

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Ledger Components

France . 6,364 parts In-Stock

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LOOK Integrated Logistics

Peru . 5,645 parts In-Stock

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Montano Global Distributors

Canada . 5,261 parts In-Stock

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LMD Electronica

Estonia . 3,844 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Experience the cutting-edge technology of Microchip Technology with the MPF300TS-1FCG1152I, a high-quality Field Programmable Gate Array (FPGA). With its advanced CMOS technology and a staggering 300,000 logic cells, this FPGA offers unmatched performance and versatility. Whether you're designing complex circuits or developing innovative solutions, the MPF300TS-1FCG1152I delivers exceptional value and benefits. Its convenient surface mount and square package shape make it easy to integrate into any project. Discover endless possibilities with Microchip Technology, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and cost-effectiveness, making this FPGA a reliable and affordable choice.

No. of Logic Cells: 300000

With a high number of logic cells, this FPGA offers vast and versatile programmability, allowing for complex designs and efficient implementation of various applications.

Surface Mount: YES

The surface mount capability simplifies the assembly and integration of this FPGA onto circuit boards, enabling easy integration into electronic systems.

Maximum Supply Voltage: 1.03 V

The FPGA's ability to operate reliably within a maximum supply voltage of 1.03 V ensures compatibility with low-power designs and contributes to energy-efficient applications.

Technology Used: CMOS

Utilizing CMOS technology, this FPGA delivers low power consumption, high noise immunity, and fast switching speeds, making it an excellent choice for demanding and power-sensitive applications.

No. of Inputs: 512

Featuring 512 inputs, this FPGA accommodates a wide range of input signals, facilitating the integration and processing of multiple data sources into a single system.

Package Shape: SQUARE

The square package shape ensures efficient use of board space, offering a compact form factor that enhances design flexibility and allows for easy integration into system layouts.

Form Of Terminal: BALL

The ball form of terminals simplifies the soldering and connection process, providing a reliable electrical connection and ensuring secure attachment to the circuit board.

No. of Terminals: 1152

With 1152 terminals, this FPGA enables seamless connectivity with other components, providing flexibility for interfacing with external devices and subsystems.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array, this product allows for customization and updates in the field, offering flexibility and adaptability to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style allows for high-density integration, enabling more logic and I/O capabilities within a smaller footprint, making this FPGA an excellent choice for space-constrained applications.

Minimum Supply Voltage: 0.97 V

With a minimum supply voltage of 0.97 V, this FPGA supports low-power operation and extends battery life for portable applications, making it an efficient and reliable choice.

Maximum Operating Temperature: 100 °C

Built to withstand a maximum operating temperature of 100°C, this FPGA ensures reliable performance even in demanding environments.

Pitch Of Terminal: 1 mm

The 1 mm terminal pitch allows for precise and compact board layout, enhancing the overall design efficiency and making it suitable for high-density circuitry.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme temperatures as low as -40°C, this FPGA proves its reliability in harsh environments.

Position Of Terminal: BOTTOM

Having the terminals positioned at the bottom enhances thermal management and facilitates efficient heat dissipation, ensuring reliable operation even under heavy load conditions.

Maximum Seated Height: 3.47 mm

With a maximum seated height of 3.47 mm, this FPGA offers compatibility with various design profiles, allowing for easy integration into different system architectures.

Width: 35 mm

The 35 mm width provides a compact form factor, allowing for efficient PCB space usage and enabling integration into space-limited designs.

No. of Outputs: 512

Offering 512 outputs, this FPGA supports the generation of multiple output signals, making it suitable for applications requiring extensive signal processing and data communication.

Length: 35 mm

With a length of 35 mm, this FPGA maintains a compact footprint, enabling easy integration and placement in various system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TS-1FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300TS-1FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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