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MPF300TLS-FCG1152I

Microchip Technology

MPF300TLS-FCG1152I by Microchip Technology

Microchip Technology's MPF300TLS-FCG1152I is a 300K logic cell FPGA with CMOS technology. It features 512 inputs/outputs, operates b/w -40 to 100°C, and has a package style of grid array. Ideal for applications requiring high-density programmable logic in compact form factors.

Median Price

$809.140

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1 parts In-Stock

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$809.140

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NAC Semi

USA . 2 parts In-Stock

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$647.320

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$606.860

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$606.860

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Digiode

USA . 389 parts In-Stock

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$834.660

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389

$834.660

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Nova Conductors

Japan . 10 parts In-Stock

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$878.590

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Vyrian

USA . 6,009 parts In-Stock

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Chip Stock

USA . 662 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 763 parts In-Stock

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$15.578

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763

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Aztec Data Supply Inc.

USA . 929 parts In-Stock

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$37.660

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929

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Corohmni

South Africa . 5 parts In-Stock

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$172.540

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Vigor

Singapore . 449 parts In-Stock

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$665.610

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Ampacity Inc.

Singapore . 1 parts In-Stock

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$746.800

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Semicontronic

India . 1 parts In-Stock

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$746.800

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$728.130

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$724.396

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1

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$724.396

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Corphita

USA . 444 parts In-Stock

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$790.731

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LMD Electronica

Estonia . 7,855 parts In-Stock

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LOOK Integrated Logistics

Peru . 7,205 parts In-Stock

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NIA Electronics

USA . 6,673 parts In-Stock

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Ledger Components

France . 6,673 parts In-Stock

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Argo Parts USA

USA . 4,298 parts In-Stock

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Montano Global Distributors

Canada . 2,935 parts In-Stock

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Continental Prestige Electronics

USA . 1,751 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$861.018

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$834.661

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$817.089

1,000

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$861.018

$834.661

$817.089

Overview

Unlock unparalleled performance and innovation with the MPF300TLS-FCG1152I by Microchip Technology. As a leader in Field Programmable Gate Arrays (FPGA), Microchip delivers cutting-edge solutions for a wide range of applications. This versatile FPGA offers customers a powerful tool to create custom logic circuits, optimize system design, and accelerate time-to-market. With 300,000 logic cells, 512 inputs and outputs, and advanced CMOS technology, the MPF300TLS-FCG1152I ensures high-performance computing in a compact package. Trust Microchip Technology to provide quality, reliability, and value with every product, empowering you to achieve your goals effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a good balance between durability and cost-effectiveness.

No. of Logic Cells: 300000

Having a large number of logic cells allows for complex programming and customization.

Surface Mount: YES

Surface mount technology makes it easier to integrate this FPGA into various electronic systems.

Maximum Supply Voltage: 1.03 V

Operating within a specific voltage range ensures optimal performance and longevity.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

No. of Inputs: 512

Having a large number of inputs allows for versatile input options for the FPGA.

Package Shape: SQUARE

Square packages are compact and efficient for space-saving in electronic designs.

Form Of Terminal: BALL

Ball terminals provide a reliable connection and are commonly used in electronic components.

No. of Terminals: 1152

A high number of terminals allow for greater connectivity options and flexibility in circuit design.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable device allows for easy reprogramming and customization of functions.

Package Style (Meter): GRID ARRAY

Grid array packages offer a high-density interconnection design suitable for complex circuits.

Minimum Supply Voltage: 0.97 V

Having a low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

Withstanding high temperatures allows for reliable operation in various environmental conditions.

Pitch Of Terminal: 1 mm

The terminal pitch provides compatibility with standard PCB layouts and assembly processes.

Minimum Operating Temperature: -40 °C

Operating at low temperatures ensures the FPGA can function in cold environments without issues.

Position Of Terminal: BOTTOM

Bottom terminals can facilitate easier soldering and assembly processes in electronic systems.

Maximum Seated Height: 3.47 mm

The low seated height saves space and allows for compact design integration.

Width: 35 mm

The width dimension indicates the physical size of the FPGA, which can influence compatibility and space requirements.

No. of Outputs: 512

Having a large number of outputs provides flexibility in routing signals and data within the FPGA.

Length: 35 mm

The length dimension of the FPGA contributes to overall size considerations in electronic system designs.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TLS-FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300TLS-FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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