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XC5VLX20T-1FFG323C

Xilinx

XC5VLX20T-1FFG323C by Xilinx

Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.

Median Price

$333.894

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Overview

Unlock limitless possibilities with the XC5VLX20T-1FFG323C FPGA by Xilinx. Renowned for their quality and innovation, Xilinx delivers a cutting-edge solution for your programmable logic needs. Ideal for a wide range of applications, this FPGA offers unparalleled value and benefits to customers looking to enhance their designs. Embrace the power of Xilinx and take your projects to the next level with the XC5VLX20T-1FFG323C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides a durable and cost-effective packaging solution for the FPGA.

No. of Logic Cells: 19968

Large number of logic cells allows for complex logic operations and designs to be implemented on the FPGA.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.05 V

Low maximum supply voltage helps in minimizing power consumption and heat dissipation.

No. of CLBs: 1560

Generous number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic circuits.

Technology Used: CMOS

CMOS technology allows for low power consumption and high-speed operation in the FPGA.

No. of Inputs: 172

Sufficient number of input pins allow for interfacing with external components and signals.

Package Shape: SQUARE

Square package shape makes the FPGA easy to handle and integrate into PCB layouts.

Power Supplies (V): 1,2.5

Support for multiple power supply voltages allows for versatile applications and compatibility.

No. of Terminals: 323

Abundance of terminals offer ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA), this IC allows for reconfigurable logic, making it versatile for various applications.

Package Style (Meter): GRID ARRAY

Grid array package style provides good mechanical support and thermal dissipation for the FPGA.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance ensures reliability in challenging environmental conditions.

Pitch Of Terminal: 1 mm

Small pitch of terminals allows for dense packaging and efficient use of PCB real estate.

Maximum Combinatorial Delay of a CLB: 0.9 ns

Low combinatorial delay in CLBs enables high-speed processing and reduced latency in logic operations.

Organization: 1560 CLBS

Organized structure of 1560 Configurable Logic Blocks facilitates systematic design and implementation of logic circuits.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin, silver, and copper finishing on terminals provide good conductivity and corrosion resistance for reliable connections.

Position Of Terminal: BOTTOM

Bottom-positioned terminals facilitate easy PCB mounting and soldering processes.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates a robust packaging that can withstand moderate exposure to moisture.

Maximum Seated Height: 2.85 mm

Low seated height allows for compact designs and efficient use of vertical space in electronic assemblies.

Width: 19 mm

Compact width dimension enables easy integration into standard PCB layouts and tight spaces.

No. of Outputs: 172

Sufficient number of output pins facilitate communication of processed signals to other components and systems.

Maximum Time At Peak Reflow Temperature (s): 30

Able to handle peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints during assembly processes.

Peak Reflow Temperature °C: 250

High peak reflow temperature capability of 250°C allows for lead-free soldering processes and reliable connections.

Length: 19 mm

Optimal length dimension for easy PCB layout and compatibility with standard board sizes.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VLX20T-1FFG323C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

19968

No. of Inputs:

172

No. of Outputs:

172

No. of CLBs:

1560

CLB Maximum Delay:

0.9 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

1560 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

2.85 mm

Package Equivalence Code:

BGA323,18X18,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

323

Standards

JESD-30 Code:

S-PBGA-B323

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC5VLX20T-1FFG323C Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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