Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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Xilinx XC5VLX85-1FFG676C FPGA features 82944 logic cells, 6480 CLBs, and 440 inputs/outputs. Operating at 1.05V with a max combinatorial delay of 0.9ns, it is ideal for high-performance applications requiring fast processing speeds in fields like telecommunications and aerospace.
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This material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.
Having a high number of logic cells allows for complex logic functions to be implemented, making the FPGA versatile for multiple applications.
Surface mount capability makes installation and assembly of the FPGA easier and more efficient.
This voltage level is suitable for efficient power consumption and operation of the FPGA.
A high number of Configurable Logic Blocks (CLBs) means more flexibility in designing and implementing logic functions within the FPGA.
Having a high number of inputs allows for the FPGA to handle a large amount of external data and signals.
The square shape of the package allows for efficient use of space in a circuit board layout.
Ball terminals provide strong electrical connections and are suitable for high-speed data transmission.
Having multiple power supply options allows for flexibility in integrating the FPGA with other components in a system.
A sufficient number of terminals allows for easy connectivity and integration of the FPGA within a larger system.
Being a Field Programmable Gate Array (FPGA) means that the device can be reprogrammed and customized for different applications, providing versatility and adaptability.
The grid array style of packaging allows for efficient heat dissipation and electrical performance of the FPGA.
A low minimum supply voltage enables energy-efficient operation of the FPGA.
With a high maximum operating temperature, the FPGA can withstand harsh environmental conditions and maintain reliable performance.
The 1mm pitch of terminals allows for compact design and efficient routing of signals within the FPGA.
Having a low maximum delay allows for fast and efficient processing of logic functions within the FPGA.
The organization of 6480 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and designs.
With a low minimum operating temperature, the FPGA can function reliably in a wide range of environmental conditions.
The use of tin, silver, and copper finishing on the terminals ensures strong electrical connections and resistance to corrosion.
Having terminals positioned on the bottom allows for compact and efficient layout of the FPGA on a circuit board.
A moisture sensitivity level of 4 indicates that the FPGA requires special handling to prevent damage from moisture during storage or assembly.
With a maximum seated height of 3mm, the FPGA can be easily integrated into compact devices and systems.
The 27mm width of the FPGA allows for efficient use of space on a circuit board and easy integration into a system.
Having a high number of outputs allows for the FPGA to drive multiple external devices and components.
The 30-second maximum time at peak reflow temperature ensures reliable soldering of the FPGA during assembly.
The peak reflow temperature of 250°C is suitable for reliable soldering and assembly of the FPGA.
The 27mm length of the FPGA allows for efficient placement and layout on a circuit board.
Field Programmable Gate Arrays (FPGA) XC5VLX85-1FFG676C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC5VLX85-1FFG676C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Cross-Ship Lead-Free Notice 31/Oct/2016 Mult Dev Material Chg 16/Dec/2019
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
2N7002
Supertex
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Maximum Feedback Capacitance (Crss): 5 pF;
1N4148
Won-top Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ULN2003ADR
Texas Instruments
ULN2003ADR by Texas Instruments is a NPN BJT with 7 elements, max IC of 0.5A, and VCEsat of 1.6V. Ideal for switching applications in small outline packages with Gull Wing terminals.
2N2222A
Microchip Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum Operating Temperature: -65 Cel; Terminal Position: BOTTOM;
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
1N4148WS
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
MBR0520LT3G
MBR0520LT3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, ideal for applications requiring high-speed switching and low power loss in compact electronic devices. The package style is small outline, making it suitable for surface mount designs in various electronics.
SMBJ18CA
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
CC0603KRX7R9BB104
Yageo
Yageo's CC0603KRX7R9BB104 is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. With X7R temperature characteristics, it operates b/w -55 to 125°C. Ideal for surface mount applications in electronics due to its compact size of 1.6mm x 0.8mm x 0.8mm and wraparound terminals.
BAV99
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
M39029/56-351
Itt Cannon
CONNECTOR ACCESSORY; MIL Conformity: YES; Terminal Type: WIRE; IEC Conformity: NO; Alternate Contact Sources: ITT CANNON; Associated Military - Specifications: MIL-C-38999;
BSS138
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Feedback Capacitance (Crss): 10 pF; JEDEC-95 Code: TO-236AB;
American Power Devices
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ECA2DHG4R7
Panasonic
ECA2DHG4R7 by Panasonic is a 4.7uF aluminum electrolytic capacitor with 200V rated DC voltage. It features tan delta of 0.15, leakage current of 0.0664mA, and ripple current of 50mA, making it ideal for applications requiring high capacitance stability and low leakage in through-hole mounting setups at temperatures ranging from -25 to 105°C.
Synsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
International Devices
LFD2NX-40-9BG256C
Lattice Semiconductor
LFD2NX-40-9BG256C by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It has 9750 CLBs, 111 inputs/outputs, and operates b/w -40 to 85°C. Ideal for applications requiring high-density programmable ICs in a compact grid array package.
M7A3P1000-FGG256I
M7A3P1000-FGG256I by Microchip Technology is a FPGA with 24576 logic cells, 1.5V nominal voltage, and 350MHz max clock frequency. Ideal for industrial applications requiring high-speed processing, it features 177 inputs/outputs and 1000000 equivalent gates in a compact grid array package.
XCAU10P-2UBVA368E
Xilinx
FIELD PROGRAMMABLE GATE ARRAY;
10M16DAF256A7G
Intel
Intel's 10M16DAF256A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a package style of grid array and programmable IC type, it is ideal for automotive applications requiring high performance in a compact form factor.
A3P600-PQG208I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
EP3C55F484I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
M1A3P1000-FGG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
EP1C3T144C8N
EP1C3T144C8N by Intel is a Field Programmable Gate Array (FPGA) with 2910 logic cells, 291 CLBs, and a max clock frequency of 275 MHz. It is ideal for applications requiring high-speed processing and customizable logic circuits in compact electronic designs.
EP4CE10E22I7N
EP4CE10E22I7N by Intel is a Field Programmable Gate Array (FPGA) with 10320 logic cells and a max clock frequency of 472.5 MHz. It is commonly used in applications requiring high-speed data processing and programmable logic capabilities.
XCAU25P-2SFVB784I
XCAU10P-L1SBVB484I
XQR5VFX130-1CN1752B
Xilinx XQR5VFX130-1CN1752B is a 131072 logic cell FPGA with 10240 CLBs, operating at -55 to 125 °C. It uses CMOS technology, has a max supply voltage of 1.05 V, and total dose of 1M Rad(Si). Ideal for military applications requiring high-performance computing in harsh environments.
10M08SCU169C8G
The Intel 10M08SCU169C8G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for applications requiring high-speed processing and programmable ICs in various industries such as telecommunications and automotive.
XC3S250E-4VQG100I
Xilinx XC3S250E-4VQG100I FPGA offers 5508 logic cells, 612 CLBs, and 250000 gates. With a max clock frequency of 572 MHz, it is ideal for industrial applications requiring high-speed processing in compact designs. The package style includes flatpack, thin profile, and fine pitch options for versatile integration.
EP4CE10F17I7N
EP4CE10F17I7N by Intel is a FPGA with 10320 logic cells, 645 CLBs, and max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing, such as telecommunications equipment and industrial automation systems.
LCMXO2-640HC-4SG48C
LCMXO2-640HC-4SG48C by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 40 Inputs/Outputs. Operating at 2.375V to 3.6V, it's ideal for applications requiring high performance in compact form factors like IoT devices and consumer electronics.
XC6SLX9-3TQG144C
The Xilinx XC6SLX9-3TQG144C is a FPGA with 9152 logic cells, 715 CLBs, and max clock frequency of 862 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
ICE40LP1K-CM121
ICE40LP1K-CM121 by Lattice Semiconductor is a 1280 logic cell FPGA with 160 CLBs, operating at max 133 MHz. Ideal for industrial applications, it features a max supply voltage of 1.26 V and can withstand temperatures from -40 to 100 °C.
XC7S6-2CPGA196I
The Xilinx XC7S6-2CPGA196I FPGA features 6000 logic cells, 469 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with fine pitch terminals.
XC6SLX45-3FGG484C
Xilinx XC6SLX45-3FGG484C FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Utilized in applications requiring high clock frequencies up to 862 MHz, such as telecommunications and signal processing due to its CMOS technology and low combinatorial delay of 0.21 ns.
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XC5VLX20T-1FFG323C
Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XC5VFX70T-1FFG1136C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VLX30T-1FFG665C
Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.
XC5VLX30T-2FFG665C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-1FFG1136C
Xilinx XC5VSX95T-1FFG1136C is a FPGA with 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. It operates at voltages of 1-2.5V, has a max combinatorial delay of 0.9ns, and uses CMOS technology. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.
XC5VFX30T-1FFG665C
XC5VLX85T-1FF1136I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VLX50-1FFG1153C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;
XC5VSX50T-1FFG1136C
XC5VFX100T-1FF1136I
XC5VLX330-1FFG1760I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
XC5VFX130T-1FFG1738C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-2FF1136C
XC5VLX110T-2FFG1136C
XC5VLX50T-1FFG1136C
XC5VLX110-1FFG1153C
XC5VLX85T-1FFG1136I
XC5VFX70T-1FF665I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VLX50-1FF676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
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