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XC5VLX110-1FFG1153C

Xilinx

XC5VLX110-1FFG1153C by Xilinx

XC5VLX110-1FFG1153C by Xilinx is a FPGA with 110592 logic cells, 8640 CLBs, and 800 inputs/outputs. It operates at 1.05V max voltage, 0.95V min voltage, and has a combinatorial delay of 0.9ns per CLB. Ideal for applications requiring high-speed processing and customization in electronics design.

Median Price

$1,840.000

Lifecycle Status

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AZTECH Wire

Italy . 467 parts In-Stock

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One Stop Electronics

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Semicontronic

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Modulus Dynamics

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Overview

Unlock limitless possibilities with the Xilinx XC5VLX110-1FFG1153C FPGA. Crafted by industry leader Xilinx, this high-quality Field Programmable Gate Array boasts 110,592 logic cells and 8,640 CLBs, making it a powerhouse for a wide range of applications. With its versatile programmable IC type and advanced features, this FPGA offers unparalleled value and benefits to customers looking to optimize performance and efficiency in their designs. Discover the future of innovation with the Xilinx XC5VLX110-1FFG1153C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the FPGA chip, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 110592

With a large number of logic cells, this FPGA can handle complex logic operations efficiently, making it suitable for demanding applications.

Surface Mount: YES

Being surface-mountable makes installation and replacement of this FPGA convenient and suitable for automated assembly processes.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making this FPGA energy-efficient.

No. of CLBs: 8640

Having a high number of Configurable Logic Blocks (CLBs) allows for flexible configuration and customization of logic functions in the FPGA design.

No. of Inputs: 800

With a large number of inputs, this FPGA can handle a significant amount of external data, enabling complex data processing tasks.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB, making it easier to integrate this FPGA into various electronic designs.

Form Of Terminal: BALL

The ball form of terminals simplifies soldering and ensures reliable connections with the PCB, enhancing the overall performance and reliability of the FPGA.

Power Supplies (V): 1,2.5

Supporting multiple power supply voltages offers flexibility in designing power-efficient systems that require different voltage levels for varying components.

No. of Terminals: 1153

Having a high number of terminals allows for a greater number of connections and interfaces, making this FPGA versatile in diverse applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this chip offers reprogrammable logic functions, enabling rapid prototyping, customization, and adaptability to changing design requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and structured layout for the terminals, facilitating easier PCB layout and enhancing signal integrity.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and allows for operation in low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature tolerance makes this FPGA suitable for industrial and automotive applications where temperature fluctuations are common.

Pitch Of Terminal: 1 mm

The fine pitch of terminals enables high-density integration and compact PCB design, making this FPGA ideal for space-constrained applications.

Maximum Combinatorial Delay of a CLB: 0.9 ns

The low combinatorial delay of configurable logic blocks ensures fast signal processing and efficient operation of this FPGA in time-critical applications.

Organization: 8640 CLBS

With a well-organized architecture comprising 8640 Configurable Logic Blocks, this FPGA provides efficient logic resources for implementing complex digital circuits.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes this FPGA suitable for use in extreme environments where temperature variations are a concern.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishes on the terminals ensures reliable electrical connections and reduces the risk of oxidation, enhancing the longevity of the FPGA.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom simplifies PCB layout and reduces signal trace length, leading to improved signal integrity and performance of the FPGA.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level of 4 indicates that this FPGA can withstand moderate exposure to moisture during storage or assembly processes without compromising its performance.

Maximum Seated Height: 3.4 mm

The low seated height of this FPGA allows for a slim profile and compact design, making it suitable for space-constrained applications where height clearance is limited.

Width: 35 mm

The compact width of this FPGA enables efficient use of PCB space and facilitates integration into various electronic systems with limited board real estate.

No. of Outputs: 800

Having a high number of outputs allows this FPGA to drive multiple external devices and interfaces, enabling versatile signal processing capabilities in complex systems.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature ensures quick and reliable soldering of this FPGA during assembly, reducing production time and ensuring quality connections.

Peak Reflow Temperature °C: 245

The high peak reflow temperature tolerance of 245°C allows for robust soldering processes, ensuring secure attachment of the FPGA to the PCB.

Length: 35 mm

The moderate length of this FPGA offers a balanced form factor for easy integration into various electronic systems, providing a combination of performance and flexibility.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VLX110-1FFG1153C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

110592

No. of Inputs:

800

No. of Outputs:

800

No. of CLBs:

8640

CLB Maximum Delay:

0.9 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

8640 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.4 mm

Package Equivalence Code:

BGA1153,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1153

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC5VLX110-1FFG1153C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.7.A

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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