Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
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The Xilinx XC5VLX50-1FFG1153C is a FPGA with 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. Operating at 1.05V, it offers 0.9ns combinatorial delay per CLB. Ideal for applications requiring high-speed processing in compact form factors like telecommunications and industrial automation.
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Futuretech Components
RC Electronics
Kepictronics
The use of plastic/epoxy material for the package body makes the product lightweight and durable, perfect for portable or rugged applications.
With a high number of logic cells, this FPGA offers a large capacity for implementing complex logic functions, making it suitable for advanced applications.
Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space in the manufacturing process.
The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation, making the product energy-efficient.
The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic circuits to meet specific requirements.
Having a high number of inputs allows for greater connectivity and versatility in input signal sources, enhancing the functionality of the FPGA.
The square package shape enables efficient use of space on the circuit board, optimizing layout and allowing for compact designs.
The use of ball terminals simplifies the soldering process during assembly, leading to a reliable and secure connection on the circuit board.
Support for multiple power supply voltages offers flexibility in system design and compatibility with different power requirements, enhancing versatility.
A high number of terminals provides ample connectivity options for interfacing with other components and peripherals, enabling robust system integration.
Being a field programmable device allows for reconfigurability and customization of logic functions, enabling rapid prototyping and flexibility in design iterations.
The grid array package style facilitates easy alignment and soldering during assembly, ensuring a reliable connection and robust mechanical stability.
The low minimum supply voltage requirement enables operation in low-power scenarios, extending battery life and minimizing power consumption.
The high maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.
The compact pitch of terminals allows for high-density packaging and space-efficient layout on the circuit board, enabling miniaturized designs.
The low maximum combinatorial delay of a CLB ensures fast signal processing and response times, making the FPGA suitable for high-speed applications.
With an organized structure of 3600 Configurable Logic Blocks (CLBs), the FPGA offers a systematic and efficient framework for implementing complex logic functions.
The low minimum operating temperature tolerance allows for reliable operation in cold environments, making the product suitable for a wide range of temperature conditions.
The use of tin, silver, and copper finishing on terminals enhances conductivity, corrosion resistance, and solderability, ensuring long-term reliability and performance.
Placing terminals at the bottom allows for easier access and soldering during assembly, simplifying the manufacturing process and improving overall reliability.
The MSL 4 rating indicates a moderate level of moisture sensitivity, requiring standard precautions during storage and handling to prevent moisture-related damage.
The low maximum seated height profile of the package enables compact and slim designs, saving space and allowing for sleek and portable product designs.
The specific width dimension provides an indication of the physical size of the FPGA, allowing for accurate placement and fit within the layout of the circuit board.
The high number of outputs enables the FPGA to drive multiple external devices and interfaces, enhancing connectivity and functionality in system applications.
The specified maximum time at peak reflow temperature ensures proper soldering and reflowing of the component during assembly, maintaining structural integrity.
The high peak reflow temperature tolerance allows for reliable soldering and assembly processes, ensuring strong mechanical bonds and long-lasting connections.
The specific length dimension provides an indication of the physical size and form factor of the FPGA, allowing for accurate placement and integration within the system design.
Field Programmable Gate Arrays (FPGA) XC5VLX50-1FFG1153C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC5VLX50-1FFG1153C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Cross-Ship Lead-Free Notice 31/Oct/2016 Mult Dev Material Chg 16/Dec/2019
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
USB3320C-EZK-TR
Microchip Technology
Microchip Technology's USB3320C-EZK-TR is a Bus Controller IC with 32 terminals, operating at 1.6-2V. It supports USB bus compatibility, clock frequency up to 60MHz, and CMOS technology. Ideal for applications requiring Universal Serial Bus peripherals in compact designs with low power consumption.
2N2222A
Semicoa
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Taitron Components
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM358N
Freescale Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358AN
STMicroelectronics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
C1206C104M5RACTU
KEMET Corporation
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
ATMEGA328P-AU
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM358MX
MBRS140T3G
MBRS140T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.6V and max output current of 1A. It operates b/w -65°C to 125°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package style. The diode's matte tin terminal finish and dual position terminals enhance its performance in surface mount configurations.
U.FL-R-SMT-1(10)
Hirose Electric
U.FL-R-SMT-1(10) by Hirose Electric is a RF connector with 50 ohm impedance, 0.05 dB insertion loss, and 8 GHz operating frequency. Ideal for board mounting in commercial applications, it features gold termination finish, liquid crystal polymer insulator, and 200VAC dielectric voltage resistance.
LM317D2TG
LM317D2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max output voltage of 37V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact spaces.
1N4148WT
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Nte Electronics
DS18B20
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 3; Package Shape or Style: ROUND; Housing: PLASTIC; Output Interface Type: 1-WIRE INTERFACE;
KSZ9031RNXIA
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
10M50SCE144C8G
Intel
The Intel 10M50SCE144C8G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. It operates at supply voltages of 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile device is ideal for applications requiring high-speed data processing and customizable logic functions in a compact form factor.
XC7A15T-1FGG484I
Xilinx
The Xilinx XC7A15T-1FGG484I is a Field Programmable Gate Array (FPGA) with 1300 CLBs and a max supply voltage of 1.05V. It features a grid array package style, operates in industrial temperatures (-40 to 100°C), and is suitable for applications requiring high-speed processing and programmable logic capabilities.
EP4CE30F23C8N
Altera
The EP4CE30F23C8N by Altera is a field programmable gate array with 28848 logic cells, 331 inputs and outputs, and a maximum clock frequency of 472.5 MHz. It is suitable for various applications including digital signal processing, high-speed communications, and industrial automation.
XCKU3P-2FFVB676E
Xilinx XCKU3P-2FFVB676E FPGA features 355950 logic cells, 20340 CLBs, and 304 inputs/outputs. Ideal for applications requiring high-performance computing with a max supply voltage of 0.876 V. Package style is grid array with a square shape and ball terminals, suitable for various industrial uses.
ICE40HX8K-BG121
Lattice Semiconductor
ICE40HX8K-BG121 by Lattice Semiconductor is a 1.2V FPGA with 7680 logic cells, 960 CLBs, and 93 inputs/outputs. It operates in industrial temperatures (-40 to 100 °C) and uses CMOS technology. Ideal for applications requiring high-performance programmable ICs in a compact grid array package.
A3PE1500-PQG208I
A3PE1500-PQG208I by Microchip Technology is a CMOS FPGA with 38400 logic cells and 1500000 equivalent gates. It operates at a supply voltage of 1.5V, suitable for industrial applications requiring high-speed processing and programmable logic capabilities in a compact 28mm square package.
XC7S75-1FGGA484I
Xilinx XC7S75-1FGGA484I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with surface mount technology.
EP1C6Q240C6N
EP1C6Q240C6N by Intel is a Field Programmable Gate Array (FPGA) with 5980 logic cells and 598 CLBs. It operates at a max clock frequency of 405 MHz, making it suitable for high-speed applications in industries like telecommunications and signal processing. With a package style of flatpack and fine pitch, this FPGA offers versatility in design while maintaining compact dimensions.
XC7A15T-2CSG325C
Xilinx XC7A15T-2CSG325C is a FPGA with 16640 logic cells, 1300 CLBs, and max clock freq of 1286 MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation due to its low profile grid array package style.
EP2C20F484I8N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
10M08SAM153I7G
The Altera 10M08SAM153I7G is a field programmable gate array (FPGA) with a plastic/epoxy package and surface mount capability. It has a square package shape with ball terminals and a package code of BGA. With 153 terminals, it is a versatile programmable IC. It features a grid array package style and bottom terminal position. The JESD-30 code for this FPGA is S-PBGA-B153. Unfortunately, detailed information regarding its maximum time at peak reflow temperature and peak reflow temperature are not specified.
10M16SCU169A7G
Intel's 10M16SCU169A7G FPGA features 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. With a max supply voltage of 3.15V, it is ideal for automotive applications requiring high-performance computing in a compact form factor. The package style is grid array with a square shape and 0.8mm terminal pitch.
MPF100T-1FCG484I
Microchip Technology's MPF100T-1FCG484I is a CMOS FPGA with 244 inputs/outputs, operating b/w -40 to 100°C. Its grid array package has 484 terminals on a 23x23mm square body, suitable for applications requiring programmable gate arrays in surface-mount technology.
XCAU25P-L1FFVB676I
Xilinx XCAU25P-L1FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 208 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries. Operating temperature ranges from -40 to 100°C with a max supply voltage of 0.742V.
XC3S200-4TQG144C
XC3S200-4TQG144C by Xilinx is a FPGA with 4320 logic cells, 480 CLBs, and 200000 gates. It operates at max frequency of 630 MHz and has 97 inputs/outputs. Ideal for applications requiring high-speed processing like telecommunications and signal processing.
LCMXO3LF-4300C-5BG256C
LCMXO3LF-4300C-5BG256C by Lattice Semiconductor is a PLASTIC/EPOXY FPGA with 540 CLBs. It operates at a voltage range of 2.375V to 3.465V and has a temperature range of 0°C to 85°C. This FPGA is suitable for applications requiring field programmable gate arrays with low profile and fine pitch package style.
5CEBA4F17I7N
5CEBA4F17I7N by Intel is a FPGA with 49000 logic cells, CMOS technology, and 128 inputs/outputs. It operates at a nominal voltage of 1.1V and is suitable for applications requiring high-performance programmable ICs in compact form factors. The package style is grid array with low profile, making it ideal for space-constrained designs.
EP3C16F256C8N
EP3C16F256C8N by Intel is a CMOS FPGA with 15408 logic cells, 168 inputs/outputs, and max clock frequency of 472.5 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation due to its low profile grid array package style.
ICE40HX1K-CB132
ICE40HX1K-CB132 by Lattice Semiconductor is a FPGA with 1280 logic cells, 160 CLBs, and max clock frequency of 133 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor. Operates at temperatures ranging from -40 to 100 °C with a low combinatorial delay of 7.3 ns.
LFE5U-45F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3;
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XC5VLX20T-1FFG323C
Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XC5VFX70T-1FFG1136C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VLX30T-1FFG665C
Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.
XC5VLX30T-2FFG665C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-1FFG1136C
Xilinx XC5VSX95T-1FFG1136C is a FPGA with 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. It operates at voltages of 1-2.5V, has a max combinatorial delay of 0.9ns, and uses CMOS technology. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.
XC5VFX30T-1FFG665C
XC5VLX85T-1FF1136I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VSX50T-1FFG1136C
XC5VFX100T-1FF1136I
XC5VLX330-1FFG1760I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
XC5VFX130T-1FFG1738C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-2FF1136C
XC5VLX110T-2FFG1136C
XC5VLX50T-1FFG1136C
XC5VLX110-1FFG1153C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;
XC5VLX85-1FFG676C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XC5VLX85T-1FFG1136I
XC5VFX70T-1FF665I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VLX50-1FF676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
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