Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XC5VLX50-1FFG1153C is a FPGA with 46080 logic cells, 3600 CLBs, and 560 inputs/outputs. Operating at 1.05V, it offers 0.9ns combinatorial delay per CLB. Ideal for applications requiring high-speed processing in compact form factors like telecommunications and industrial automation.
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The use of plastic/epoxy material for the package body makes the product lightweight and durable, perfect for portable or rugged applications.
With a high number of logic cells, this FPGA offers a large capacity for implementing complex logic functions, making it suitable for advanced applications.
Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and space in the manufacturing process.
The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation, making the product energy-efficient.
The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing and implementing custom logic circuits to meet specific requirements.
Having a high number of inputs allows for greater connectivity and versatility in input signal sources, enhancing the functionality of the FPGA.
The square package shape enables efficient use of space on the circuit board, optimizing layout and allowing for compact designs.
The use of ball terminals simplifies the soldering process during assembly, leading to a reliable and secure connection on the circuit board.
Support for multiple power supply voltages offers flexibility in system design and compatibility with different power requirements, enhancing versatility.
A high number of terminals provides ample connectivity options for interfacing with other components and peripherals, enabling robust system integration.
Being a field programmable device allows for reconfigurability and customization of logic functions, enabling rapid prototyping and flexibility in design iterations.
The grid array package style facilitates easy alignment and soldering during assembly, ensuring a reliable connection and robust mechanical stability.
The low minimum supply voltage requirement enables operation in low-power scenarios, extending battery life and minimizing power consumption.
The high maximum operating temperature tolerance ensures reliable performance in harsh environmental conditions, making the product suitable for industrial applications.
The compact pitch of terminals allows for high-density packaging and space-efficient layout on the circuit board, enabling miniaturized designs.
The low maximum combinatorial delay of a CLB ensures fast signal processing and response times, making the FPGA suitable for high-speed applications.
With an organized structure of 3600 Configurable Logic Blocks (CLBs), the FPGA offers a systematic and efficient framework for implementing complex logic functions.
The low minimum operating temperature tolerance allows for reliable operation in cold environments, making the product suitable for a wide range of temperature conditions.
The use of tin, silver, and copper finishing on terminals enhances conductivity, corrosion resistance, and solderability, ensuring long-term reliability and performance.
Placing terminals at the bottom allows for easier access and soldering during assembly, simplifying the manufacturing process and improving overall reliability.
The MSL 4 rating indicates a moderate level of moisture sensitivity, requiring standard precautions during storage and handling to prevent moisture-related damage.
The low maximum seated height profile of the package enables compact and slim designs, saving space and allowing for sleek and portable product designs.
The specific width dimension provides an indication of the physical size of the FPGA, allowing for accurate placement and fit within the layout of the circuit board.
The high number of outputs enables the FPGA to drive multiple external devices and interfaces, enhancing connectivity and functionality in system applications.
The specified maximum time at peak reflow temperature ensures proper soldering and reflowing of the component during assembly, maintaining structural integrity.
The high peak reflow temperature tolerance allows for reliable soldering and assembly processes, ensuring strong mechanical bonds and long-lasting connections.
The specific length dimension provides an indication of the physical size and form factor of the FPGA, allowing for accurate placement and integration within the system design.
Field Programmable Gate Arrays (FPGA) XC5VLX50-1FFG1153C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC5VLX50-1FFG1153C Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Cross-Ship Lead-Free Notice 31/Oct/2016 Mult Dev Material Chg 16/Dec/2019
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
261
Deltrol Controls
Other Relays;
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Tesla Elektronicke Soucastky
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Comset Semiconductors
1N4148W-7-F
Diodes Incorporated
1N4148W-7-F by Diodes Inc. is a single rectifier diode with 0.715V max forward voltage and 100V max reverse voltage. Ideal for applications requiring fast switching speeds, it has a small outline package style and matte tin terminal finish, making it suitable for surface mount PCB designs.
BSS138
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 3 ohm; Minimum DS Breakdown Voltage: 50 V; Terminal Form: GULL WING;
Fairchild Semiconductor
BAV99
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
ST3485EBDR
STMicroelectronics
ST3485EBDR by STMicroelectronics is a Line Driver & Receiver with 3.3V power supply, EIA-422/EIA-485 interface standard, and 30ns max transmit delay. It is ideal for industrial applications requiring differential output and operates in temperatures ranging from -40 to 85°C.
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
FDLL4148
Onsemi
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
1N4148WS
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Micro Commercial Components
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; Moisture Sensitivity Level (MSL): 1; Maximum Output Current-1: 1.5 A; Operating Temperature (TJ-Min): 0 Cel;
LM317T/NOPB
Texas Instruments
LM317T/NOPB by Texas Instruments is an adjustable positive single output standard regulator with a max output voltage of 37V and max input-output voltage differential of 40V. It operates in temperatures ranging from 0 to 125°C, making it suitable for various applications requiring precise voltage regulation in electronic circuits. The package style is flange mount with three terminals for easy installation.
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
SMBJ18CA
Daco Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAT54C-7-F
BAT54C-7-F by Diodes Inc. is a Schottky rectifier diode with common cathode, 2 elements, and max forward voltage of 0.24V. Ideal for applications requiring fast reverse recovery time of 0.005 us, such as in small outline packages for surface mount technology at temperatures ranging from -65 to 150°C.
LM317BD2TG
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
10M08SAE144C8GES
Altera
FIELD PROGRAMMABLE GATE ARRAY;
M1A3P1000-FGG484I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XCAU25P-L1FFVB676I
Xilinx
Xilinx XCAU25P-L1FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 208 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries. Operating temperature ranges from -40 to 100°C with a max supply voltage of 0.742V.
M1A3P1000-PQG208M
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC7A35T-2CSG325I
Xilinx XC7A35T-2CSG325I is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing in compact form factor. Operates b/w -40 to 100 °C with low profile grid array package style.
EP4CE55F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 472.5 MHz;
EP2C20F256C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
10M02SCE144A7G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
A3P1000-PQG208I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC3SD1800A-4CSG484C
The Xilinx XC3SD1800A-4CSG484C FPGA features 37440 logic cells, 4160 CLBs, and 1800000 equivalent gates. It operates at a max clock frequency of 250 MHz and is suitable for applications requiring high-speed processing and programmable ICs in commercial extended temperature environments.
10CL040YU484I7G
Intel
The Intel 10CL040YU484I7G is a Field Programmable Gate Array (FPGA) with 2475 CLBs. It operates at a nominal voltage of 1.2V and has a max supply voltage of 1.25V. This FPGA is suitable for industrial applications requiring high performance and programmable logic capabilities in a compact square package with fine pitch grid array style terminals.
ICE40HX4K-TQ144
Siliconblue Technologies
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: QFP; Package Shape: SQUARE;
LFCPNX-100-9LFG672C
Lattice Semiconductor
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Moisture Sensitivity Level (MSL): 4;
XC7A200T-1FBG484I
Xilinx XC7A200T-1FBG484I FPGA features 215360 logic cells, 16825 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications, networking, and industrial automation.
XC6SLX150T-2FGG676C
Xilinx XC6SLX150T-2FGG676C is a FPGA with 147443 logic cells, 11519 CLBs, and 396 inputs/outputs. It operates at max frequency of 667 MHz, suitable for high-speed applications like signal processing and telecommunications due to its advanced CMOS technology. The package style is grid array with a square shape and plastic/epoxy material.
10M25DAF256I7G
The Intel 10M25DAF256I7G is a FPGA with 25000 logic cells, 1563 CLBs, and 360 inputs/outputs. It operates at temperatures from -40 to 100 °C and has a supply voltage range of 1.15-1.25 V. Ideal for industrial applications requiring high-performance programmable ICs in a compact square package with grid array style terminals.
M2S090-FCS325
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; Pitch Of Terminal: .5 mm;
A3P1000-FG256I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE;
XC7K410T-2FFG900I
Xilinx XC7K410T-2FFG900I FPGA features 406720 logic cells, 31775 CLBs, and a max clock frequency of 1286 MHz. Ideal for high-performance applications requiring advanced programmable ICs with a grid array package style.
LCMXO2-1200UHC-4FTG256C
LCMXO2-1200UHC-4FTG256C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. It operates at 2.5V nominal voltage and supports up to 206 inputs/outputs. Ideal for applications requiring high-speed processing in compact designs.
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XC5VLX20T-1FFG323C
Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XC5VFX70T-1FFG1136C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VLX30T-1FFG665C
Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.
XC5VLX30T-2FFG665C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-1FFG1136C
Xilinx XC5VSX95T-1FFG1136C is a FPGA with 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. It operates at voltages of 1-2.5V, has a max combinatorial delay of 0.9ns, and uses CMOS technology. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.
XC5VFX30T-1FFG665C
XC5VLX85T-1FF1136I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VSX50T-1FFG1136C
XC5VFX100T-1FF1136I
XC5VLX330-1FFG1760I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
XC5VFX130T-1FFG1738C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-2FF1136C
XC5VLX110T-2FFG1136C
XC5VLX50T-1FFG1136C
XC5VLX110-1FFG1153C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;
XC5VLX85-1FFG676C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XC5VLX85T-1FFG1136I
XC5VFX70T-1FF665I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VLX50-1FF676I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
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