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XC5VLX50-1FF676I

Xilinx

XC5VLX50-1FF676I by Xilinx

The Xilinx XC5VLX50-1FF676I is a FPGA with 46080 logic cells, 3600 CLBs, and 440 inputs/outputs. It operates at 1.05V with a max combinatorial delay of 0.9ns. Ideal for industrial applications requiring high-speed processing in compact designs.

Median Price

$1,068.132

Lifecycle Status

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5

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Digiode

USA . 426 parts In-Stock

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VNN

France . 692 parts In-Stock

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Vyrian

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Chip Stock

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Nova Conductors

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MARBEL Systems

Belgium . 3,513 parts In-Stock

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$35.278

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Texas Native Microelectronics

USA . 938 parts In-Stock

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$40.549

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$35.683

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Kenton Components

USA . 1,128 parts In-Stock

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$48.659

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$42.820

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Modulus Dynamics

Lithuania . 249 parts In-Stock

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$58.856

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Qasali Group International

UK . 4,994 parts In-Stock

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$109.482

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Corohmni

South Africa . 583 parts In-Stock

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Vigor

Singapore . 676 parts In-Stock

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One Stop Electronics

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Ampacity Inc.

Singapore . 3 parts In-Stock

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Semicontronic

India . 3 parts In-Stock

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$907.910

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Corphita

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Authorized Procurement Solutions

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Microchip USA

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Continental Prestige Electronics

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Argo Parts USA

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Supply Digital

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Overview

Unlock a world of possibilities with the Xilinx XC5VLX50-1FF676I FPGA. Renowned for its exceptional quality and reliability, Xilinx delivers cutting-edge technology that empowers innovation across various industries. This versatile FPGA boasts 46080 logic cells, making it ideal for applications requiring high-speed processing and customization. With a wide range of inputs and outputs, along with low power consumption, the XC5VLX50-1FF676I offers unrivaled flexibility and performance. Transform your designs and stay ahead of the competition with Xilinx's top-of-the-line FPGA solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the FPGA, making it suitable for various environments and applications.

No. of Logic Cells: 46080

Large number of logic cells allows for complex programmability and customization, making it versatile for different functions and tasks.

Surface Mount: YES

Surface mount capability makes it easy to integrate the FPGA onto circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.05 V

Efficient power consumption at a maximum supply voltage of 1.05 V helps in reducing energy costs and improving overall performance.

No. of CLBs: 3600

A high number of Configurable Logic Blocks (CLBs) provides flexibility in customizing the FPGA for specific applications or tasks.

No. of Inputs: 440

Multiple inputs allow for a wide range of data to be processed simultaneously, enhancing the FPGA's capability to handle complex tasks efficiently.

Package Shape: SQUARE

Square package shape optimizes space utilization on circuit boards, making it easier to incorporate the FPGA into various designs.

Form Of Terminal: BALL

Ball terminal design enhances connectivity and reliability of the FPGA when mounted on circuit boards, ensuring secure connections.

Power Supplies (V): 1,2.5

Support for multiple power supply voltages (1 V and 2.5 V) offers compatibility with different systems and allows for flexible power management.

No. of Terminals: 676

A high number of terminals provide ample connectivity options, enabling the FPGA to interface with various components within a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array (FPGA) allows for reprogramming and customization, making it suitable for prototyping and flexible system designs.

Package Style (Meter): GRID ARRAY

Grid array package style offers reliable connections and efficient heat dissipation, contributing to the FPGA's overall performance and longevity.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage of 0.95 V supports energy efficiency and helps in extending the lifespan of the FPGA.

Maximum Operating Temperature: 100 °C

High maximum operating temperature of 100°C ensures reliability and performance in demanding environmental conditions.

Pitch Of Terminal: 1 mm

A pitch of 1 mm between terminals allows for compact placement on circuit boards and facilitates fine-tuning of connections.

Maximum Combinatorial Delay of a CLB: 0.9 ns

Low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast data processing and efficient performance of the FPGA.

Organization: 3600 CLBS

Organized structure with 3600 Configurable Logic Blocks (CLBs) provides a systematic framework for customizing and programming the FPGA.

Minimum Operating Temperature: -40 °C

Wide temperature range of -40 to 100°C allows the FPGA to operate in both extreme cold and hot environments.

Finishing Of Terminal Used: TIN LEAD

Tin lead finishing on terminals enhances solderability and ensures secure connections when mounting the FPGA onto circuit boards.

Position Of Terminal: BOTTOM

Terminal position at the bottom ensures easy access for soldering and maintenance, simplifying the installation process.

Moisture Sensitivity Level (MSL): 4

Moisture sensitivity level of 4 indicates resistance to moisture damage, making the FPGA suitable for use in humid or damp environments.

Maximum Seated Height: 3 mm

Low maximum seated height of 3 mm minimizes the profile of the FPGA on circuit boards, allowing for thinner and more compact designs.

Width: 27 mm

Standard width of 27 mm ensures compatibility with common circuit board sizes and layouts, facilitating integration into various systems.

No. of Outputs: 440

A high number of outputs allow for versatile data processing and communication capabilities, expanding the functionality of the FPGA.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature of 30 seconds ensures quick and efficient soldering during the assembly process.

Peak Reflow Temperature °C: 225

High peak reflow temperature of 225°C ensures reliable soldering and secure connections for the FPGA on circuit boards.

Length: 27 mm

Standard length of 27 mm facilitates compatibility with common circuit board dimensions, enhancing the ease of integration.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance and durability of the FPGA in harsh industrial environments and applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VLX50-1FF676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

46080

No. of Inputs:

440

No. of Outputs:

440

No. of CLBs:

3600

CLB Maximum Delay:

0.9 ns

Sub-Category:

Field Programmable Gate Arrays

Organization:

3600 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

225 °C (437 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

27 mm

Width:

27 mm

Maximum Seated Height:

3 mm

Package Equivalence Code:

BGA676,26X26,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Lead

Terminal Pitch:

1 mm

No. of Terminals:

676

Standards

JESD-30 Code:

S-PBGA-B676

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

XC5VLX50-1FF676I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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