Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XC5VLX50-1FF676I is a FPGA with 46080 logic cells, 3600 CLBs, and 440 inputs/outputs. It operates at 1.05V with a max combinatorial delay of 0.9ns. Ideal for industrial applications requiring high-speed processing in compact designs.
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Plastic/Epoxy material provides durability and protection for the FPGA, making it suitable for various environments and applications.
Large number of logic cells allows for complex programmability and customization, making it versatile for different functions and tasks.
Surface mount capability makes it easy to integrate the FPGA onto circuit boards, saving space and simplifying the assembly process.
Efficient power consumption at a maximum supply voltage of 1.05 V helps in reducing energy costs and improving overall performance.
A high number of Configurable Logic Blocks (CLBs) provides flexibility in customizing the FPGA for specific applications or tasks.
Multiple inputs allow for a wide range of data to be processed simultaneously, enhancing the FPGA's capability to handle complex tasks efficiently.
Square package shape optimizes space utilization on circuit boards, making it easier to incorporate the FPGA into various designs.
Ball terminal design enhances connectivity and reliability of the FPGA when mounted on circuit boards, ensuring secure connections.
Support for multiple power supply voltages (1 V and 2.5 V) offers compatibility with different systems and allows for flexible power management.
A high number of terminals provide ample connectivity options, enabling the FPGA to interface with various components within a system.
Being a Field Programmable Gate Array (FPGA) allows for reprogramming and customization, making it suitable for prototyping and flexible system designs.
Grid array package style offers reliable connections and efficient heat dissipation, contributing to the FPGA's overall performance and longevity.
Low minimum supply voltage of 0.95 V supports energy efficiency and helps in extending the lifespan of the FPGA.
High maximum operating temperature of 100°C ensures reliability and performance in demanding environmental conditions.
A pitch of 1 mm between terminals allows for compact placement on circuit boards and facilitates fine-tuning of connections.
Low maximum combinatorial delay of a Configurable Logic Block (CLB) ensures fast data processing and efficient performance of the FPGA.
Organized structure with 3600 Configurable Logic Blocks (CLBs) provides a systematic framework for customizing and programming the FPGA.
Wide temperature range of -40 to 100°C allows the FPGA to operate in both extreme cold and hot environments.
Tin lead finishing on terminals enhances solderability and ensures secure connections when mounting the FPGA onto circuit boards.
Terminal position at the bottom ensures easy access for soldering and maintenance, simplifying the installation process.
Moisture sensitivity level of 4 indicates resistance to moisture damage, making the FPGA suitable for use in humid or damp environments.
Low maximum seated height of 3 mm minimizes the profile of the FPGA on circuit boards, allowing for thinner and more compact designs.
Standard width of 27 mm ensures compatibility with common circuit board sizes and layouts, facilitating integration into various systems.
A high number of outputs allow for versatile data processing and communication capabilities, expanding the functionality of the FPGA.
Short maximum time at peak reflow temperature of 30 seconds ensures quick and efficient soldering during the assembly process.
High peak reflow temperature of 225°C ensures reliable soldering and secure connections for the FPGA on circuit boards.
Standard length of 27 mm facilitates compatibility with common circuit board dimensions, enhancing the ease of integration.
Industrial-grade temperature rating ensures reliable performance and durability of the FPGA in harsh industrial environments and applications.
Field Programmable Gate Arrays (FPGA) XC5VLX50-1FF676I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XC5VLX50-1FF676I Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Cross-Ship Lead-Free Notice 31/Oct/2016 Mult Dev Material Chg 16/Dec/2019
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148WS
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Pro-an Electronic
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
M39029/58360
Esterline Technologies
CONNECTOR ACCESSORY; Terminal Type: CRIMP; Removal Tools: M81969/14-01; Associated Military - Specifications: MIL-DTL-38999; IEC Conformity: NO; MIL-Connector Accessory Name: CONTACT;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
INA826AIDGKR
Texas Instruments
INA826AIDGKR by Texas Instruments is an instrumentation amplifier with 150uV max input offset voltage, 0.095uA max average bias current, and 1MHz nominal bandwidth. Ideal for automotive applications due to its -40 to 125 °C operating temperature range and high common mode rejection ratio of 120dB.
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
LM7805CT
Integrated Circuit Technology
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Terminal Position: SINGLE; Operating Temperature (TJ-Min): 0 Cel;
1N4148WT
1N4148WT by Onsemi is a single rectifier diode with a max output current of 0.3A and forward voltage of 0.72V. It has a small outline package style, matte tin terminal finish, and operates at temperatures up to 150°C. Ideal for applications requiring fast reverse recovery time such as power supplies and signal demodulation circuits.
MBRA160T3G
MBRA160T3G by Onsemi is a Schottky rectifier diode with a max output current of 1A and forward voltage of 0.51V. It operates b/w -55 to 150°C, has a reverse test voltage of 60V, and is ideal for power applications due to its high efficiency and small outline package style.
LFXTAL025159REEL
Iqd Frequency Products
LFXTAL025159REEL by IQD Frequency Products is a 32.768 kHz crystal oscillator with 20 ppm frequency tolerance and 40,000 ohm series resistance. It is ideal for applications requiring precise timekeeping, such as real-time clocks in IoT devices or microcontrollers in wearables. The surface-mount design with a drive level of 1 uW makes it suitable for compact electronic systems.
2N2222A
Asi Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LL4148
Itt Components
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .005 us; Config: SINGLE; Maximum Operating Temperature: 200 Cel; Maximum Non Repetitive Peak Forward Current: 1 A;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
CRG0805F10K
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10000 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
Hi-tron Semiconductor
ULN2803A
Allegro MicroSystems
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Maximum Operating Temperature: 85 Cel; Terminal Form: THROUGH-HOLE;
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
EP4CE115F23I7N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
M2S090-FCSG325
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 325; Package Code: TFBGA; Package Shape: RECTANGULAR; JESD-609 Code: e1;
XCAU25P-L1FFVB676I
Xilinx
Xilinx XCAU25P-L1FFVB676I FPGA features 308437 logic cells, 17625 CLBs, and 208 inputs/outputs. With a package style of grid array and square shape, it is ideal for applications requiring high-performance programmable ICs in various industries. Operating temperature ranges from -40 to 100°C with a max supply voltage of 0.742V.
LCMXO2-256ZE-1MG132C
Lattice Semiconductor
LCMXO2-256ZE-1MG132C by Lattice Semiconductor is a 256 Logic Cell FPGA with 55 inputs/outputs, operating at 1.2V. It comes in a square grid array package and is suitable for applications requiring low power consumption and high flexibility in electronic designs.
EP4CE115F29C8N
Intel
EP4CE115F29C8N by Intel is a FPGA with 114480 logic cells, 7155 CLBs, and a max clock frequency of 472.5 MHz. It is used in applications requiring high-speed processing and programmable logic capabilities, such as telecommunications equipment and industrial automation systems.
EP3C55F484I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
EP3C25E144C8N
EP3C25E144C8N by Intel is a CMOS FPGA with 24624 logic cells and CLBs. Operating at 1.2V, it has 82 inputs/outputs and a clock frequency of 472.5MHz. Ideal for applications requiring high-speed processing in compact designs with low power consumption.
XC6SLX45-2FGG484I
Xilinx XC6SLX45-2FGG484I FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C and low power consumption at 1.2V, this FPGA offers versatile programmability for various electronic systems.
EP1S25F672C7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL EXTENDED; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
XC7S25-2CSGA324I
XC7S25-2CSGA324I by Xilinx is a Field Programmable Gate Array (FPGA) with 23360 logic cells and 1825 configurable logic blocks (CLBs). It operates at a max clock frequency of 1286 MHz and is commonly used in industrial applications.
XC7A75T-3FGG484E
Xilinx XC7A75T-3FGG484E FPGA features 75520 logic cells, 5900 CLBs, and a max clock frequency of 1412 MHz. Ideal for high-performance applications requiring advanced programmable ICs in a compact grid array package with a low combinatorial delay of 0.94 ns.
A40MX04-PLG68I
Microchip Technology
A40MX04-PLG68I by Microchip Tech is a 3.6V FPGA with 547 CLBs, 6000 gates, and max clock freq of 80MHz. Ideal for industrial applications requiring high-speed processing in temp range -40 to 85°C. Features CMOS tech, J bend terminals, and square package shape.
XC7S6-2CPGA196C
XC7S6-2CPGA196C by Xilinx is a 6000 logic cell FPGA with a max clock frequency of 1286 MHz. It is used for applications requiring high-speed processing and programmable logic capabilities.
XC6SLX25-2FGG484C
The Xilinx XC6SLX25-2FGG484C is a FPGA with 24051 logic cells, 1879 CLBs, and max clock frequency of 667 MHz. It operates at a nominal voltage of 1.2V and is suitable for applications requiring high-speed processing in electronics and telecommunications industries.
10M04SCU169I7G
The Intel 10M04SCU169I7G is a FPGA with 4000 logic cells, 250 CLBs, and 246 inputs/outputs. It operates at a voltage range of 2.85V to 3.15V and has an industrial temperature rating from -40°C to 100°C. Ideal for applications requiring high-performance programmable ICs in compact form factors.
10CL080YU484I7G
Intel's 10CL080YU484I7G FPGA features 5079 CLBs, operates at -40 to 100 °C, with a supply voltage of 1.2V. Ideal for industrial applications requiring high performance and flexibility in a compact GRID ARRAY package with 0.8mm terminal pitch.
A3P1000-PQG208I
A3P1000-PQG208I by Microchip Technology is a CMOS FPGA with 24576 CLBs and 1000000 gates. It operates at a max clock frequency of 350 MHz, suitable for industrial applications requiring high-speed processing. With a package style of flatpack, fine pitch, it offers versatility in design while maintaining reliability in harsh environments.
XC7S75-1FGGA676I
Xilinx XC7S75-1FGGA676I FPGA features 76800 logic cells, 6000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 400 inputs/outputs.
EP3C10M164C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 164; Package Code: TFBGA; Package Shape: SQUARE;
A3P600-FGG256I
Microchip Technology's A3P600-FGG256I is a CMOS FPGA with 13824 CLBs and 600000 gates. Operating at 1.5V, it offers a max clock frequency of 350MHz. Ideal for industrial applications requiring high gate count and clock speed in a compact grid array package.
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XC5VLX20T-1FFG323C
Xilinx XC5VLX20T-1FFG323C FPGA features 19968 logic cells, 1560 CLBs, and 172 inputs/outputs. Utilized in applications requiring high-speed processing with a max operating temperature of 85°C. Package style is grid array with a square shape and ball terminals for surface mount assembly.
XC5VFX70T-1FFG1136C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VLX30T-1FFG665C
Xilinx XC5VLX30T-1FFG665C FPGA features 30720 logic cells, 2400 CLBs, and a max clock frequency of 1098 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data processing units.
XC5VLX30T-2FFG665C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-1FFG1136C
Xilinx XC5VSX95T-1FFG1136C is a FPGA with 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. It operates at voltages of 1-2.5V, has a max combinatorial delay of 0.9ns, and uses CMOS technology. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.
XC5VFX30T-1FFG665C
XC5VLX85T-1FF1136I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1136; Package Code: BGA; Package Shape: SQUARE;
XC5VLX50-1FFG1153C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1153; Package Code: BGA; Package Shape: SQUARE;
XC5VSX50T-1FFG1136C
XC5VFX100T-1FF1136I
XC5VLX330-1FFG1760I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 1760; Package Code: BGA; Package Shape: SQUARE;
XC5VFX130T-1FFG1738C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 1738; Package Code: BGA; Package Shape: SQUARE;
XC5VSX95T-2FF1136C
XC5VLX110T-2FFG1136C
XC5VLX50T-1FFG1136C
XC5VLX110-1FFG1153C
XC5VLX85-1FFG676C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 676; Package Code: BGA; Package Shape: SQUARE;
XC5VLX85T-1FFG1136I
XC5VFX70T-1FF665I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 665; Package Code: BGA; Package Shape: SQUARE;
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