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XC5VSX95T-1FFG1136C

Xilinx

XC5VSX95T-1FFG1136C by Xilinx

Xilinx XC5VSX95T-1FFG1136C is a FPGA with 94208 logic cells, 7360 CLBs, and 640 inputs/outputs. It operates at voltages of 1-2.5V, has a max combinatorial delay of 0.9ns, and uses CMOS technology. Ideal for applications requiring high-speed processing in compact designs like telecommunications equipment and industrial automation systems.

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$4,586.860

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Mouser Electronics

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Nova Conductors

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Texas Native Microelectronics

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Kenton Components

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Qasali Group International

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Modulus Dynamics

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Corphita

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Continental Prestige Electronics

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Argo Parts USA

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Microchip USA

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Overview

Unlock limitless possibilities with the Xilinx XC5VSX95T-1FFG1136C Field Programmable Gate Array. Manufactured by the industry leader, Xilinx, this FPGA boasts 94,208 logic cells and 7,360 CLBs, making it a powerhouse in programmable IC technology. With a maximum supply voltage of 1.05V and advanced CMOS technology, this FPGA delivers reliable performance for a wide range of applications. Whether you're designing cutting-edge electronics or optimizing data processing tasks, the XC5VSX95T-1FFG1136C offers unmatched flexibility and efficiency. Elevate your projects to new heights with Xilinx's top-of-the-line FPGA solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and cost-effective.

No. of Logic Cells: 94208

With a high number of logic cells, this FPGA allows for complex designs and high-performance processing capabilities.

Surface Mount: YES

Being surface mountable, this FPGA is easy to integrate into PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 1.05 V

The low maximum supply voltage of 1.05 V ensures efficient power consumption and reduced heat generation.

No. of CLBs: 7360

The large number of Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions.

Technology Used: CMOS

The CMOS technology used in this FPGA results in low power consumption and high noise immunity.

No. of Inputs: 640

With 640 input options, this FPGA can handle a wide range of input signals and data.

Package Shape: SQUARE

The square package shape allows for efficient use of space on a PCB and simplifies layout design.

Form Of Terminal: BALL

The ball form of terminals makes for reliable connections and ease of soldering during assembly.

Power Supplies (V): 1,2.5

The multiple power supply options of 1V and 2.5V cater to different voltage requirements in various applications.

No. of Terminals: 1136

With a high number of terminals, this FPGA offers ample connectivity options for input and output connections.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this product provides flexibility for reconfiguring logic functions as needed.

Package Style (Meter): GRID ARRAY

The grid array package style enables easy connection to external components, enhancing overall system integration.

Minimum Supply Voltage: 0.95 V

The low minimum supply voltage requirement of 0.95V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this FPGA can perform reliably in harsh environmental conditions.

Pitch Of Terminal: 1 mm

The 1mm pitch of terminals allows for high-density mounting, maximizing the use of available board space.

Maximum Combinatorial Delay of a CLB: 0.9 ns

The low maximum combinatorial delay of 0.9 ns ensures fast signal processing and reduced latency.

Organization: 7360 CLBS

The organizational structure of 7360 CLBs provides a balance between logic complexity and design flexibility.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can operate reliably in cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of tin, silver, and copper finishing on terminals ensures good conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies the PCB layout and routing of signal traces for efficient design.

Moisture Sensitivity Level (MSL): 4

With an MSL of 4, this FPGA can withstand moderate levels of moisture exposure during handling and assembly.

Maximum Seated Height: 3.25 mm

The low maximum seated height of 3.25 mm allows for compact PCB designs with minimal height restrictions.

Width: 35 mm

With a width of 35 mm, this FPGA offers a balance between compact size and sufficient space for terminal connections.

No. of Outputs: 640

The high number of output options provides flexibility for routing signals and data to external components.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this FPGA can be easily integrated into the manufacturing process.

Peak Reflow Temperature °C: 245

The high peak reflow temperature of 245°C ensures reliable soldering and component attachment during assembly.

Length: 35 mm

With a length of 35 mm, this FPGA offers a compact form factor suitable for integration into various electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC5VSX95T-1FFG1136C attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

94208

No. of Inputs:

640

No. of Outputs:

640

No. of CLBs:

7360

CLB Maximum Delay:

0.9 ns

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Organization:

7360 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Power Supplies:

1,2.5 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

4

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.25 mm

Package Equivalence Code:

BGA1136,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1136

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

XC5VSX95T-1FFG1136C Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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