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10M02SCM153C8G

Intel

10M02SCM153C8G by Intel

Intel 10M02SCM153C8G FPGA features 2000 logic cells, 125 CLBs, and 246 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for applications requiring high-performance programmable ICs in a compact square package with ball terminals.

Median Price

$7.445

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Nova Conductors

Japan . 50 parts In-Stock

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Digiode

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Chip Stock

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Touchstone Systems

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Component Sense

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Cyclops Electronics Ltd

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Corohmni

South Africa . 64 parts In-Stock

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$6.090

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Vigor

Singapore . 420 parts In-Stock

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Continental Prestige Electronics

USA . 2,401 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Ampacity Inc.

Singapore . 838 parts In-Stock

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Semicontronic

India . 696 parts In-Stock

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Corphita

USA . 1,021 parts In-Stock

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Microchip USA

USA . 1,772 parts In-Stock

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MARBEL Systems

Belgium . 2,812 parts In-Stock

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Texas Native Microelectronics

USA . 10,452 parts In-Stock

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Kenton Components

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Modulus Dynamics

Lithuania . 1,866 parts In-Stock

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Aztec Data Supply Inc.

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Advanced Electronics

New Zealand . 1,636 parts In-Stock

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Qasali Group International

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S.R.D Solutions

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RC Electronics

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Perfect Parts

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Authorized Procurement Solutions

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GreenTree Electronics

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Argo Parts USA

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Lucentia Tech

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Supply Digital

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Futuretech Components

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Overview

Unlock limitless possibilities with the 10M02SCM153C8G by Intel, a high-quality Field Programmable Gate Array that offers unparalleled flexibility and performance. Manufactured by Intel, a trusted leader in technology, this FPGA is designed to meet your specific needs with its 2000 logic cells and 125 CLBs. Whether you're looking to enhance your design, optimize performance, or streamline operations, this FPGA delivers on value, benefits, and advantages, making it the ideal choice for a wide range of applications. Experience the power of innovation with the 10M02SCM153C8G from Intel today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FPGA, making it suitable for various environmental conditions.

No. of Logic Cells: 2000

With a high number of logic cells, this FPGA has the capability to handle complex logic functions and algorithms efficiently.

Surface Mount: YES

The surface mount feature allows for easy installation and replacement of the FPGA on a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 3.15 V

The high maximum supply voltage ensures stable and reliable operation of the FPGA within the specified voltage range.

No. of CLBs: 125

The 125 CLBs (configurable logic blocks) provide flexibility in designing and implementing custom logic functions in the FPGA.

No. of Inputs: 246

Having a high number of inputs allows for versatile connectivity and integration of external signals and data sources into the FPGA.

Package Shape: SQUARE

The square package shape is space-efficient and allows for easy placement on a circuit board, optimizing the use of available space.

Form Of Terminal: BALL

The ball terminals provide good electrical connections and ensure reliable signal transmission between the FPGA and other components on the circuit board.

Nominal Supply Voltage (V): 3

The nominal supply voltage of 3V is a common standard in many electronic systems, ensuring compatibility and ease of integration.

No. of Terminals: 153

A sufficient number of terminals facilitate easy connection and interfacing of the FPGA with other components in a circuit, simplifying the overall design process.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device, this FPGA allows for flexibility in updating or modifying the logic functions and behavior without changing hardware components.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and uniform layout of terminals, promoting easy installation and maintenance of the FPGA on a circuit board.

Minimum Supply Voltage: 2.85 V

The low minimum supply voltage ensures efficient power consumption and operation of the FPGA even under low voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this FPGA can withstand elevated temperatures and harsh environmental conditions, ensuring reliable performance in various applications.

Pitch Of Terminal: 0.5 mm

The small pitch of terminals allows for compact design and placement of the FPGA on a circuit board, optimizing space utilization and signal integrity.

Organization: 125 CLBS

The organization of 125 CLBs provides a structured framework for designing and implementing complex logic functions and algorithms in the FPGA efficiently.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this FPGA can function reliably even in low temperature environments, expanding its range of applications.

Position Of Terminal: BOTTOM

The bottom position of terminals simplifies the routing and connection of signals within the circuit board layout, enhancing ease of assembly and maintenance.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level of 3, this FPGA can withstand typical environmental conditions without the risk of moisture-induced damage or performance issues.

Maximum Seated Height: 1 mm

The low maximum seated height of 1 mm ensures compatibility with standard component clearances and height restrictions in electronic systems and devices.

Width: 8 mm

With a width of 8 mm, this FPGA is space-efficient and can fit into compact circuit board layouts, enabling versatile integration in various electronic systems.

No. of Outputs: 246

Having a high number of outputs allows for efficient signal processing and distribution from the FPGA to other components in the circuit, enhancing overall system performance.

Length: 8 mm

With a length of 8 mm, this FPGA is compact and can be easily accommodated in tight spaces on a circuit board, offering flexibility in system design and layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M02SCM153C8G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

2000

No. of Inputs:

246

No. of Outputs:

246

No. of CLBs:

125

Organization:

125 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA153,15X15,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

153

Standards

JESD-30 Code:

S-PBGA-B153

Trade Compliance

10M02SCM153C8G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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