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MPF300T-1FCG1152I

Microchip Technology

MPF300T-1FCG1152I by Microchip Technology

MPF300T-1FCG1152I by Microchip Tech is a 300K logic cell FPGA with CMOS tech, 512 inputs/outputs, and 1152 terminals. It operates b/w -40 to 100°C, has a package height of 3.47mm, and uses a grid array style for applications in various electronic systems.

Median Price

$740.048

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2 parts In-Stock

1+ parts

$564.980

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-

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2

$564.980

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Microchip Technology

USA . 1 parts In-Stock

1+ parts

$708.010

100+ parts

$643.640

1k+ parts

$447.160

10k+ parts

-

1

$708.010

$643.640

$447.160

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Verical

USA . 2 parts In-Stock

1+ parts

$772.085

100+ parts

$772.085

1k+ parts

$772.085

10k+ parts

$772.085

2

$772.085

$772.085

$772.085

$772.085

Element14

Singapore . 2 parts In-Stock

1+ parts

$1,108.230

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2

$1,108.230

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Distributors (In-Stock)

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Digiode

USA . 351 parts In-Stock

1+ parts

$255.616

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351

$255.616

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NAC Semi

USA . 204 parts In-Stock

1+ parts

$566.410

100+ parts

$531.010

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204

$566.410

$531.010

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Nova Conductors

Japan . 58 parts In-Stock

1+ parts

$768.770

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58

$768.770

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Vyrian

USA . 7,730 parts In-Stock

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7,730

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Chip Stock

USA . 1,283 parts In-Stock

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1,283

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 829 parts In-Stock

1+ parts

$7.369

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829

$7.369

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Corohmni

South Africa . 67 parts In-Stock

1+ parts

$76.493

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67

$76.493

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Aztec Data Supply Inc.

USA . 142 parts In-Stock

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$79.790

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142

$79.790

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Corphita

USA . 303 parts In-Stock

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$242.163

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303

$242.163

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Ampacity Inc.

Singapore . 15 parts In-Stock

1+ parts

$480.230

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15

$480.230

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Semicontronic

India . 15 parts In-Stock

1+ parts

$480.230

100+ parts

$468.224

1k+ parts

$465.823

10k+ parts

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15

$480.230

$468.224

$465.823

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Vigor

Singapore . 177 parts In-Stock

1+ parts

$582.400

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177

$582.400

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$768.770

100+ parts

$753.395

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2,000

$768.770

$753.395

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Montano Global Distributors

Canada . 4,661 parts In-Stock

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4,661

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LOOK Integrated Logistics

Peru . 3,767 parts In-Stock

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3,767

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Argo Parts USA

USA . 3,366 parts In-Stock

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3,366

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LMD Electronica

Estonia . 2,580 parts In-Stock

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2,580

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Continental Prestige Electronics

USA . 2,277 parts In-Stock

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2,277

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NIA Electronics

USA . 980 parts In-Stock

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980

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Ledger Components

France . 980 parts In-Stock

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980

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Overview

Unlock limitless possibilities with the MPF300T-1FCG1152I by Microchip Technology. As a leading manufacturer in the field of Field Programmable Gate Arrays (FPGA), Microchip Technology delivers top-quality products that cater to a wide range of applications. With 300,000 logic cells and 512 inputs/outputs, this FPGA offers unmatched flexibility and performance. Whether you're designing cutting-edge electronics or optimizing industrial processes, the MPF300T-1FCG1152I provides the value, benefits, and advantages you need to stay ahead of the curve. Embrace innovation and elevate your projects with this game-changing product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material helps in reducing the overall weight of the product, making it easier to handle and install.

No. of Logic Cells: 300000

With a high number of logic cells, this FPGA is capable of handling complex logic operations and designs, making it suitable for advanced applications.

Surface Mount: YES

Being surface mountable makes the FPGA easier to integrate onto printed circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 1.03 V

The maximum supply voltage of 1.03 V ensures safe operation and reduces the risk of overloading or damaging the FPGA.

Technology Used: CMOS

The use of CMOS technology results in lower power consumption and faster operation speeds, making the FPGA efficient and reliable.

No. of Inputs: 512

Having a high number of inputs allows for greater flexibility and versatility in designing complex digital circuits and systems.

Package Shape: SQUARE

The square package shape is space-efficient and facilitates easier placement and routing on circuit boards, improving overall system design.

Form Of Terminal: BALL

The ball terminals provide a reliable and secure connection between the FPGA and the circuit board, ensuring stable performance under varying conditions.

No. of Terminals: 1152

With a high number of terminals, the FPGA offers extensive connectivity options for interfacing with external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this product offers the flexibility of reconfiguring logic functions and designs as needed, making it versatile and adaptable to changing requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and organized layout of terminals, improving signal integrity and ease of installation.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage of 0.97 V allows for operation in low-power environments, increasing efficiency and reducing energy consumption.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this FPGA can withstand high temperature environments without compromising performance.

Pitch Of Terminal: 1 mm

The 1 mm pitch of terminals provides ample spacing for easy soldering and assembly, ensuring reliable connections and a robust electrical interface.

Minimum Operating Temperature: -40 °C

The FPGA is designed to operate efficiently in extreme cold conditions down to -40°C, making it suitable for a wide range of environmental applications.

Position Of Terminal: BOTTOM

The bottom position of the terminals allows for easy access and connection to the circuit board, simplifying installation and maintenance processes.

Maximum Seated Height: 3.47 mm

With a maximum seated height of 3.47 mm, the FPGA is compact and slim, fitting easily within tight spaces or low-profile designs.

Width: 35 mm

The 35 mm width of the FPGA provides a balance between compactness and compatibility, allowing for seamless integration into various system configurations.

No. of Outputs: 512

The high number of outputs enables the FPGA to drive multiple external devices and components simultaneously, enhancing system performance and functionality.

Length: 35 mm

The 35 mm length of the FPGA complements its width, making it a compact and versatile solution for a wide range of digital design applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-1FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300T-1FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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