Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Xilinx XA6SLX45-3CSG324Q is a FPGA with 43661 logic cells, 218 inputs/outputs, and max clock frequency of 62.5 MHz. Ideal for applications requiring high-speed processing like telecommunications equipment and industrial automation systems.
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Provides durability and protection for the internal components of the FPGA, ensuring reliable performance.
High number of logic cells allows for complex programmable logic designs to be implemented effectively.
Simplifies the PCB assembly process and saves space on the board.
Meets automotive-grade standards, ensuring high reliability and performance under harsh conditions.
Provides ample input ports for connecting to external devices and sensors.
Facilitates easy integration and placement on the PCB.
Enables reliable connections and soldering during the assembly process.
Supports multiple voltage options, allowing flexibility in powering the FPGA.
Offers sufficient terminals for connecting to other components on the PCB.
Provides flexibility for reprogramming the logic design as needed, making it suitable for prototyping and development.
Enables high-density packaging and efficient routing of signals on the PCB.
Allows for close spacing of terminals, saving PCB real estate.
Ensures good conductivity and reliability in the terminal connections.
Facilitates easy access and soldering of the terminals during PCB assembly.
Indicates moderate sensitivity to moisture, requiring standard handling procedures during storage and assembly.
Supports high-speed operation for time-critical applications.
Provides ample output ports for transmitting processed data and signals to external devices.
Allows sufficient time for the component to be heated uniformly during the soldering process.
Withstands high-temperature soldering processes, ensuring robust and reliable solder joints.
Field Programmable Gate Arrays (FPGA) XA6SLX45-3CSG324Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
Programmable IC Type:
No. of Logic Cells:
No. of Inputs:
No. of Outputs:
Maximum Clock Frequency:
Sub-Category:
Power Supplies:
Peak Reflow Temperature:
Peak Reflow Time:
Moisture Sensitivity Level (MSL):
Package Body Material:
Surface Mountable:
Package Style:
Package Code:
Package Shape:
Package Equivalence Code:
Terminal Position:
Terminal Style:
Terminal Finish:
Terminal Pitch:
No. of Terminals:
JESD-30 Code:
JESD-609 Code:
Qualified:
Screening Level:
XA6SLX45-3CSG324Q Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
1N4148
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
RN41N-I/RM
Microchip Technology
Microchip Technology's RN41N-I/RM is a telecom IC with 35 terminals, operating from -40 to 85°C. It has a supply voltage of 3.3V and is surface mountable in industrial applications. The package style is rectangular, measuring 13.2mm x 20.1mm with a seated height of 2.2mm, suitable for telecom interface functions.
M24308/2-1F
Souriau-sunbank Connection Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Body Length: 1.228 inch; Mounting Type: CABLE AND PANEL; Termination Type: CRIMP;
2N2222A
Electronic Transistors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BAV99
Bkc Semiconductors
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Plessey Semiconductors Discrete Components Div
Other Transistors;
USB2514BI-AEZG
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
BSS123,215
NXP Semiconductors
NXP Semiconductors' BSS123,215 is a N-CHANNEL FET for SWITCHING applications. Features include 100V DS Breakdown Voltage, 0.17A Drain Current, and 6 ohm On Resistance. With GULL WING terminals and ENHANCEMENT MODE operation, it's ideal for small outline packages in various electronic devices.
ULN2803A
Motorola
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; Terminal Position: DUAL; JESD-30 Code: R-PDIP-T18;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Allegro MicroSystems
BSS123LT1G
Onsemi
BSS123LT1G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. It comes in a small outline package with gull wing terminals and can withstand temperatures from -55 to 150°C.
LM358N
Texas Instruments
LM358N by Texas Instruments is an operational amplifier with 2 functions, offering a max input offset voltage of 9000 uV and a nominal common mode reject ratio of 85 dB. Widely used in commercial applications, it operates at temperatures ranging from 0 to 70 °C and has a unity gain bandwidth of 1000 kHz.
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Vishay Sprague
NPN; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JEDEC-95 Code: TO-18; Maximum Collector-Emitter Voltage: 40 V;
Lite-on Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Qualification: Not Qualified; Additional Features: LOW THRESHOLD; Minimum DS Breakdown Voltage: 60 V;
1N4148WS
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Meritek Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Diotec Semiconductor Ag
XC7S25-1CSGA225C
Xilinx
The Xilinx XC7S25-1CSGA225C is a FPGA with 23360 logic cells, 1825 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems. The package style is grid array, low profile, fine pitch with PLASTIC/EPOXY material.
10M16SAE144I7G
Intel
Intel 10M16SAE144I7G is a FPGA with 16000 logic cells, 1000 CLBs, and 320 inputs/outputs. It operates at 2.85-3.15V, -40 to 100°C, ideal for industrial applications requiring high-performance programmable ICs in compact form factors with low power consumption.
XCAU25P-1SFVB784I
FIELD PROGRAMMABLE GATE ARRAY;
LCMXO2-2000HC-4BG256C
Lattice Semiconductor
LCMXO2-2000HC-4BG256C by Lattice Semiconductor is a FPGA with 2112 logic cells, 206 inputs/outputs, and max clock frequency of 133 MHz. It operates at 2.375-3.465 V, suitable for applications requiring high-speed processing in industrial automation and telecommunications sectors.
M1A3P1000-PQG208M
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: MILITARY; Form Of Terminal: GULL WING; No. of Terminals: 208; Package Code: FQFP; Package Shape: SQUARE;
XC6SLX9-2FTG256I
Xilinx XC6SLX9-2FTG256I FPGA features 9152 logic cells, 715 CLBs, and a max clock frequency of 667 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
EP3C16F256I7N
Intel's EP3C16F256I7N FPGA features 15408 logic cells, 168 inputs/outputs, and a max clock frequency of 472.5 MHz. Ideal for industrial applications requiring high-speed processing in a compact form factor with low power consumption.
XC6SLX45-2FGG484I
Xilinx XC6SLX45-2FGG484I FPGA features 43661 logic cells, 3411 CLBs, and 316 inputs/outputs. Operating at a max frequency of 667 MHz, it is ideal for industrial applications requiring high-speed processing in a compact form factor. With a wide temperature range from -40 to 100°C and low power consumption at 1.2V, this FPGA offers versatile programmability for various electronic systems.
LCMXO2-4000HC-4FTG256I
LCMXO2-4000HC-4FTG256I by Lattice Semiconductor is a FPGA with 4320 logic cells, 206 inputs/outputs, and operates at 2.5V nominal voltage. It is used in applications requiring high-performance computing, signal processing, and embedded systems due to its low profile grid array package style.
XC7A75T-2FGG484I
The Xilinx XC7A75T-2FGG484I is a FPGA with 75520 logic cells, 5900 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
XC7S15-2CSGA225C
The Xilinx XC7S15-2CSGA225C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1286 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP3C5F256C8N
Altera
EP3C5F256C8N by Altera is a field programmable gate array (FPGA) with 5136 logic cells, CMOS technology, 182 inputs/outputs, and a maximum clock frequency of 472.5 MHz. It has a low profile package and is suitable for various applications requiring high-speed processing.
EP4CE15F23I7N
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
LFE5U-45F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
EP3C40Q240C8N
The EP3C40Q240C8N by Altera is a field programmable gate array (FPGA) with 39,600 logic cells and 128 inputs/outputs. It has a maximum clock frequency of 472.5 MHz and operates at a supply voltage range of 1.15V to 1.25V. This FPGA is surface mountable and has a compact rectangular package shape. Its applications include digital signal processing, communications, and embedded systems.
A3P1000-FGG484
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: COMMERCIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
10M50SCE144C8G
The Intel 10M50SCE144C8G is a FPGA with 50000 logic cells, 3125 CLBs, and 500 inputs/outputs. It operates at supply voltages of 2.85V to 3.15V and temperatures from 0°C to 85°C. This versatile device is ideal for applications requiring high-speed data processing and customizable logic functions in a compact form factor.
EP3C40F484I7N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: RECTANGULAR;
LCMXO2-1200ZE-1TG144C
LCMXO2-1200ZE-1TG144C by Lattice Semiconductor is a 1280 logic cell FPGA with max clock freq of 133MHz. It operates at 1.2V, has 107 inputs/outputs, and can withstand temps from 0 to 85°C. Ideal for applications requiring high-speed processing in compact designs.
EP2C20F256C8N
EP2C20F256C8N by Intel is a FPGA with 18752 logic cells, 1172 CLBs, and 152 inputs. It operates at a max clock frequency of 402.5 MHz and is suitable for applications requiring high-speed processing and programmable ICs in various industries. With a package style of grid array and low profile, it offers versatility in design while maintaining a compact form factor.
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XA6SLX45-3FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XA6SLX100-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX75-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
XA6SLX16-2CSG225Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XA6SLX45-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FGG484I
XA6SLX100-2FG484Q
XA6SLX100-2FGG676I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XA6SLX100-2FGG676Q
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
XA6SLX100-2CS484I
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e0; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN LEAD;
XA6SLX100-2CSG484I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2FG676I
XA6SLX100-2FG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FGG676C
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2CSG484C
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XA6SLX100-2FG676Q
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN LEAD; JESD-609 Code: e0;
XA6SLX100-2CSG484Q
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2FG900C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FG900I
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