Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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XA6SLX100-2FGG484Q by Xilinx is a CMOS FPGA with 101261 logic cells, 326 inputs/outputs, and max clock freq of 667MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation.
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This material is cost-effective and durable, making the FPGA suitable for a wide range of applications.
With a high number of logic cells, this FPGA can handle complex logic functions efficiently.
Being surface mountable makes the FPGA easy to integrate onto PCBs, saving space and simplifying assembly.
This screening level ensures that the FPGA meets automotive-grade reliability and quality standards.
CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.
With a high number of inputs, this FPGA can handle a large amount of data and signals, making it versatile for different applications.
The square package shape allows for easy placement and alignment on the PCB.
Ball terminals provide a reliable and secure connection, ensuring stable performance of the FPGA.
Supporting multiple power supply voltages gives flexibility in design and compatibility with different power systems.
With a high number of terminals, there are plenty of connection options for interfacing with other components.
As an FPGA, this IC offers reconfigurability for custom logic functions, enabling versatile and adaptable designs.
A grid array package style ensures easy mounting and soldering, enhancing the assembly process.
With a small pitch of terminals, the FPGA can be densely packed on the PCB, saving space.
This finishing offers good conductivity and corrosion resistance, ensuring reliable electrical connections.
Terminals at the bottom allow for a cleaner and more accessible PCB design layout.
MSL 3 indicates that the FPGA is moderately sensitive to moisture, requiring standard handling procedures.
A high maximum clock frequency allows for fast operation and processing of signals in real-time applications.
With a matching number of outputs to inputs, the FPGA can efficiently process and route signals.
With a maximum time at peak reflow temperature of 30 seconds, the FPGA can withstand soldering processes without damage.
With a high peak reflow temperature, the FPGA can endure rigorous soldering conditions, ensuring reliable connections.
Field Programmable Gate Arrays (FPGA) XA6SLX100-2FGG484Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx
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XA6SLX100-2FGG484Q Programmable ICs trade compliance attributes, and parameters.
ECCN
3A991.D
ECCN Governance
EAR
HTS
8542.39.00.01
SB
8542.39.00.00
Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
1N4148
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR0520LT1
Onsemi
MBR0520LT1 by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, making it suitable for applications requiring low power consumption in compact electronic devices. This single-configured diode is surface mountable and has a max repetitive peak reverse voltage of 20V, ideal for small outline package designs.
FDV304P
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
LL4148
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MMBT2907ALT1G
Rochester Electronics
PNP; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 200 MHz; Maximum Collector Current (IC): .6 A; Terminal Form: GULL WING;
BAV99
Taitron Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M24308/2-1F
Esterline Technologies
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Option-1: HOLE .115-.125; Mounting Type: CABLE AND PANEL; Mating Contact Finish: NOT SPECIFIED;
2N2222A
Gec Plessey Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
EU2B-YS303C
Idec
ROTARY SWITCH;
Surge Components
SMBJ18CA
World Products
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Zetex Plc
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
ROHM
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .6 A;
LAN8720AI-CP-TR
LAN8720AI-CP-TR by Microchip is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 85 °C. It features a 3.3 V supply voltage, 54 mA supply current, and TS 16949 screening level. Ideal for network interfaces in industrial applications due to its compact square package and low profile design.
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
LCMXO2-640HC-4SG48I
Lattice Semiconductor
LCMXO2-640HC-4SG48I by Lattice Semiconductor is a 640 Logic Cells FPGA with 80 CLBs and 40 Inputs/Outputs. Operating at -40 to 100 °C, it's ideal for applications requiring high-speed processing and flexibility in electronic design. Its compact SQUARE package with 0.5 mm terminal pitch makes it suitable for space-constrained designs.
LFE5U-25F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
A3P1000-FG144I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
LFE5UM-85F-8BG381I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): NOT SPECIFIED; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED;
ICE5LP4K-SG48ITR
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260;
A3P250-VQG100
A3P250-VQG100 by Microchip Technology is a CMOS FPGA with 6144 CLBs and 250000 gates. Operating at max 1.575V, it offers a clock frequency of 350MHz. Ideal for applications requiring high gate count and fast processing speeds in commercial temperature range.
EP3C10F256I7N
Intel
EP3C10F256I7N by Intel is a CMOS-based FPGA with 10320 logic cells and 182 inputs/outputs. It operates at a max clock frequency of 472.5 MHz and is commonly used in industrial applications requiring programmable ICs for high-speed data processing.
XC7A100T-2CSG324I
Xilinx
Xilinx XC7A100T-2CSG324I FPGA offers 101440 logic cells, 7925 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
XC7S15-2CPGA196C
Xilinx XC7S15-2CPGA196C is a 12800 logic cell FPGA with 1000 CLBs, operating at max frequency of 1286 MHz. Suitable for applications requiring high-speed processing and low power consumption in electronics industry. Features include 0.5 mm terminal pitch, 1.05 ns combinatorial delay, and thin profile grid array package style.
M2S090-FCSG325
Microchip Technology's M2S090-FCSG325 FPGA offers 86184 logic cells, 180 inputs/outputs, and operates at a voltage range of 1.14V to 1.26V. Ideal for applications requiring high-speed processing and programmable logic in compact form factors with a grid array package style.
5CEFA7F23I7N
Altera
The Altera 5CEFA7F23I7N is a field programmable gate array (FPGA) with 149500 logic cells. It has a maximum supply voltage of 1.13V and uses CMOS technology. The package style is a grid array with 484 terminals, and it has 240 inputs and outputs. This FPGA is suitable for applications requiring high-level customization and versatility.
10CL120YF780I7G
Intel 10CL120YF780I7G is a FPGA with 7443 CLBs, 1.2V nominal voltage, and 100°C max operating temp. Ideal for industrial applications requiring high-performance programmable ICs in a compact square grid array package with bottom terminals.
XC6SLX150T-3FGG484I
Xilinx XC6SLX150T-3FGG484I FPGA features 147443 logic cells, 11519 CLBs, and 296 inputs/outputs. Utilized in industrial applications, it operates at a max clock frequency of 862 MHz with a combinatorial delay of 0.21 ns per CLB.
EP1C3T144C8N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
XC7S25-2CSGA225C
Xilinx XC7S25-2CSGA225C FPGA features 23360 logic cells, 1825 CLBs, and a max clock frequency of 1286 MHz. Ideal for applications requiring high-speed processing such as telecommunications equipment, industrial automation systems, and data center infrastructure.
LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I by Lattice Semiconductor is a 256 Logic Cell FPGA with 32 CLBs, operating at 2.5V nominal voltage. Suitable for applications requiring high-density programmable ICs in compact form factors, such as IoT devices and industrial automation systems.
LCMXO2-4000HC-4TG144I
LCMXO2-4000HC-4TG144I by Lattice Semiconductor is a FPGA with 4320 logic cells, 114 inputs/outputs, and operates at 2.5V nominal voltage. Ideal for applications requiring high-density programmable ICs in compact spaces with temperature range of -40 to 100°C.
XC7A100T-1CS324I
The Xilinx XC7A100T-1CS324I is a FPGA with 101440 logic cells, 7925 CLBs, and max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package. Operating temperatures range from -40 to 100°C, making it suitable for various environments.
EP2C8F256C8N
EP2C8F256C8N by Intel is a FPGA with 8256 logic cells, 516 CLBs, and 182 inputs. It operates at a max clock frequency of 402.5 MHz and has a package style of grid array, making it suitable for high-performance computing applications requiring fast processing speeds in compact form factors.
EP2C5T144C7N
EP2C5T144C7N by Altera is a field programmable gate array with 4608 logic cells. It operates on a supply voltage range of 1.15-1.25V and has a maximum clock frequency of 450 MHz. This FPGA is commonly used in applications that require high-speed processing and programmability.
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XA6SLX45-3CSG324Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 324; Package Code: FBGA; Package Shape: SQUARE; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX45-3FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
XA6SLX75-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
XA6SLX16-2CSG225Q
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
XA6SLX45-2FGG484Q
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: AUTOMOTIVE; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FGG484I
FIELD PROGRAMMABLE GATE ARRAY; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE; Package Body Material: PLASTIC/EPOXY;
XA6SLX100-2FG484Q
XA6SLX100-2FGG676I
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3;
XA6SLX100-2FGG676Q
FIELD PROGRAMMABLE GATE ARRAY; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1;
XA6SLX100-2CS484I
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e0; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN LEAD;
XA6SLX100-2CSG484I
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2FG676I
XA6SLX100-2FG484I
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FGG676C
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Peak Reflow Temperature (C): 250; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2CSG484C
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1;
XA6SLX100-2FG676Q
FIELD PROGRAMMABLE GATE ARRAY; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN LEAD; JESD-609 Code: e0;
XA6SLX100-2CSG484Q
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Moisture Sensitivity Level (MSL): 3; Finishing Of Terminal Used: TIN SILVER COPPER;
XA6SLX100-2FG900C
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 900; Package Code: BGA; Package Shape: SQUARE;
XA6SLX100-2FG900I
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