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XA6SLX100-2FGG484Q

Xilinx

XA6SLX100-2FGG484Q by Xilinx

XA6SLX100-2FGG484Q by Xilinx is a CMOS FPGA with 101261 logic cells, 326 inputs/outputs, and max clock freq of 667MHz. Ideal for applications requiring high-speed processing like telecommunications, automotive systems, and industrial automation.

Median Price

$284.700

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Nova Conductors

Japan . 500 parts In-Stock

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Digiode

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Ampacity Inc.

Singapore . 457 parts In-Stock

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Modulus Dynamics

Lithuania . 922 parts In-Stock

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AZTECH Wire

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One Stop Electronics

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Aztec Data Supply Inc.

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Texas Native Microelectronics

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Corohmni

South Africa . 514 parts In-Stock

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Kenton Components

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Netroflash

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Continental Prestige Electronics

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Microchip USA

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Qasali Group International

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Overview

Unlock limitless possibilities with the Xilinx XA6SLX100-2FGG484Q Field Programmable Gate Array. Crafted by industry leader Xilinx, this FPGA boasts 101261 logic cells and a maximum clock frequency of 667 MHz, providing unparalleled performance for a wide range of applications. Whether you're designing cutting-edge technology or powering complex systems, this FPGA's versatility and reliability make it the ideal choice. Experience the power of innovation with Xilinx today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the FPGA suitable for a wide range of applications.

No. of Logic Cells: 101261

With a high number of logic cells, this FPGA can handle complex logic functions efficiently.

Surface Mount: YES

Being surface mountable makes the FPGA easy to integrate onto PCBs, saving space and simplifying assembly.

Screening Level: AEC-Q100

This screening level ensures that the FPGA meets automotive-grade reliability and quality standards.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy-efficient and reliable.

No. of Inputs: 326

With a high number of inputs, this FPGA can handle a large amount of data and signals, making it versatile for different applications.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on the PCB.

Form Of Terminal: BALL

Ball terminals provide a reliable and secure connection, ensuring stable performance of the FPGA.

Power Supplies (V): 1.2,1.2/3.3,2.5/3.3

Supporting multiple power supply voltages gives flexibility in design and compatibility with different power systems.

No. of Terminals: 484

With a high number of terminals, there are plenty of connection options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As an FPGA, this IC offers reconfigurability for custom logic functions, enabling versatile and adaptable designs.

Package Style (Meter): GRID ARRAY

A grid array package style ensures easy mounting and soldering, enhancing the assembly process.

Pitch Of Terminal: 1 mm

With a small pitch of terminals, the FPGA can be densely packed on the PCB, saving space.

Finishing Of Terminal Used: TIN SILVER COPPER

This finishing offers good conductivity and corrosion resistance, ensuring reliable electrical connections.

Position Of Terminal: BOTTOM

Terminals at the bottom allow for a cleaner and more accessible PCB design layout.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the FPGA is moderately sensitive to moisture, requiring standard handling procedures.

Maximum Clock Frequency: 667 MHz

A high maximum clock frequency allows for fast operation and processing of signals in real-time applications.

No. of Outputs: 326

With a matching number of outputs to inputs, the FPGA can efficiently process and route signals.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, the FPGA can withstand soldering processes without damage.

Peak Reflow Temperature °C: 250

With a high peak reflow temperature, the FPGA can endure rigorous soldering conditions, ensuring reliable connections.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XA6SLX100-2FGG484Q attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

101261

No. of Inputs:

326

No. of Outputs:

326

Maximum Clock Frequency:

667 MHz

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Power Supplies:

1.2,1.2/3.3,2.5/3.3 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Qualified:

No

Screening Level:

AEC-Q100

Trade Compliance

XA6SLX100-2FGG484Q Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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