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EP3C25F256C8NES

Intel

EP3C25F256C8NES by Intel

EP3C25F256C8NES by Intel is a FPGA with 24624 CLBs, 472.5 MHz clock frequency, and 1.25 V max supply voltage. Ideal for applications requiring high-speed processing and programmable logic in compact form factors like IoT devices and telecommunications equipment.

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Vyrian

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Nova Conductors

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Andel Nordic

Denmark . 5,329 parts In-Stock

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One Stop Electronics

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AZTECH Wire

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Semicontronic

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Modulus Dynamics

Lithuania . 1,110 parts In-Stock

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MARBEL Systems

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Texas Native Microelectronics

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Kenton Components

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Corohmni

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Overview

Unlock limitless possibilities with the EP3C25F256C8NES by Intel, a top-of-the-line Field Programmable Gate Array that boasts unparalleled quality and reliability. Manufactured by industry leader Intel, this FPGA is designed to revolutionize the way you approach circuit design and implementation. With a wide range of applications in various industries, from telecommunications to aerospace, the EP3C25F256C8NES offers exceptional value, benefits, and advantages to customers looking to enhance their projects with cutting-edge technology. Experience the power of innovation with Intel's EP3C25F256C8NES FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and cost-effectiveness.

Surface Mount: YES

Allows for easy integration onto circuit boards.

Maximum Supply Voltage: 1.25 V

Provides a wide operating range for different applications.

No. of CLBs: 24624

Offers a high level of programmable logic for complex designs.

Package Shape: RECTANGULAR

Helps in efficient use of space on circuit boards.

Form Of Terminal: BALL

Ensures reliable connections in the system.

Nominal Supply Voltage (V): 1.2

Provides stable power input for consistent performance.

No. of Terminals: 256

Offers ample connectivity options for various components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Enables customization for specific applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE

Facilitates compact design and efficient heat dissipation.

Minimum Supply Voltage: 1.15 V

Allows for operation in low-power scenarios.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in varying environmental conditions.

Pitch Of Terminal: 1 mm

Allows for densely populated circuit boards.

Organization: 24624 CLBS

Provides flexibility in design and implementation.

Minimum Operating Temperature: 0 °C

Ensures functionality even in extreme cold conditions.

Finishing Of Terminal Used: TIN SILVER COPPER

Improves conductivity and corrosion resistance.

Position Of Terminal: BOTTOM

Facilitates easy connections in circuit assemblies.

Maximum Seated Height: 1.55 mm

Helps in designing slim and compact devices.

Width: 17 mm

Provides a balance between compact size and component placement.

Maximum Clock Frequency: 472.5 MHz

Allows for fast processing of data in real time.

Length: 17 mm

Contributes to space-saving and efficient board layout.

Technical Specifications

Field Programmable Gate Arrays (FPGA) EP3C25F256C8NES attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of CLBs:

24624

Maximum Clock Frequency:

472.5 MHz

Organization:

24624 CLBS

Power Characteristics

Nominal Supply Voltage:

1.2

Minimum Supply Voltage:

1.15 V

Maximum Supply Voltage:

1.25 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile

Package Code:

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.55 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

R-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

EP3C25F256C8NES Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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