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10CX150YF780I5G

Intel

10CX150YF780I5G by Intel

Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.

Median Price

$298.417

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 294 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$310.608

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Vyrian

USA . 4,670 parts In-Stock

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VNN

France . 3,567 parts In-Stock

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Chip Stock

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AZTECH Wire

Italy . 307 parts In-Stock

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$4.979

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Texas Native Microelectronics

USA . 2,608 parts In-Stock

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$126.996

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$121.916

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$118.106

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$111.756

2,608

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$111.756

Advanced Electronics

New Zealand . 978 parts In-Stock

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$130.313

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$123.797

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$123.797

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Corohmni

South Africa . 128 parts In-Stock

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Microchip USA

USA . 2,166 parts In-Stock

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$218.340

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$217.660

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$217.320

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$216.980

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Ampacity Inc.

Singapore . 48 parts In-Stock

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Semicontronic

India . 7 parts In-Stock

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Vigor

Singapore . 382 parts In-Stock

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Corphita

USA . 220 parts In-Stock

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Continental Prestige Electronics

USA . 4,132 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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MARBEL Systems

Belgium . 3,587 parts In-Stock

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Qasali Group International

UK . 894 parts In-Stock

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Argo Parts USA

USA . 606 parts In-Stock

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Kenton Components

USA . 100 parts In-Stock

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Overview

Unleash the power of innovation with the 10CX150YF780I5G by Intel. This cutting-edge Field Programmable Gate Array (FPGA) offers unparalleled quality and performance, thanks to Intel's reputation as a leading manufacturer in the industry. Perfect for a wide range of applications, this FPGA provides customers with endless possibilities for customization and optimization. Elevate your projects to new heights with the value, benefits, and advantages that only the 10CX150YF780I5G can deliver. Experience the difference today and see why Intel is the go-to choice for top-tier technology solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides a cost-effective and lightweight solution for the package body, making the FPGA easier to handle and less expensive to produce.

No. of Logic Cells: 150000

With a large number of logic cells, this FPGA has a high level of flexibility and can accommodate complex logic functions, making it suitable for a wide range of applications.

Surface Mount: YES

Being surface mountable makes this FPGA easy to integrate into circuit boards, saving space and simplifying the manufacturing process.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage reduces power consumption and heat generation, making this FPGA energy-efficient and reliable under normal operating conditions.

No. of CLBs: 54770

A high number of Configurable Logic Blocks (CLBs) allows for great flexibility in implementing custom logic functions, enabling the FPGA to be used in a wide variety of applications.

Technology Used: TSMC

TSMC is a well-known and reputable semiconductor manufacturing technology, ensuring high quality and reliability in the production of this FPGA.

No. of Inputs: 284

Having a large number of inputs provides versatility in connecting external signals and data to the FPGA, allowing for complex input processing and control logic.

Package Shape: SQUARE

A square package shape is efficient for space utilization on circuit boards, ensuring a compact and tidy layout in electronic designs.

Form Of Terminal: BALL

The ball form of terminal contacts is suitable for high-density and fine-pitch packages, enabling easy and reliable connections during assembly and soldering processes.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage provides a stable operating condition for the FPGA, ensuring consistent performance and longevity in electronic systems.

No. of Terminals: 780

Having a high number of terminals allows for multiple connections and interfacing options, making the FPGA versatile in its integration with other components and circuits.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC type offers flexibility in customizing logic functions and reprogramming the device as needed, making it adaptable to changing project requirements.

Package Style (Meter): GRID ARRAY

The grid array package style provides enhanced mechanical stability and reliability in harsh operating environments, ensuring the durability and longevity of the FPGA.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage allows for operation at reduced power levels without compromising performance, making the FPGA suitable for battery-powered or low-power applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand extreme environmental conditions and maintain reliable performance in industrial settings with elevated temperatures.

Organization: 54770 CLBS

The organization of over 50,000 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and algorithms, offering high functionality and versatility in applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance in cold environments or during startup, making this FPGA suitable for a wide range of operating conditions.

Position Of Terminal: BOTTOM

The terminal positioned at the bottom of the package allows for easy and secure mounting on circuit boards, ensuring stable electrical connections and mechanical integrity in electronic systems.

No. of Outputs: 284

Having a large number of outputs enables the FPGA to drive multiple external devices or components, facilitating complex data processing and control functions in electronic systems.

Grading Of Temperature: INDUSTRIAL

The industrial temperature grading ensures that this FPGA is suitable for use in rugged and demanding applications, offering high reliability and performance in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX150YF780I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

150000

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

54770

Technology:

TSMC

Organization:

54770 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10CX150YF780I5G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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