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10CX105YF672E6G

Intel

10CX105YF672E6G by Intel

The Intel 10CX105YF672E6G is a FPGA with 104,000 logic cells and 38,000 CLBs. It operates at 0.9V nominal voltage and supports up to 236 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

Median Price

$181.380

Lifecycle Status

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DigiKey

USA . 30 parts In-Stock

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Verical

USA . 320 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$181.664

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Vyrian

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 870 parts In-Stock

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$9.436

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Texas Native Microelectronics

USA . 88 parts In-Stock

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$91.741

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$88.875

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Aztec Data Supply Inc.

USA . 3,192 parts In-Stock

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Kenton Components

USA . 2,302 parts In-Stock

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Ampacity Inc.

Singapore . 320 parts In-Stock

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Semicontronic

India . 320 parts In-Stock

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Vigor

Singapore . 127 parts In-Stock

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Advanced Electronics

New Zealand . 325 parts In-Stock

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Continental Prestige Electronics

USA . 5,462 parts In-Stock

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$178.031

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Netroflash

USA . 1,000 parts In-Stock

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Microchip USA

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Corohmni

South Africa . 99 parts In-Stock

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MARBEL Systems

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Argo Parts USA

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Qasali Group International

UK . 187 parts In-Stock

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Corphita

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Overview

Upgrade your technology with the 10CX105YF672E6G by Intel, a high-quality Field Programmable Gate Array designed to enhance performance and efficiency. With over 104,000 logic cells and 38,000 CLBs, this FPGA offers unparalleled flexibility and processing power for a wide range of applications. Whether you're in the automotive, aerospace, or telecommunications industry, this versatile product will elevate your projects to the next level. Trust Intel's reputation for innovation and reliability, and experience the value and benefits that the 10CX105YF672E6G brings to your work.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and cost-effectiveness, making it suitable for various applications.

No. of Logic Cells: 104000

With a large number of logic cells, this FPGA can handle complex digital designs and computations efficiently.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly processes.

Maximum Supply Voltage: 0.93 V

Operating at a maximum supply voltage of 0.93V helps in minimizing power consumption and reducing heat dissipation.

No. of CLBs: 38000

Having 38000 Configurable Logic Blocks (CLBs) provides flexibility in designing custom logic functions and algorithms.

Technology Used: TSMC

Being based on TSMC technology ensures high performance, reliability, and compatibility with industry standards.

No. of Inputs: 236

Having 236 input pins allows for interfacing with a wide range of external devices and peripherals.

Package Shape: SQUARE

Square package shape simplifies layout design and facilitates optimal use of board space.

Form Of Terminal: BALL

Ball terminals provide secure connections, enhanced thermal performance, and reliable electrical contact.

Nominal Supply Voltage (V): 0.9

Operating at a nominal supply voltage of 0.9V ensures stable and consistent performance in various operating conditions.

No. of Terminals: 672

Having 672 terminals allows for comprehensive connectivity options and integration with external components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a Field Programmable Gate Array, this IC offers flexibility, reconfigurability, and rapid prototyping capability for diverse applications.

Package Style (Meter): GRID ARRAY

Grid array package style simplifies soldering, enhances mechanical stability, and supports high-density routing.

Minimum Supply Voltage: 0.87 V

Having a minimum supply voltage of 0.87V allows for efficient power management and optimization in low-power applications.

Maximum Operating Temperature: 100 °C

Operating at a maximum temperature of 100°C ensures reliability and performance in harsh environmental conditions.

Organization: 38000 CLBS

Organized into 38000 Configurable Logic Blocks (CLBs), this FPGA offers scalability, modularity, and ease of design implementation.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable performance in diverse operational environments.

Position Of Terminal: BOTTOM

Bottom terminal positioning facilitates PCB routing, thermal management, and ensures mechanical stability in system integration.

No. of Outputs: 236

Having 236 output pins allows for delivering processed data or signals to external devices, enabling versatile system connectivity.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX105YF672E6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

104000

No. of Inputs:

236

No. of Outputs:

236

No. of CLBs:

38000

Technology:

TSMC

Organization:

38000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX105YF672E6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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