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10CX085YF672E6G

Intel

10CX085YF672E6G by Intel

Intel's 10CX085YF672E6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for applications requiring high-speed processing and complex logic operations in a compact form factor.

Median Price

$161.490

Lifecycle Status

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6

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DigiKey

USA . 102 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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AZTECH Wire

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Ampacity Inc.

Singapore . 843 parts In-Stock

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Semicontronic

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Texas Native Microelectronics

USA . 980 parts In-Stock

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Aranea Global

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Advanced Electronics

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Corohmni

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Continental Prestige Electronics

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Microchip USA

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MARBEL Systems

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Kenton Components

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Qasali Group International

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Argo Parts USA

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Corphita

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Overview

Unlock endless possibilities with the 10CX085YF672E6G by Intel, a cutting-edge Field Programmable Gate Array that boasts 85,000 logic cells and 31,000 CLBs. Crafted with precision and expertise by Intel, this FPGA offers unparalleled performance and flexibility for a wide range of applications. Whether you're diving into AI development, IoT solutions, or high-performance computing, this FPGA delivers exceptional value, reliability, and efficiency to help you bring your innovative ideas to life. Experience the power of Intel technology in every project you tackle with the 10CX085YF672E6G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight packaging option for the FPGA, making it suitable for various applications.

No. of Logic Cells: 85000

Offers a large number of logic cells, allowing for more complex designs and greater functionality in the FPGA.

Surface Mount: YES

Ease of installation and integration onto circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 0.93 V

Efficient power consumption and operation at a relatively low supply voltage.

No. of CLBs: 31000

A high number of Configurable Logic Blocks enables flexibility in design and implementation of various functions.

Technology Used: TSMC

Utilizes a reliable and advanced manufacturing technology from TSMC, ensuring high performance and quality.

No. of Inputs: 216

Sufficient number of input ports for connecting external signals and data to the FPGA.

Package Shape: SQUARE

Compact and space-saving package design, making it suitable for applications with limited space.

Form Of Terminal: BALL

Ball terminals offer reliable electrical connections and facilitate easy soldering during installation.

Nominal Supply Voltage (V): 0.9

Stable and optimal supply voltage for efficient operation and performance of the FPGA.

No. of Terminals: 672

Sufficient number of terminals for connections and interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA is programmable, allowing for customization and reconfiguration of logic functions as needed.

Package Style (Meter): GRID ARRAY

Grid array package style provides a high-density interconnection layout, optimizing signal routing and minimizing footprint.

Minimum Supply Voltage: 0.87 V

Supports operation at low supply voltages, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 100 °C

Wide operating temperature range allows for reliable performance in various environmental conditions.

Organization: 31000 CLBS

Organized into 31000 Configurable Logic Blocks, providing structured logic resources for design implementation.

Minimum Operating Temperature: 0 °C

Operates reliably at low temperatures, suitable for both commercial and industrial applications.

Position Of Terminal: BOTTOM

Bottom positioning of terminals for easy access and connectivity within the system design.

No. of Outputs: 216

Adequate number of output ports for transmitting processed signals and data from the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX085YF672E6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

85000

No. of Inputs:

216

No. of Outputs:

216

No. of CLBs:

31000

Technology:

TSMC

Organization:

31000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX085YF672E6G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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