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10CX220YF780E6G

Intel

10CX220YF780E6G by Intel

Intel's 10CX220YF780E6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it features TSMC technology with 0.93V supply voltage. Ideal for applications requiring high-performance programmable ICs in a grid array package style.

Median Price

$397.800

Lifecycle Status

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9

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Mouser Electronics

USA . 12 parts In-Stock

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DigiKey

USA . 1 parts In-Stock

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$377.927

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Verical

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Digiode

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Nova Conductors

Japan . 40 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

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Chip Stock

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AZTECH Wire

Italy . 659 parts In-Stock

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MARBEL Systems

Belgium . 2,120 parts In-Stock

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Kenton Components

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Corohmni

South Africa . 113 parts In-Stock

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Microchip USA

USA . 1,131 parts In-Stock

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Ampacity Inc.

Singapore . 41 parts In-Stock

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Vigor

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Corphita

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Semicontronic

India . 36 parts In-Stock

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Argo Parts USA

USA . 4,106 parts In-Stock

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$341.835

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Continental Prestige Electronics

USA . 2,869 parts In-Stock

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Texas Native Microelectronics

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Lucentia Tech

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Bastille Electronics

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Perfect Parts

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Qasali Group International

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Overview

Enhance your projects with the cutting-edge technology of Intel's 10CX220YF780E6G FPGA. Designed with 220,000 logic cells and 80,330 CLBs, this versatile device offers unmatched performance and flexibility for a wide range of applications. Whether you're in need of rapid prototyping, signal processing, or high-performance computing, this FPGA delivers the power and efficiency you require. With Intel's reputation for quality and reliability, you can trust that your projects will be in good hands. Elevate your designs and unlock endless possibilities with the Intel 10CX220YF780E6G FPGA today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides durability and protects the internal components of the FPGA.

No. of Logic Cells: 220000

Having a large number of logic cells allows for complex logic functions to be implemented efficiently in the FPGA.

Surface Mount: YES

Surface mount technology enables easy and efficient installation of the FPGA on a PCB, saving valuable space.

Maximum Supply Voltage: 0.93 V

Operating within a maximum supply voltage of 0.93V ensures efficient power consumption and performance of the FPGA.

Technology Used: TSMC

Utilizing TSMC technology ensures high reliability, performance, and compatibility with a wide range of applications.

No. of Inputs: 284

Having a large number of inputs allows for versatile connectivity and input options for various applications.

Package Shape: SQUARE

A square package shape facilitates easier integration and placement of the FPGA on the PCB, optimizing space utilization.

Form Of Terminal: BALL

The ball form of terminals provides reliable and secure connections for the FPGA, enhancing overall functionality and performance.

Nominal Supply Voltage (V): 0.9

Operating at a nominal supply voltage of 0.9V ensures stable and efficient performance of the FPGA.

No. of Terminals: 780

Having a high number of terminals allows for versatile connectivity options and ensures efficient signal transmission within the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for reconfigurability and flexibility in implementing a wide range of logic functions within the FPGA.

Package Style (Meter): GRID ARRAY

A grid array package style provides efficient heat dissipation and mechanical stability, enhancing the overall reliability of the FPGA.

Minimum Supply Voltage: 0.87 V

Operating within a minimum supply voltage of 0.87V ensures stable performance and reliability of the FPGA under various operating conditions.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, the FPGA can withstand challenging thermal environments and maintain performance.

Organization: 80330 CLBS

With 80330 Configurable Logic Blocks (CLBs), the FPGA offers the flexibility to implement a wide range of logic functions and designs.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliable performance of the FPGA even in cold environments.

Position Of Terminal: BOTTOM

Having terminals positioned at the bottom facilitates easier and more secure connections within the PCB layout, enhancing reliability.

No. of Outputs: 284

A high number of outputs allows for versatile connectivity options and efficient signal transmission from the FPGA to external components.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX220YF780E6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

80330

Technology:

TSMC

Organization:

80330 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10CX220YF780E6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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