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10CX220YF780I5G

Intel

10CX220YF780I5G by Intel

Intel's 10CX220YF780I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 284 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package.

Median Price

$433.980

Lifecycle Status

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Mouser Electronics

USA . 2 parts In-Stock

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DigiKey

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Verical

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$384.330

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Nova Conductors

Japan . 750 parts In-Stock

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Vyrian

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Digiode

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Chip Stock

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AZTECH Wire

Italy . 251 parts In-Stock

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Texas Native Microelectronics

USA . 2,970 parts In-Stock

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$104.864

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$99.226

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Advanced Electronics

New Zealand . 654 parts In-Stock

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Corohmni

South Africa . 153 parts In-Stock

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Ampacity Inc.

Singapore . 144 parts In-Stock

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Semicontronic

India . 144 parts In-Stock

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Vigor

Singapore . 966 parts In-Stock

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Continental Prestige Electronics

USA . 4,746 parts In-Stock

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Argo Parts USA

USA . 2,706 parts In-Stock

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Netroflash

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Microchip USA

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MARBEL Systems

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Qasali Group International

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Corphita

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Kenton Components

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Perfect Parts

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Overview

Unlock limitless possibilities with the Intel 10CX220YF780I5G Field Programmable Gate Array. Manufactured by industry leader Intel, this FPGA offers unparalleled quality and reliability for a wide range of applications. From aerospace to telecommunications, this versatile technology empowers you to create innovative solutions tailored to your specific needs. With a high number of logic cells and inputs, along with industrial-grade temperature grading, the Intel 10CX220YF780I5G delivers exceptional value and performance, making it the ideal choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides good durability and protection for the internal components of the FPGA.

No. of Logic Cells: 220000

Having a high number of logic cells allows for complex designs and calculations to be implemented on this FPGA.

Surface Mount: YES

The surface mount capability makes it easier to integrate this FPGA onto circuit boards, saving space and making assembly more convenient.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA more energy efficient.

No. of CLBs: 80330

The high number of Configurable Logic Blocks (CLBs) allows for a high degree of flexibility and customization in logic design.

Technology Used: TSMC

Utilizing technology from TSMC ensures high quality and reliability in the manufacturing process of this FPGA.

No. of Inputs: 284

With a large number of inputs, this FPGA can handle a wide variety of data inputs and signals for processing.

Package Shape: SQUARE

The square package shape is compact and efficient for fitting into circuit designs without wasted space.

Form Of Terminal: BALL

The use of ball terminals allows for easy and secure connections during installation and integration of the FPGA.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9V is optimal for the performance and reliability of this FPGA.

No. of Terminals: 780

With a high number of terminals, this FPGA offers plenty of connection options for external devices and components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product allows for reprogramming and customization of logic functions as needed, offering great flexibility.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure and stable mounting option for the FPGA on circuit boards, ensuring reliability in operation.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage allows for stable operation even under low power conditions, making this FPGA versatile in various applications.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand harsh environmental conditions and continue to perform reliably.

Organization: 80330 CLBS

The organization of 80330 Configurable Logic Blocks provides extensive logic capacity for complex designs and computations on this FPGA.

Minimum Operating Temperature: -40 °C

The wide range of temperatures this FPGA can operate in makes it suitable for a variety of industrial applications where temperature fluctuations are common.

Position Of Terminal: BOTTOM

The terminal position at the bottom of the package allows for easier connection and integration of the FPGA into circuit designs.

No. of Outputs: 284

With a high number of outputs, this FPGA can provide a wide range of processed data and signals to external devices and components.

Grading Of Temperature: INDUSTRIAL

The FPGA is graded for industrial temperature ranges, ensuring reliability and performance in demanding industrial environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX220YF780I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

80330

Technology:

TSMC

Organization:

80330 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10CX220YF780I5G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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