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10CX105YF780I6G

Intel

10CX105YF780I6G by Intel

Intel's 10CX105YF780I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Utilizes TSMC technology with 0.93V max supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

Median Price

$227.690

Lifecycle Status

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6

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DigiKey

USA . 233 parts In-Stock

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$227.690

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Digiode

USA . 372 parts In-Stock

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$183.778

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Nova Conductors

Japan . 20 parts In-Stock

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VNN

France . 31,966 parts In-Stock

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Vyrian

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Chip Stock

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AZTECH Wire

Italy . 652 parts In-Stock

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Aztec Data Supply Inc.

USA . 39,309 parts In-Stock

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MARBEL Systems

Belgium . 934 parts In-Stock

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Texas Native Microelectronics

USA . 189 parts In-Stock

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$91.404

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Corohmni

South Africa . 213 parts In-Stock

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Kenton Components

USA . 2,564 parts In-Stock

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Ampacity Inc.

Singapore . 302 parts In-Stock

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Vigor

Singapore . 353 parts In-Stock

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Corphita

USA . 124 parts In-Stock

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Continental Prestige Electronics

USA . 6,926 parts In-Stock

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Advanced Electronics

New Zealand . 78 parts In-Stock

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Microchip USA

USA . 3,272 parts In-Stock

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Argo Parts USA

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Qasali Group International

UK . 188 parts In-Stock

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Overview

Discover the power of innovation with the 10CX105YF780I6G FPGA by Intel. Designed with cutting-edge technology and crafted from high-quality materials, this FPGA offers unmatched performance and reliability. Whether you're in the automotive, aerospace, or telecommunications industry, this versatile product is sure to meet your needs. Unlock endless possibilities and accelerate your projects with Intel's top-of-the-line FPGA. Elevate your business to new heights with the 10CX105YF780I6G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the FPGA, ensuring it can withstand various environmental conditions.

No. of Logic Cells: 104000

Large number of logic cells allows for complex designs and high-performance processing capabilities.

Surface Mount: YES

Surface mount capability makes installation and integration of the FPGA easier and more efficient.

Maximum Supply Voltage: 0.93 V

Low maximum supply voltage helps in reducing power consumption and heat generation, making the FPGA more energy-efficient.

No. of CLBs: 38000

High number of Configurable Logic Blocks (CLBs) provides flexibility and scalability for designing custom logic circuits.

Technology Used: TSMC

Use of TSMC technology ensures high quality and reliability of the FPGA.

No. of Inputs: 284

Ample number of inputs allows for extensive connectivity and ability to interface with various external devices.

Package Shape: SQUARE

Square package shape facilitates easy integration and placement within a circuit board layout.

Form Of Terminal: BALL

Ball terminals enable secure connections and efficient heat dissipation for the FPGA.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage ensures consistent performance of the FPGA.

No. of Terminals: 780

Sufficient number of terminals provide connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device allows for flexibility in configuring and customizing the FPGA for specific applications.

Package Style (Meter): GRID ARRAY

Grid array package style offers a compact and efficient layout for the FPGA, saving space on the circuit board.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage supports reliable operation and power efficiency.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range makes the FPGA suitable for industrial applications with demanding environmental conditions.

Organization: 38000 CLBS

Well-organized 38000 Configurable Logic Blocks (CLBs) provide a structured framework for designing complex logic circuits.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range ensures the FPGA can function effectively in various temperature environments.

Position Of Terminal: BOTTOM

Bottom-positioned terminals facilitate easier connections and routing of signals within the circuit board.

No. of Outputs: 284

Abundance of outputs enables the FPGA to drive multiple devices and interface with various components.

Grading Of Temperature: INDUSTRIAL

Designed for industrial-grade temperature ranges, ensuring reliable operation in harsh conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX105YF780I6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

104000

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

38000

Technology:

TSMC

Organization:

38000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10CX105YF780I6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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