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10M08SAM153I7G

Intel

10M08SAM153I7G by Intel

Intel 10M08SAM153I7G FPGA features 8000 logic cells, 500 CLBs, and 250 inputs/outputs. With a supply voltage range of 2.85V to 3.15V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with bottom terminals.

Median Price

$48.830

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Arrow

USA . 91 parts In-Stock

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$41.490

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$32.360

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$31.110

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$31.110

DigiKey

USA . 23 parts In-Stock

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Verical

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Nova Conductors

Japan . 37 parts In-Stock

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Digiode

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Vyrian

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Chip Stock

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VNN

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ComSIT Distribution GmbH

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AZTECH Wire

Italy . 488 parts In-Stock

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$14.098

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MARBEL Systems

Belgium . 4,224 parts In-Stock

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Aztec Data Supply Inc.

USA . 10 parts In-Stock

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Corohmni

South Africa . 258 parts In-Stock

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$31.666

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Ampacity Inc.

Singapore . 297 parts In-Stock

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$35.270

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One Stop Electronics

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Semicontronic

India . 182 parts In-Stock

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Continental Prestige Electronics

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Texas Native Microelectronics

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Corphita

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Kenton Components

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Microchip USA

USA . 2,513 parts In-Stock

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Qasali Group International

UK . 1,674 parts In-Stock

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Modulus Dynamics

Lithuania . 689 parts In-Stock

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Vigor

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Lixinc

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QUARKTWIN TECHNOLOGY LTD

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Alle Elektronik GmbH

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A-Z Elektronik GmbH

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Supply Digital

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Lucentia Tech

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GreenTree Electronics

Israel . 1,800 parts In-Stock

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Argo Parts USA

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Futuretech Components

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Perfect Parts

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Glotronic Ltd.

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Overview

Unlock limitless possibilities with the Intel 10M08SAM153I7G Field Programmable Gate Array (FPGA). Manufactured by industry giant Intel, this FPGA boasts 8000 logic cells and 500 CLBs, making it ideal for a wide range of applications. With surface mount technology and a maximum supply voltage of 3.15V, this versatile device offers unparalleled performance and reliability. Whether you're designing cutting-edge electronics or optimizing industrial processes, the Intel 10M08SAM153I7G delivers the flexibility and power you need to bring your ideas to life. Elevate your projects to new heights with Intel's top-tier FPGA technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA, ensuring reliability in various operating environments.

No. of Logic Cells: 8000

Offers high logic density and flexibility for implementing complex designs and functions.

Surface Mount: YES

Enables easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.15 V

Supports a wide range of voltage inputs for compatibility with different power sources.

No. of CLBs: 500

Provides ample resources for implementing logic functions and routing signals efficiently.

No. of Inputs: 250

Allows for a high number of input signals to be processed and controlled by the FPGA.

Package Shape: SQUARE

Facilitates easy integration into circuit layouts and designs, optimizing space utilization.

Form Of Terminal: BALL

Enables secure and reliable connections on the PCB, maintaining signal integrity and performance.

Nominal Supply Voltage (V): 3

Indicates the standard operating voltage for the FPGA, ensuring stability and compatibility with other components.

No. of Terminals: 153

Provides sufficient connections for input and output signals, supporting versatile design configurations.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for flexible configuration and customization of logic functions and operations according to specific application requirements.

Package Style (Meter): GRID ARRAY

Facilitates precise alignment and positioning during assembly, ensuring proper connections and functionality.

Minimum Supply Voltage: 2.85 V

Allows for operation at lower voltage levels, conserving power and reducing energy consumption.

Maximum Operating Temperature: 100 °C

Ensures reliable performance under high temperature conditions, making it suitable for industrial applications.

Pitch Of Terminal: 0.5 mm

Provides fine pitch spacing for compact design layouts, enabling high-density PCB integration.

Organization: 500 CLBS

Organizes logic resources into configurable logic blocks, simplifying design implementation and optimization.

Minimum Operating Temperature: -40 °C

Maintains functionality even in extreme cold environments, expanding the range of operating conditions.

Position Of Terminal: BOTTOM

Facilitates component placement and soldering during PCB assembly, enhancing manufacturing efficiency.

Moisture Sensitivity Level (MSL): 3

Indicates the level of protection against moisture damage, ensuring reliability in humid or damp environments.

Maximum Seated Height: 1 mm

Allows for low-profile PCB designs, reducing overall system height and saving space in compact applications.

Width: 8 mm

Compact width dimension for easy integration into different circuit board layouts and configurations.

No. of Outputs: 250

Supports a high number of output signals for controlling external devices and communicating with other components.

Length: 8 mm

Compact length dimension for efficient placement on PCBs, optimizing space utilization.

Grading Of Temperature: INDUSTRIAL

Designed to withstand harsh industrial environments with wide temperature ranges, ensuring reliable operation in rugged conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10M08SAM153I7G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

8000

No. of Inputs:

250

No. of Outputs:

250

No. of CLBs:

500

Organization:

500 CLBS

Additional Features:

Also Operates at 3.3 V nominal supply

Power Characteristics

Nominal Supply Voltage:

3

Minimum Supply Voltage:

2.85 V

Maximum Supply Voltage:

3.15 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

8 mm

Width:

8 mm

Maximum Seated Height:

1 mm

Package Equivalence Code:

BGA153,15X15,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

153

Standards

JESD-30 Code:

S-PBGA-B153

Trade Compliance

10M08SAM153I7G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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