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10CX085YF672I5G

Intel

10CX085YF672I5G by Intel

Intel's 10CX085YF672I5G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications requiring high performance with a wide operating temperature range from -40 to 100 °C.

Median Price

$171.267

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Digiode

USA . 289 parts In-Stock

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Nova Conductors

Japan . 44 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 310 parts In-Stock

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Texas Native Microelectronics

USA . 200 parts In-Stock

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$126.815

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$122.852

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$116.247

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Vigor

Singapore . 228 parts In-Stock

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Ampacity Inc.

Singapore . 73 parts In-Stock

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Semicontronic

India . 73 parts In-Stock

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Corphita

USA . 223 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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Continental Prestige Electronics

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Netroflash

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Microchip USA

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Qasali Group International

UK . 3,910 parts In-Stock

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MARBEL Systems

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Argo Parts USA

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Kenton Components

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Overview

Unlock limitless possibilities with the 10CX085YF672I5G by Intel. Crafted with precision and expertise, this Field Programmable Gate Array (FPGA) offers unparalleled quality and reliability. Whether you're in the realm of aerospace, telecommunications, or automotive industries, this product provides unmatched flexibility and performance. With 85000 logic cells and 31000 CLBs, it empowers you to create cutting-edge solutions tailored to your needs. Experience seamless integration, exceptional value, and endless advantages with the Intel 10CX085YF672I5G. Elevate your projects to new heights today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage during installation or operation.

No. of Logic Cells: 85000

With a large number of logic cells, this FPGA offers high complexity and flexibility for designing complex digital circuits.

Surface Mount: YES

Being surface mountable, this FPGA can be easily integrated onto circuit boards, saving space and simplifying assembly.

Maximum Supply Voltage: 0.93 V

The low maximum supply voltage helps in reducing power consumption and increasing energy efficiency.

No. of CLBs: 31000

With a large number of Configurable Logic Blocks (CLBs), this FPGA provides ample resources for implementing custom logic functions.

Technology Used: TSMC

TSMC is a reputable semiconductor manufacturing technology, ensuring high quality and reliability of the FPGA.

No. of Inputs: 216

Having a sufficient number of inputs allows for versatile connectivity and input/output configurations in the FPGA design.

Package Shape: SQUARE

The square package shape enables easy handling and placement of the FPGA on circuit boards or mounting surfaces.

Form Of Terminal: BALL

The ball form of terminals simplifies soldering and connection of the FPGA to the PCB, ensuring secure and reliable electrical connections.

Nominal Supply Voltage (V): 0.9

The low nominal supply voltage contributes to energy efficiency and reduced power consumption in the FPGA operation.

No. of Terminals: 672

With a high number of terminals, this FPGA offers versatile connectivity options for interfacing with other components in the system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

The FPGA's programmable nature allows for flexible and customizable logic functionality, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides a compact and efficient layout of terminals, optimizing space utilization on the circuit board.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage ensures reliable operation of the FPGA even under low voltage conditions, enhancing system robustness.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature allows the FPGA to withstand harsh environmental conditions and ensures dependable performance in various applications.

Organization: 31000 CLBS

The organization of 31000 Configurable Logic Blocks (CLBs) provides ample resources for implementing complex logic functions and algorithms in the FPGA design.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the FPGA to operate reliably in cold environments, making it suitable for a wide range of applications.

Position Of Terminal: BOTTOM

The bottom position of terminals facilitates easy and convenient PCB mounting and connection of the FPGA within the system.

No. of Outputs: 216

Having a sufficient number of outputs enables versatile signal routing and output configurations in the FPGA design.

Grading Of Temperature: INDUSTRIAL

With industrial-grade temperature grading, this FPGA is designed to operate reliably in a wide range of temperature conditions, ensuring robust performance in industrial applications.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX085YF672I5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

85000

No. of Inputs:

216

No. of Outputs:

216

No. of CLBs:

31000

Technology:

TSMC

Organization:

31000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX085YF672I5G Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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