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10CX220YF780I6G

Intel

10CX220YF780I6G by Intel

Intel's 10CX220YF780I6G FPGA boasts 220,000 logic cells and 80,330 CLBs. Utilizes TSMC technology with 0.9V nominal voltage. Ideal for industrial applications requiring high logic cell count and temperature tolerance up to 100°C.

Median Price

$437.600

Lifecycle Status

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8

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Mouser Electronics

USA . 20 parts In-Stock

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$397.820

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DigiKey

USA . 31 parts In-Stock

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$437.600

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Verical

USA . 26 parts In-Stock

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$762.290

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Nova Conductors

Japan . 50 parts In-Stock

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$395.584

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Vyrian

USA . 3,122 parts In-Stock

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VNN

France . 2,438 parts In-Stock

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 296 parts In-Stock

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$9.206

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Aztec Data Supply Inc.

USA . 4,674 parts In-Stock

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$127.280

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Texas Native Microelectronics

USA . 11,153 parts In-Stock

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$155.877

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Kenton Components

USA . 1,328 parts In-Stock

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$187.052

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$179.570

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$173.959

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$164.606

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$164.606

Vigor

Singapore . 321 parts In-Stock

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$321.110

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Continental Prestige Electronics

USA . 5,890 parts In-Stock

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$395.584

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$387.672

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Argo Parts USA

USA . 144 parts In-Stock

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$391.628

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$387.672

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$383.716

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Netroflash

USA . 100 parts In-Stock

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Corohmni

South Africa . 216 parts In-Stock

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Microchip USA

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Qasali Group International

UK . 413 parts In-Stock

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$391.407

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Ampacity Inc.

Singapore . 26 parts In-Stock

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$647.950

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Semicontronic

India . 26 parts In-Stock

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$647.950

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$631.751

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MARBEL Systems

Belgium . 4,538 parts In-Stock

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Corphita

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Overview

Unlock endless possibilities with the Intel 10CX220YF780I6G FPGA, a powerful technology crafted with precision by Intel. This versatile device allows for customizable logic and high-performance computing, perfect for a wide range of applications in industries like aerospace, automotive, and telecommunications. With its advanced features and innovative design, the Intel FPGA offers unmatched value and benefits to customers seeking reliable, efficient solutions. Elevate your projects to new heights with the Intel 10CX220YF780I6G FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides strong and durable packaging for the FPGA, ensuring long-term reliability and protection against external elements.

No. of Logic Cells: 220000

Large number of logic cells allow for complex designs and high functionality in the FPGA, making it suitable for a wide range of applications.

Surface Mount: YES

Allows for easy installation on PCBs, making it convenient for manufacturers to integrate the FPGA into their systems.

Maximum Supply Voltage: 0.93 V

Efficient power consumption at a low maximum supply voltage, making it energy-efficient and suitable for portable devices.

Technology Used: TSMC

Utilizes advanced technology from TSMC for high performance and reliability in the FPGA design.

No. of Inputs: 284

Sufficient number of inputs for versatile connectivity and data processing capabilities in the FPGA.

Package Shape: SQUARE

Compact square shape for efficient use of space on PCBs and easy integration into electronic systems.

Form Of Terminal: BALL

Ball terminals provide secure connections and reliable contact points for external devices and components.

Nominal Supply Voltage (V): 0.9

Stable nominal supply voltage for consistent performance and reliability in various operating conditions.

No. of Terminals: 780

Sufficient number of terminals for connecting external devices and components, enhancing the versatility of the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable device allows for flexibility in design implementation and customization according to specific application requirements.

Package Style (Meter): GRID ARRAY

Grid array package style for efficient routing of signals and high-density integration on PCBs, optimizing the overall performance of the FPGA.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage enables operation in low-power scenarios while maintaining functionality and performance of the FPGA.

Maximum Operating Temperature: 100 °C

High maximum operating temperature range for reliable performance in various environmental conditions, suitable for industrial applications.

Organization: 80330 CLBS

Organized structure with a large number of CLBs for efficient design implementation and high-performance capabilities in the FPGA.

Minimum Operating Temperature: -40 °C

Wide minimum operating temperature range for reliable operation in extreme cold conditions, making it suitable for a variety of outdoor applications.

Position Of Terminal: BOTTOM

Bottom positioning of terminals for easy PCB layout and secure connections, simplifying the integration of the FPGA into electronic systems.

No. of Outputs: 284

Sufficient number of outputs for versatile data transmission and communication capabilities in the FPGA design.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading for reliable performance in harsh operating environments, ensuring long-term durability and stability of the FPGA.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX220YF780I6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

220000

No. of Inputs:

284

No. of Outputs:

284

No. of CLBs:

80330

Technology:

TSMC

Organization:

80330 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

780

Standards

JESD-30 Code:

S-PBGA-B780

Trade Compliance

10CX220YF780I6G Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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