Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Intel's 10CX105YF780E6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temperature of 100°C, it features TSMC technology and is ideal for applications requiring high-speed data processing and complex algorithm implementations. With 284 inputs/outputs, this square-shaped grid array package supports various digital design projects.
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Authorized Procurement Solutions
Argo Parts USA
Futuretech Components
Glotronic Ltd.
Plastic/epoxy material provides durability and allows for cost-effective manufacturing, making this product a good choice for affordable solutions.
High number of logic cells allows for complex logic implementation, making this FPGA suitable for advanced applications.
Surface mount technology enables easy integration onto printed circuit boards, saving space and simplifying assembly processes.
Operating at a maximum supply voltage of 0.93V helps in reducing power consumption and heat dissipation, making it energy-efficient.
Large number of Configurable Logic Blocks (CLBs) offers flexibility in designing various logic functions, catering to a wide range of applications.
Utilizing TSMC technology ensures high performance and reliability, making this FPGA a dependable solution for demanding tasks.
Having a high number of inputs allows for versatile connectivity options, enhancing the flexibility and functionality of the FPGA.
Square package shape facilitates efficient layout and placement on PCBs, optimizing the use of available space and improving signal integrity.
Ball terminals enable reliable connections and facilitate easy rework, making this FPGA convenient for manufacturing and maintenance processes.
Operating at a nominal supply voltage of 0.9V ensures stable performance and compatibility with standard power sources, simplifying system integration.
Having a high number of terminals provides ample connectivity options, supporting complex designs and facilitating the interfacing with external components.
Being a Field Programmable Gate Array (FPGA) offers reconfigurability and flexibility, allowing for customization and adaptation to changing requirements.
Utilizing a grid array package style ensures efficient thermal dissipation and robust mechanical support, enhancing the reliability and performance of the FPGA.
Operating at a minimum supply voltage of 0.87V enables low-power operation and extends battery life, making this FPGA suitable for portable and energy-efficient devices.
With a maximum operating temperature of 100°C, this FPGA can withstand harsh environmental conditions and high-performance applications, ensuring reliable operation under stress.
Organized into 38000 Configurable Logic Blocks (CLBs), this FPGA provides a structured architecture for implementing complex logic functions efficiently, supporting diverse applications.
Operating at a minimum temperature of 0°C allows for reliable performance in cold environments, making this FPGA suitable for a wide range of operating conditions.
Having terminals at the bottom facilitates easy PCB layout and routing, simplifying the design process and ensuring proper signal integrity.
A high number of outputs enables the FPGA to drive multiple external devices, supporting complex system designs and enhancing the versatility of the product.
Field Programmable Gate Arrays (FPGA) 10CX105YF780E6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel
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10CX105YF780E6G Programmable ICs trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
PCN Design/Specification - Arria/Cyclone 10 Software Chg 3/Jun/2021 Mult Dev Des/Errata Chgs 16/Aug/2022
PCN Packaging - Mult Dev Label CHG 24/Jan/2020 Mult Dev Label Chgs 24/Feb/2020
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
2N2222A
Micro Commercial Components
Small Signal Bipolar Transistors; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-609 Code: e0;
LL4148
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
Vishay Intertechnology
Vishay Intertechnology's SMBJ18CA is a bidirectional TRANS VOLTAGE SUPPRESSOR DIODE with a max clamping voltage of 29.2 V and a breakdown voltage of 21.05 V. It is surface mountable and commonly used in transient suppression applications.
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
FDN5618P
Onsemi
FDN5618P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage. It features a single configuration with built-in diode, suitable for switching applications. With 10A IDM and 0.17 ohm RDS(on), it operates in the temperature range of -55 to 150 °C, making it ideal for various electronic devices.
1N4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
2N7002
Panjit International
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Maximum Time At Peak Reflow Temperature (s): 40; Minimum DS Breakdown Voltage: 60 V;
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
1N4148WS
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV303N
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
AMS1117-3.3
Advanced Monolithic Systems
AMS1117-3.3 by Advanced Monolithic Systems is a fixed positive single output LDO regulator with 1A max output current, 3% voltage tolerance, and 1.3V dropout voltage. Ideal for applications requiring stable 3.3V supply in compact designs due to its small outline package and excellent load regulation of 0.025%.
EP3C10F256C8N
Altera
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: RECTANGULAR;
EP4CE40F23C6N
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 484; Package Code: BGA; Package Shape: SQUARE;
XC7A12T-2CPG238I
Xilinx
Xilinx XC7A12T-2CPG238I FPGA features 12800 logic cells, 1000 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with low profile grid array style.
LFD2NX-40-7BG196I
Lattice Semiconductor
LFD2NX-40-7BG196I by Lattice Semiconductor is a 39000 logic cell FPGA with FDSOI technology. It operates b/w -40 to 100 °C, has 92 inputs/outputs, and uses plastic/epoxy package material. Ideal for industrial applications requiring high-performance programmable ICs in compact square form factor.
XC7A50T-2FTG256I
Xilinx XC7A50T-2FTG256I FPGA features 52160 logic cells, 4075 CLBs, and a max clock frequency of 1286 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact grid array package with low profile design.
XCAU20P-1SFVB784I
Xilinx XCAU20P-1SFVB784I FPGA offers 238437 logic cells, 13625 CLBs, and 228 inputs/outputs. Ideal for applications requiring high-performance computing with a max operating temperature of 100°C. Package style: Grid Array, Fine Pitch.
A3P1000-FGG144I
Actel
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 144; Package Code: LBGA; Package Shape: SQUARE;
LFE5U-25F-7BG256I
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Finishing Of Terminal Used: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
XC7S25-1CSGA324Q
XC7S25-1CSGA324Q by Xilinx is a PLASTIC/EPOXY FPGA with 23360 logic cells, 1825 CLBs, and a max clock frequency of 1098 MHz. It is commonly used in automotive applications due to its AUTOMOTIVE temperature grading.
LFE5UM-85F-8BG554C
FIELD PROGRAMMABLE GATE ARRAY; JESD-609 Code: e1; Finishing Of Terminal Used: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 30; Peak Reflow Temperature (C): 260;
10M25SAE144I7G
Intel 10M25SAE144I7G is a 25000 logic cells FPGA with 1563 CLBs and 360 inputs/outputs. Operating at -40 to 100 °C, it's ideal for industrial applications requiring high-speed data processing in compact form factors. The package features a square shape, gull wing terminals, and low profile design for surface mount assembly.
XC7A35T-3FTG256E
Xilinx XC7A35T-3FTG256E is a FPGA with 33280 logic cells, 2600 CLBs, and max clock frequency of 1412 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
ICE40UP5K-UWG30ITR1K
FIELD PROGRAMMABLE GATE ARRAY; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260;
EP3C10E144C8N
The EP3C10E144C8N by Altera is a CMOS-based FPGA with 10320 logic cells, 94 inputs and outputs, and a maximum clock frequency of 472.5 MHz. It is commonly used for applications requiring field programmable gate arrays.
10M04DCU324I7G
Intel's 10M04DCU324I7G FPGA features 4000 logic cells, 250 CLBs, and 246 inputs/outputs. With a max supply voltage of 1.25V, it is ideal for industrial applications requiring high-performance programmable ICs in a compact square package with 0.8mm terminal pitch.
10M25SAE144C8GES
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: GULL WING; No. of Terminals: 144; Package Code: LFQFP; Package Shape: SQUARE;
LCMXO3LF-4300E-5MG256C
LCMXO3LF-4300E-5MG256C by Lattice Semiconductor is a 540 CLB FPGA with max supply voltage of 1.26V, suitable for applications requiring high performance in a compact form factor. With a package style of GRID ARRAY and very thin profile, it operates b/w 0 to 85°C temperatures, making it ideal for various industrial and consumer electronics projects.
M1A3P250-VQG100I
Microsemi
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: GULL WING; No. of Terminals: 100; Package Code: TFQFP; Package Shape: SQUARE;
XC7A12T-1CSG325C
The Xilinx XC7A12T-1CSG325C is a FPGA with 12800 logic cells, 1000 CLBs, and max clock frequency of 1098 MHz. It is used in applications requiring high-speed processing and programmable ICs for various electronic systems.
EP2C20F256C8N
EP2C20F256C8N by Intel is a FPGA with 18752 logic cells, 1172 CLBs, and 152 inputs. It operates at a max clock frequency of 402.5 MHz and is suitable for applications requiring high-speed processing and programmable ICs in various industries. With a package style of grid array and low profile, it offers versatility in design while maintaining a compact form factor.
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10CX150YF672E5G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
10CX150YF672E6G
Intel's 10CX150YF672E6G FPGA boasts 150,000 logic cells and 54,770 CLBs. Operating b/w 0-100°C with a supply voltage range of 0.87-0.93V, it offers 236 inputs/outputs for various applications requiring high-performance programmable ICs in a square grid array package.
10CX150YF780I5G
Intel's 10CX150YF780I5G FPGA boasts 150,000 logic cells and 54770 CLBs. Operating at -40 to 100 °C, it has 284 inputs/outputs for industrial applications. Utilizes TSMC tech with 0.87-0.93 V supply voltage range in a grid array package.
10CX150YF780E5G
The Intel 10CX150YF780E5G is a FPGA with 150,000 logic cells and 54,770 CLBs. It operates at 0.9V nominal voltage and can handle up to 284 inputs/outputs. Ideal for applications requiring high-performance programmable ICs in a grid array package style.
10CX220YF780I5G
Intel's 10CX220YF780I5G FPGA boasts 220,000 logic cells and 80,330 CLBs. Operating at a max temp of 100°C, it has 284 inputs/outputs and uses TSMC technology. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package.
10CX150YU484E5G
Intel's 10CX150YU484E5G FPGA boasts 150,000 logic cells and 54770 CLBs, utilizing TSMC technology. With 188 inputs/outputs, it operates at 0.87-0.93V and up to 100°C. Ideal for applications requiring high-performance programmable ICs in a grid array package.
10CX105YF672I6G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 672; Package Code: BGA; Package Shape: SQUARE;
10CX085YF672I5G
10CX105YF672I5G
10CX085YF672E6G
10CX220YF780E5G
The Intel 10CX220YF780E5G is a FPGA with 220,000 logic cells and 80,330 CLBs. It uses TSMC technology and operates b/w -40 to 100 °C. Ideal for applications requiring high-speed processing and programmable ICs in industrial automation and telecommunications sectors.
10CX220YF780E6G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: OTHER; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
10CX220YU484E5G
10CX105YF672E6G
10CX105YU484I6G
Intel's 10CX105YU484I6G FPGA boasts 104,000 logic cells and TSMC technology. With 38,000 CLBs and 188 inputs/outputs, it operates in industrial settings with a temperature range of -40 to 100°C. Ideal for applications requiring high-performance programmable ICs in grid array packaging.
10CX105YF672E5G
10CX220YF780I6G
FIELD PROGRAMMABLE GATE ARRAY; Grading Of Temperature: INDUSTRIAL; Form Of Terminal: BALL; No. of Terminals: 780; Package Code: BGA; Package Shape: SQUARE;
10CX105YF780I6G
10CX085YU484I6G
Intel's 10CX085YU484I6G FPGA boasts 85000 logic cells, TSMC technology, and 31000 CLBs. Ideal for industrial applications with -40 to 100 °C operating temp range, it features 188 inputs/outputs and a grid array package style.
10CX105YF780E5G
Supply Digital Components
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