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10CX105YF672I6G

Intel

10CX105YF672I6G by Intel

Intel's 10CX105YF672I6G FPGA boasts 104,000 logic cells and 38,000 CLBs. Operating at a max temp of 100°C, it uses TSMC technology with 0.93V supply voltage. Ideal for industrial applications requiring high-performance programmable ICs in a grid array package style.

Median Price

$177.990

Lifecycle Status

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Verical

USA . 40 parts In-Stock

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$177.990

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Nova Conductors

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Vyrian

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Digiode

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Chip Stock

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VNN

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AZTECH Wire

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Corohmni

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Ampacity Inc.

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Semicontronic

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Vigor

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Texas Native Microelectronics

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Kenton Components

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Aranea Global

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Continental Prestige Electronics

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Microchip USA

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Qasali Group International

UK . 40 parts In-Stock

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Argo Parts USA

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Corphita

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MARBEL Systems

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Overview

Unleash the power of innovation with Intel's 10CX105YF672I6G Field Programmable Gate Array. Boasting 104,000 logic cells and TSMC technology, this FPGA is the key to unlocking limitless possibilities in a variety of applications. From automotive to industrial automation, this versatile device offers unparalleled performance and reliability. Experience the ultimate in customizable solutions and stay ahead of the competition with Intel at your side. Upgrade your projects today and discover the true value of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a robust and cost-effective packaging solution for the FPGA, ensuring durability and reliability.

No. of Logic Cells: 104000

Offers a high number of logic cells for complex programmable logic designs and applications.

Surface Mount: YES

Ease of assembly and compatibility with surface mounting technology.

Maximum Supply Voltage: 0.93 V

Efficient power consumption and operation within specified voltage limits.

No. of CLBs: 38000

Large number of Configurable Logic Blocks for versatile and customizable logic implementation.

Technology Used: TSMC

Utilization of advanced TSMC technology for high performance and reliability.

No. of Inputs: 236

Sufficient number of input channels for versatile input configurations.

Package Shape: SQUARE

Square shape allows for efficient use of PCB space and easy integration with other components.

Form Of Terminal: BALL

Ball terminals offer good electrical performance and reliability in a grid array package style.

Nominal Supply Voltage (V): 0.9

Stable supply voltage for consistent and reliable FPGA operation.

No. of Terminals: 672

Sufficient number of terminals for versatile connections and integration within a system.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility and reconfigurability of FPGA design for custom logic functions and applications.

Package Style (Meter): GRID ARRAY

Grid array package style enables secure mounting and reliable electrical connections.

Minimum Supply Voltage: 0.87 V

Low minimum supply voltage for efficient power management and extended battery life.

Maximum Operating Temperature: 100 °C

Wide operating temperature range suitable for industrial applications and environments.

Organization: 38000 CLBS

Organized structure of Configurable Logic Blocks for efficient logic implementation and routing.

Minimum Operating Temperature: -40 °C

Operational reliability in low temperature environments for extended application flexibility.

Position Of Terminal: BOTTOM

Bottom position of terminals for secure mounting and efficient signal routing on the PCB.

No. of Outputs: 236

Sufficient number of output channels for versatile output configurations and signal processing.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature rating for robust and reliable performance in demanding environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX105YF672I6G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

104000

No. of Inputs:

236

No. of Outputs:

236

No. of CLBs:

38000

Technology:

TSMC

Organization:

38000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX105YF672I6G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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