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10CX105YF672E5G

Intel

10CX105YF672E5G by Intel

Intel's 10CX105YF672E5G FPGA boasts 104K logic cells, TSMC technology, and 38000 CLBs. Ideal for applications requiring high-speed processing and low power consumption in a compact form factor. Supports various input/output configurations with a max supply voltage of 0.93V and operating temperature up to 100°C.

Median Price

$208.922

Lifecycle Status

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5

In-Stock Inventory

1k+

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Nova Conductors

Japan . 50 parts In-Stock

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Vyrian

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Chip Stock

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Digiode

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AZTECH Wire

Italy . 644 parts In-Stock

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Semicontronic

India . 933 parts In-Stock

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Ampacity Inc.

Singapore . 676 parts In-Stock

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Corohmni

South Africa . 302 parts In-Stock

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Texas Native Microelectronics

USA . 4,185 parts In-Stock

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$109.087

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Continental Prestige Electronics

USA . 3,789 parts In-Stock

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Microchip USA

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Authorized Procurement Solutions

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Qasali Group International

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Kenton Components

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Argo Parts USA

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MARBEL Systems

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Netroflash

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Corphita

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Vigor

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Overview

Unleash the power of innovation with the 10CX105YF672E5G by Intel. Harnessing the cutting-edge technology of Field Programmable Gate Arrays (FPGA), this product offers unparalleled versatility and performance for a wide range of applications. With 104,000 logic cells and 38,000 CLBs, it provides the perfect solution for your complex design needs. Intel's reputation for quality and reliability ensures that you are investing in a product that delivers exceptional value and benefits. Experience the advantages of seamless integration, high-speed processing, and low power consumption with the 10CX105YF672E5G - the key to unlocking limitless possibilities in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and can withstand various environmental conditions, making it a reliable choice for long-term use.

No. of Logic Cells: 104000

With a large number of logic cells, this FPGA provides ample resources for complex and large-scale designs, offering flexibility and high performance.

Surface Mount: YES

Surface mount packaging allows for easy installation and soldering onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 0.93 V

This low maximum supply voltage helps in reducing power consumption and heat dissipation, improving overall energy efficiency.

No. of CLBs: 38000

With a high number of Configurable Logic Blocks (CLBs), this FPGA enables versatile and reconfigurable designs, suitable for a wide range of applications.

Technology Used: TSMC

Utilizing TSMC technology ensures high quality manufacturing processes and reliable performance, meeting industry standards and expectations.

No. of Inputs: 236

Having a large number of input pins allows for interfacing with multiple external devices and signals, enhancing the versatility and connectivity of the FPGA.

Package Shape: SQUARE

The square package shape offers efficient use of space and easy integration into circuit board layouts, optimizing design flexibility and compactness.

Form Of Terminal: BALL

Ball terminals provide good electrical contact and reliability, facilitating soldering and connection processes for seamless integration into electronic systems.

Nominal Supply Voltage (V): 0.9

The nominal supply voltage of 0.9V ensures stable and consistent operation of the FPGA, contributing to overall system reliability and performance.

No. of Terminals: 672

Having a sufficient number of terminals allows for versatile connectivity options and ease of integration, enabling diverse system configurations and functionality.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

As a FPGA, this product offers reconfigurability and flexibility, allowing for on-the-fly changes and customization to meet specific application requirements.

Package Style (Meter): GRID ARRAY

The grid array package style offers convenient alignment and connection with other components, simplifying assembly processes and improving overall reliability.

Minimum Supply Voltage: 0.87 V

The low minimum supply voltage of 0.87V allows for efficient power utilization and operation at lower voltages, enhancing energy efficiency and reducing heat dissipation.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature of 100°C, this FPGA can withstand elevated temperatures, ensuring performance stability and reliability in demanding environments.

Organization: 38000 CLBS

The organized structure of 38000 Configurable Logic Blocks (CLBs) enables efficient routing and logic implementation, enhancing design flexibility and performance optimization.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C allows for reliable operation in various temperature conditions, ensuring consistent performance in diverse environments.

Position Of Terminal: BOTTOM

The terminal positioned at the bottom simplifies the connection and integration process, providing easy access and secure mounting within electronic systems.

No. of Outputs: 236

With a high number of output pins, this FPGA can drive multiple external devices and signals, offering versatility and connectivity for diverse applications and functionalities.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 10CX105YF672E5G attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

104000

No. of Inputs:

236

No. of Outputs:

236

No. of CLBs:

38000

Technology:

TSMC

Organization:

38000 CLBS

Power Characteristics

Nominal Supply Voltage:

.9

Minimum Supply Voltage:

.87 V

Maximum Supply Voltage:

.93 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

No. of Terminals:

672

Standards

JESD-30 Code:

S-PBGA-B672

Trade Compliance

10CX105YF672E5G Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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