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MPF300T-1FCSG536I

Microchip Technology

MPF300T-1FCSG536I by Microchip Technology

MPF300T-1FCSG536I by Microchip Technology is a CMOS FPGA with 300,000 logic cells and 300 inputs/outputs. It operates b/w -40 to 100°C, with a supply voltage range of 0.97V to 1.03V. This low-profile grid array package is ideal for applications requiring high-density programmable logic solutions in compact spaces.

Median Price

$766.170

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

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Microchip Technology

USA . 340 parts In-Stock

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$766.170

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$701.550

1k+ parts

$485.240

10k+ parts

$431.330

340

$766.170

$701.550

$485.240

$431.330

Distributors (In-Stock)

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Digiode

USA . 397 parts In-Stock

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$727.862

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Nova Conductors

Japan . 91 parts In-Stock

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Vyrian

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AZTECH Wire

Italy . 785 parts In-Stock

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$16.876

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Aztec Data Supply Inc.

USA . 248 parts In-Stock

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$31.410

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Corohmni

South Africa . 931 parts In-Stock

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$52.197

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Vigor

Singapore . 517 parts In-Stock

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$630.200

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Semicontronic

India . 90 parts In-Stock

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$651.240

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$634.959

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$631.703

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Corphita

USA . 463 parts In-Stock

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$689.553

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Ampacity Inc.

Singapore . 90 parts In-Stock

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$1,417.410

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QUARKTWIN TECHNOLOGY LTD

USA . 29,711 parts In-Stock

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LMD Electronica

Estonia . 8,321 parts In-Stock

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LOOK Integrated Logistics

Peru . 6,925 parts In-Stock

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Continental Prestige Electronics

USA . 6,578 parts In-Stock

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Argo Parts USA

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Montano Global Distributors

Canada . 808 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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NIA Electronics

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Ledger Components

France . 90 parts In-Stock

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Overview

Elevate your electronics projects with the MPF300T-1FCSG536I by Microchip Technology. This top-of-the-line Field Programmable Gate Array offers unmatched quality and reliability, thanks to its cutting-edge CMOS technology and durable plastic/epoxy package body material. With 300,000 logic cells and 300 inputs/outputs, this FPGA provides endless possibilities for customization and innovation. Whether you're designing advanced robotics, AI systems, or high-performance computing solutions, the MPF300T-1FCSG536I delivers exceptional value, flexibility, and performance. Upgrade your projects today with Microchip Technology's latest offering.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and cost-effectiveness.

No. of Logic Cells: 300000

High number of logic cells allows for complex designs and functions.

Surface Mount: YES

Easy installation and integration into existing systems.

Maximum Supply Voltage: 1.03 V

Low power consumption and efficient operation.

Technology Used: CMOS

Advanced technology for high performance and reliability.

No. of Inputs: 300

Sufficient inputs for versatile applications and functionality.

Package Shape: SQUARE

Compact design for space-saving installations.

Form Of Terminal: BALL

Secure and reliable connection for stable performance.

No. of Terminals: 536

Sufficient terminals for versatile connectivity options.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Flexibility for customization and adaptability to different applications.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Improved signal integrity and performance due to precise packaging.

Minimum Supply Voltage: 0.97 V

Low power requirement for energy efficiency.

Maximum Operating Temperature: 100 °C

Wide temperature range for reliable operation in various environments.

Pitch Of Terminal: 0.5 mm

Precise terminal spacing for secure connections and optimal performance.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme temperature conditions.

Position Of Terminal: BOTTOM

Convenient terminal placement for easy access and connectivity.

Maximum Seated Height: 1.45 mm

Low profile design for compact installations and space-saving solutions.

Width: 16 mm

Compact size for versatile applications and integration options.

No. of Outputs: 300

Sufficient outputs for versatile functionality and programming options.

Length: 16 mm

Compact design for space-efficient installations.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-1FCSG536I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

300

No. of Outputs:

300

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Low Profile, Fine Pitch

Package Code:

Package Shape:

Length:

16 mm

Width:

16 mm

Maximum Seated Height:

1.45 mm

Package Equivalence Code:

BGA536,30X30,20

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

536

Standards

JESD-30 Code:

S-PBGA-B536

Trade Compliance

MPF300T-1FCSG536I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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