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XC7S100-1FGGA484I

Xilinx

XC7S100-1FGGA484I by Xilinx

Xilinx XC7S100-1FGGA484I FPGA features 102400 logic cells, 8000 CLBs, and a max clock frequency of 1098 MHz. Ideal for industrial applications requiring high-speed processing and programmable ICs in a compact square package with 484 terminals.

Median Price

$157.530

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Farnell

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$128.890

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Mouser Electronics

USA . 119 parts In-Stock

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DigiKey

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Nova Conductors

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$63.484

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Digiode

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$122.446

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VNN

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IBS Electronics

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Vyrian

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AZTECH Wire

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$8.959

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Modulus Dynamics

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Aztec Data Supply Inc.

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Ampacity Inc.

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Corphita

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Vigor

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Netroflash

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Microchip USA

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Corohmni

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Texas Native Microelectronics

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Kenton Components

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$213.940

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$207.255

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$196.112

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Qasali Group International

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$501.422

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MARBEL Systems

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Supply Digital

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Overview

Unlock endless possibilities with the XC7S100-1FGGA484I by Xilinx. This cutting-edge Field Programmable Gate Array boasts superior quality and precision engineering, making it a standout choice for a wide range of applications. From industrial automation to aerospace technology, this FPGA offers unparalleled performance and reliability. Experience seamless integration, unmatched flexibility, and unparalleled efficiency with the XC7S100-1FGGA484I. Elevate your projects to new heights with Xilinx's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and cost-effective, making this FPGA suitable for various applications.

No. of Logic Cells: 102400

Large number of logic cells provide flexibility and ability to handle complex designs efficiently.

Surface Mount: YES

Surface mount package makes it easy to integrate this FPGA onto circuit boards, saving space and simplifying manufacturing process.

Maximum Supply Voltage: 1.05 V

Low maximum supply voltage ensures power efficiency and reduces heat dissipation.

No. of CLBs: 8000

Having 8000 Configurable Logic Blocks (CLBs) allows for significant logic resources for designing complex digital circuits.

Technology Used: HKMG

HKMG technology offers high performance and energy efficiency, making this FPGA suitable for demanding applications.

No. of Inputs: 400

Having 400 inputs provides flexibility in connecting external signals to the FPGA.

Package Shape: SQUARE

Square package shape makes it easy to design and layout the FPGA on a PCB, optimizing space utilization.

Form Of Terminal: BALL

Ball grid array terminal form simplifies soldering and ensures reliable connections.

No. of Terminals: 484

Having 484 terminals provides ample connectivity options for interfacing with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a Field Programmable Gate Array, this product offers flexibility in design and reconfiguration, making it ideal for prototyping and customization.

Package Style (Meter): GRID ARRAY

Grid array package style offers a compact and efficient layout on the PCB, optimizing signal integrity and thermal performance.

Minimum Supply Voltage: 0.95 V

Low minimum supply voltage allows for operation in low power environments, making it suitable for battery-powered devices.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliable performance in harsh environmental conditions.

Pitch Of Terminal: 1 mm

1mm terminal pitch provides ease of PCB layout and assembly, reducing manufacturing complexities.

Maximum Combinatorial Delay of a CLB: 1.27 ns

Low maximum combinatorial delay ensures efficient operation and fast response time in processing logic functions.

Organization: 8000 CLBS

Organized into 8000 Configurable Logic Blocks (CLBs) for efficient logic implementation and design flexibility.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature enables reliable performance in extreme cold environments.

Finishing Of Terminal Used: TIN SILVER COPPER

Tin silver copper finish on terminals provides excellent conductivity and reliability in signal transmission.

Position Of Terminal: BOTTOM

Bottom position of terminals makes it easier for PCB integration and ensures secure connections.

Maximum Seated Height: 2.44 mm

Low maximum seated height minimizes space requirements and allows for compact PCB designs.

Width: 23 mm

Compact width dimension makes it suitable for applications where space is limited.

Maximum Clock Frequency: 1098 MHz

High maximum clock frequency ensures fast operation and high-speed data processing capabilities.

No. of Outputs: 400

Having 400 outputs provides ample connectivity options for driving external components and devices.

Length: 23 mm

Compact length dimension makes it suitable for space-constrained applications.

Grading Of Temperature: INDUSTRIAL

Industrial-grade temperature grading ensures reliable operation in harsh environmental conditions and high-temperature environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) XC7S100-1FGGA484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Xilinx

IC Features

Programmable IC Type:

No. of Logic Cells:

102400

No. of Inputs:

400

No. of Outputs:

400

No. of CLBs:

8000

Maximum Clock Frequency:

1098 MHz

CLB Maximum Delay:

1.27 ns

Technology:

HKMG

Organization:

8000 CLBS

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.95 V

Maximum Supply Voltage:

1.05 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.44 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Trade Compliance

XC7S100-1FGGA484I Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991.D

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Xilinx

Xilinx, Inc. (XIlinx) in February 2022 acquired by AMD

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