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MPF300T-FCVG484E

Microchip Technology

MPF300T-FCVG484E by Microchip Technology

MPF300T-FCVG484E by Microchip is a CMOS FPGA with 300K logic cells, 284 inputs/outputs, and operates b/w 0-100°C. It features a fine pitch grid array package suitable for surface mount applications. Ideal for high-performance computing, telecommunications, and industrial automation systems.

Median Price

$485.460

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$475.880

100+ parts

-

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-

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2

$475.880

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Arrow

USA . 5 parts In-Stock

1+ parts

$485.460

100+ parts

$485.460

1k+ parts

$485.460

10k+ parts

$485.460

5

$485.460

$485.460

$485.460

$485.460

Verical

USA . 5 parts In-Stock

1+ parts

$485.460

100+ parts

$485.460

1k+ parts

$485.460

10k+ parts

$485.460

5

$485.460

$485.460

$485.460

$485.460

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 103 parts In-Stock

1+ parts

$452.086

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-

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103

$452.086

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Nova Conductors

Japan . 60 parts In-Stock

1+ parts

$516.660

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60

$516.660

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Vyrian

USA . 4 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 613 parts In-Stock

1+ parts

$13.802

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-

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613

$13.802

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Vigor

Singapore . 532 parts In-Stock

1+ parts

$391.410

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532

$391.410

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Semicontronic

India . 4 parts In-Stock

1+ parts

$404.500

100+ parts

$394.388

1k+ parts

$392.365

10k+ parts

-

4

$404.500

$394.388

$392.365

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Corphita

USA . 489 parts In-Stock

1+ parts

$428.292

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489

$428.292

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Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$880.380

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4

$880.380

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NIA Electronics

USA . 5,422 parts In-Stock

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5,422

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Ledger Components

France . 5,422 parts In-Stock

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Montano Global Distributors

Canada . 4,767 parts In-Stock

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4,767

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LOOK Integrated Logistics

Peru . 3,245 parts In-Stock

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LMD Electronica

Estonia . 1,874 parts In-Stock

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1,874

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Netroflash

USA . 100 parts In-Stock

1+ parts

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100+ parts

$506.327

1k+ parts

$490.827

10k+ parts

$480.494

100

-

$506.327

$490.827

$480.494

Overview

Unlock limitless possibilities with the Microchip Technology MPF300T-FCVG484E FPGA. Manufactured by a trusted leader in the industry, this cutting-edge programmable IC offers unparalleled performance and reliability. Ideal for applications requiring high-speed processing and flexibility, this FPGA boasts 300,000 logic cells and 284 inputs/outputs. Experience seamless integration and customization with its advanced CMOS technology and fine pitch grid array package style. Elevate your projects with the MPF300T-FCVG484E and unleash the power of innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in FPGA packages, providing durability and protection for the internal components.

No. of Logic Cells: 300000

With a large number of logic cells, this FPGA can handle complex programmable functions efficiently.

Surface Mount: YES

Surface mount technology allows for easy and secure installation on PCBs, saving space and simplifying assembly.

Maximum Supply Voltage: 1.03 V

This voltage level provides a suitable power input for the FPGA to operate effectively.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA energy efficient and reliable.

No. of Inputs: 284

The abundance of input channels allows for versatile connectivity and integration with various external devices.

Package Shape: SQUARE

The square shape of the package facilitates easier mounting and alignment on the PCB.

Form Of Terminal: BALL

Ball terminals provide a reliable connection to the PCB, ensuring secure and stable operation of the FPGA.

No. of Terminals: 484

A high number of terminals allows for versatile I/O options and connectivity possibilities for the FPGA.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGAs are known for their reprogrammable logic, making them adaptable to changing project requirements and reducing development time.

Package Style (Meter): GRID ARRAY, FINE PITCH

Fine pitch grid array package style enables high-density mounting and efficient signal routing for improved performance.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage ensures that the FPGA can operate effectively in a wide range of power scenarios.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions without compromising performance.

Pitch Of Terminal: 0.8 mm

The small pitch size of the terminals enables compact design and efficient use of board space.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the FPGA can function reliably in cold environments.

Position Of Terminal: BOTTOM

Bottom position of terminals allows for easy access and connection to the PCB, simplifying installation and maintenance.

Maximum Seated Height: 3.32 mm

With a relatively low seated height, this FPGA can be integrated into compact electronic systems with limited space.

Width: 19 mm

The moderate width of the FPGA makes it compatible with standard board layouts and allows for easy placement on the PCB.

No. of Outputs: 284

An equal number of output channels ensures bidirectional data flow and comprehensive data processing capabilities.

Length: 19 mm

The balanced length of the FPGA allows for optimal placement and alignment on the PCB, ensuring efficient signal routing.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-FCVG484E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300T-FCVG484E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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