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MPF300TL-FCG1152I

Microchip Technology

MPF300TL-FCG1152I by Microchip Technology

MPF300TL-FCG1152I by Microchip Technology is a 300K logic cell FPGA with CMOS technology. It features 512 inputs/outputs, operates b/w -40 to 100°C, and has a package size of 35x35mm. Ideal for applications requiring high-density programmable logic in compact form factors.

Median Price

$768.770

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$768.770

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300

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Vyrian

USA . 5,736 parts In-Stock

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Chip Stock

USA . 1,115 parts In-Stock

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Digiode

USA . 217 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 395 parts In-Stock

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$7.000

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395

$7.000

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AZTECH Wire

Italy . 836 parts In-Stock

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$9.681

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836

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Semicontronic

India . 491 parts In-Stock

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$21.000

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$20.475

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$20.370

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491

$21.000

$20.475

$20.370

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Corohmni

South Africa . 74 parts In-Stock

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$79.295

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Advanced Electronics

New Zealand . 44 parts In-Stock

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$92.433

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$84.114

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$75.795

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44

$92.433

$84.114

$75.795

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Aztec Data Supply Inc.

USA . 1,505 parts In-Stock

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$147.240

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Vigor

Singapore . 358 parts In-Stock

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$582.410

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Aranea Global

USA . 2,000 parts In-Stock

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$753.395

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$723.259

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$753.395

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$723.259

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LOOK Integrated Logistics

Peru . 5,272 parts In-Stock

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Continental Prestige Electronics

USA . 4,288 parts In-Stock

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NIA Electronics

USA . 2,979 parts In-Stock

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Ledger Components

France . 2,979 parts In-Stock

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Montano Global Distributors

Canada . 1,674 parts In-Stock

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Argo Parts USA

USA . 1,308 parts In-Stock

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LMD Electronica

Estonia . 656 parts In-Stock

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Corphita

USA . 234 parts In-Stock

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Overview

Elevate your projects with the MPF300TL-FCG1152I by Microchip Technology, a top-notch Field Programmable Gate Array that boasts superior quality and performance. With 300,000 logic cells and 512 inputs/outputs, this FPGA is designed to tackle complex tasks with ease. Whether you're in the automotive, industrial, or telecommunications industry, this versatile FPGA offers unmatched flexibility and reliability. Trust in the expertise of Microchip Technology and unlock endless possibilities for your next project. Experience the value and benefits that the MPF300TL-FCG1152I brings to the table - elevate your innovation today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FPGA.

No. of Logic Cells: 300000

Offers a high level of logic processing capability, suitable for complex applications.

Surface Mount: YES

Easy to mount on a circuit board, simplifying the assembly process.

Maximum Supply Voltage: 1.03 V

Ensures safe operation within specified voltage limits.

Technology Used: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed performance.

No. of Inputs: 512

Provides a large number of input channels for versatile connectivity.

Package Shape: SQUARE

Enables efficient use of space on the circuit board.

Form Of Terminal: BALL

Facilitates reliable and secure connections.

No. of Terminals: 1152

Offers a wide range of terminals for connecting to other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Allows for flexible customization and reprogramming of logic functions.

Package Style (Meter): GRID ARRAY

Enhances thermal performance and reliability of the FPGA.

Minimum Supply Voltage: 0.97 V

Provides a lower limit for safe operation, ensuring stable performance.

Maximum Operating Temperature: 100 °C

Can withstand high temperatures, suitable for industrial applications.

Pitch Of Terminal: 1 mm

Allows for fine-pitch connections, saving space on the circuit board.

Minimum Operating Temperature: -40 °C

Operates reliably in low temperature environments, making it versatile for different settings.

Position Of Terminal: BOTTOM

Facilitates easier installation and maintenance of the FPGA.

Maximum Seated Height: 3.47 mm

Low-profile design for space-constrained applications.

Width: 35 mm

Compact form factor, suitable for applications with limited space.

No. of Outputs: 512

Provides a large number of output channels for versatile functionality.

Length: 35 mm

Compact and square design for efficient use of space on the circuit board.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TL-FCG1152I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

512

No. of Outputs:

512

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

35 mm

Width:

35 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA1152,34X34,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

Standards

JESD-30 Code:

S-PBGA-B1152

Trade Compliance

MPF300TL-FCG1152I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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