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MPF300TS-FCV484M

Microchip Technology

MPF300TS-FCV484M by Microchip Technology

Microchip Technology's MPF300TS-FCV484M is a 300K logic cell FPGA with CMOS technology. Featuring 284 inputs/outputs, it operates b/w -55 to 125°C and has a package style of grid array, fine pitch. Ideal for military applications requiring high-density programmable ICs in compact form factors.

Median Price

$983.412

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$788.815

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50

$788.815

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Digiode

USA . 285 parts In-Stock

1+ parts

$1,178.010

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285

$1,178.010

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Vyrian

USA . 3,204 parts In-Stock

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3,204

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Chip Stock

USA . 690 parts In-Stock

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690

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 633 parts In-Stock

1+ parts

$7.559

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633

$7.559

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Semicontronic

India . 718 parts In-Stock

1+ parts

$12.000

100+ parts

$11.700

1k+ parts

$11.640

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-

718

$12.000

$11.700

$11.640

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Aztec Data Supply Inc.

USA . 3,556 parts In-Stock

1+ parts

$122.260

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3,556

$122.260

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Corohmni

South Africa . 572 parts In-Stock

1+ parts

$131.079

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572

$131.079

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Argo Parts USA

USA . 3,112 parts In-Stock

1+ parts

$788.815

100+ parts

$780.927

1k+ parts

$773.039

10k+ parts

$765.151

3,112

$788.815

$780.927

$773.039

$765.151

Continental Prestige Electronics

USA . 1,099 parts In-Stock

1+ parts

$788.815

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$773.039

1,099

$788.815

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$773.039

Ampacity Inc.

Singapore . 32 parts In-Stock

1+ parts

$1,054.010

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32

$1,054.010

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Corphita

USA . 194 parts In-Stock

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$1,116.009

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194

$1,116.009

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RGB Technical Solutions

Ukraine . 7,591 parts In-Stock

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7,591

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Microchip USA

USA . 2,140 parts In-Stock

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2,140

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Netroflash

USA . 50 parts In-Stock

1+ parts

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100+ parts

$773.039

1k+ parts

$749.374

10k+ parts

$733.598

50

-

$773.039

$749.374

$733.598

Overview

Unleash the power of innovation with the Microchip Technology MPF300TS-FCV484M FPGA. Designed to deliver top-notch performance and reliability, this cutting-edge technology offers endless possibilities in various applications. With Microchip's renowned expertise in semiconductor manufacturing, you can trust that this FPGA will exceed your expectations. Experience seamless integration, flexibility, and efficiency like never before with the MPF300TS-FCV484M FPGA. Elevate your projects to new heights with this game-changing solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and flexibility, making it suitable for a wide range of applications.

No. of Logic Cells: 300000

With a high number of logic cells, this FPGA can handle complex logic functions efficiently.

Surface Mount: YES

Being surface mountable makes this FPGA easy to install and saves space on the PCB.

Maximum Supply Voltage: 1.03 V

Operates at a low voltage, making it energy-efficient and reducing power consumption.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring reliable performance.

No. of Inputs: 284

Comes with a high number of inputs, enabling versatile connectivity options.

Package Shape: SQUARE

The square shape allows for easy placement on the PCB and efficient use of space.

Form Of Terminal: BALL

Ball terminals provide a strong and stable connection, enhancing reliability.

No. of Terminals: 484

The high number of terminals allows for extensive connectivity options with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

This type of FPGA offers reprogrammable logic functions, making it highly versatile.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array style enables high-density mounting and greater design flexibility.

Minimum Supply Voltage: 0.97 V

This low supply voltage requirement contributes to energy efficiency and reduced heat generation.

Maximum Operating Temperature: 125 °C

Operates effectively at high temperatures, suitable for demanding industrial environments.

Pitch Of Terminal: 0.8 mm

The small pitch of terminals allows for compact design and efficient use of space on the PCB.

Minimum Operating Temperature: -55 °C

Can operate in extremely low temperatures, making it suitable for a wide range of environments.

Position Of Terminal: BOTTOM

Bottom terminals make it easy to solder and connect to the PCB, simplifying the installation process.

Maximum Seated Height: 3.32 mm

The low profile of the FPGA allows for slim and compact designs in electronic applications.

Width: 19 mm

With a compact width, this FPGA can fit into tight spaces on the PCB.

No. of Outputs: 284

Offers a high number of output options, enhancing connectivity and versatility.

Length: 19 mm

The short length of this FPGA makes it suitable for designs with space constraints.

Grading Of Temperature: MILITARY

Military-grade temperature rating ensures reliability in extreme conditions and harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TS-FCV484M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

3.32 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300TS-FCV484M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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