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MPF300TS-FC484M

Microchip Technology

MPF300TS-FC484M by Microchip Technology

MPF300TS-FC484M by Microchip Technology is a 300K logic cell FPGA with CMOS technology. It has 284 inputs/outputs, operates b/w -55 to 125°C, and uses a grid array package style. Ideal for military-grade applications requiring high-density programmable ICs in compact form factors.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,648 parts In-Stock

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Digiode

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Nova Conductors

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AZTECH Wire

Italy . 661 parts In-Stock

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Semicontronic

India . 1,503 parts In-Stock

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Ampacity Inc.

Singapore . 1,610 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,079 parts In-Stock

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Corohmni

South Africa . 853 parts In-Stock

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QualityLine Systems

Poland . 7,322 parts In-Stock

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XL Components Corporation

Australia . 6,744 parts In-Stock

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Argo Parts USA

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Microchip USA

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Marpe Global Electronics

Taiwan . 1,504 parts In-Stock

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Futuretech Components

Singapore . 889 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Continental Prestige Electronics

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Corphita

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Overview

Unlock limitless possibilities with the MPF300TS-FC484M by Microchip Technology. Designed with precision and expertise, this Field Programmable Gate Array offers unparalleled performance and reliability in a compact package. Whether you're in aerospace, defense, or telecommunications, this FPGA is the perfect solution for your advanced applications. With its advanced technology and innovative design, the MPF300TS-FC484M delivers unmatched value, efficiency, and flexibility to empower your projects and take them to new heights. Elevate your designs with Microchip Technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the FPGA easy to handle and resistant to damage.

No. of Logic Cells: 300000

With a large number of logic cells, this FPGA can handle complex designs and computations efficiently.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage allows for flexibility in power requirements.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, making the FPGA efficient and reliable.

No. of Inputs: 284

Having a high number of inputs allows for connectivity with various external components and devices.

Width: 23 mm

The compact width of the FPGA enables it to be easily integrated into different systems or circuits.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures that the FPGA can operate reliably in harsh environmental conditions.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TS-FC484M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

284

No. of Outputs:

284

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

3.39 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300TS-FC484M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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