Loading...

MPF300TLS-FCG484I

Microchip Technology

MPF300TLS-FCG484I by Microchip Technology

MPF300TLS-FCG484I by Microchip: 300K logic cells, CMOS tech, 244 inputs/outputs. Ideal for FPGA applications with a grid array package style and operating temp range of -40 to 100°C.

Median Price

$700.888

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 280 parts In-Stock

1+ parts

$682.917

100+ parts

-

1k+ parts

-

10k+ parts

-

280

$682.917

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$718.860

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$718.860

-

-

-

Vyrian

USA . 5,283 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,283

-

-

-

-

Chip Stock

USA . 530 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

530

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 243 parts In-Stock

1+ parts

$18.515

100+ parts

-

1k+ parts

-

10k+ parts

-

243

$18.515

-

-

-

Corohmni

South Africa . 96 parts In-Stock

1+ parts

$44.828

100+ parts

-

1k+ parts

-

10k+ parts

-

96

$44.828

-

-

-

Aztec Data Supply Inc.

USA . 1,219 parts In-Stock

1+ parts

$95.030

100+ parts

-

1k+ parts

-

10k+ parts

-

1,219

$95.030

-

-

-

Vigor

Singapore . 952 parts In-Stock

1+ parts

$544.600

100+ parts

-

1k+ parts

-

10k+ parts

-

952

$544.600

-

-

-

Ampacity Inc.

Singapore . 4 parts In-Stock

1+ parts

$611.030

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$611.030

-

-

-

Semicontronic

India . 4 parts In-Stock

1+ parts

$611.030

100+ parts

$595.754

1k+ parts

$592.699

10k+ parts

-

4

$611.030

$595.754

$592.699

-

Corphita

USA . 375 parts In-Stock

1+ parts

$646.974

100+ parts

-

1k+ parts

-

10k+ parts

-

375

$646.974

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$718.860

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

$718.860

-

-

-

NIA Electronics

USA . 8,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,169

-

-

-

-

Ledger Components

France . 8,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,169

-

-

-

-

Continental Prestige Electronics

USA . 4,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,004

-

-

-

-

Montano Global Distributors

Canada . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,500

-

-

-

-

LMD Electronica

Estonia . 1,511 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,511

-

-

-

-

LOOK Integrated Logistics

Peru . 745 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

745

-

-

-

-

Argo Parts USA

USA . 407 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

407

-

-

-

-

Overview

Unleash the power of innovation with the MPF300TLS-FCG484I by Microchip Technology. This cutting-edge Field Programmable Gate Array (FPGA) offers unmatched quality and reliability, making it the top choice for a wide range of applications. With its 300,000 logic cells and 244 inputs/outputs, this FPGA provides limitless possibilities for customization and optimization. Experience the value and benefits of this versatile technology, from increased efficiency to enhanced performance. Elevate your projects to new heights with the MPF300TLS-FCG484I and see the difference that Microchip Technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is known for its durability and cost-effectiveness, making this product suitable for a wide range of applications.

No. of Logic Cells: 300000

Having a large number of logic cells allows for complex programming and customization, making this FPGA versatile for various tasks.

Surface Mount: YES

Surface mount technology simplifies the assembly process and allows for compact and lightweight designs.

Maximum Supply Voltage: 1.03 V

The high maximum supply voltage ensures stable performance and compatibility with different power sources.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency of this FPGA.

No. of Inputs: 244

Having a high number of inputs provides flexibility in connecting external devices and sensors to the FPGA.

Package Shape: SQUARE

The square shape allows for efficient use of space and easy integration into system designs.

Form Of Terminal: BALL

Ball terminals are known for reliable connections and ease of soldering, ensuring secure and stable connections.

No. of Terminals: 484

The high number of terminals allows for a wide range of I/O options and facilitates customization and connectivity.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array, this IC can be reconfigured and customized for specific applications, offering versatility and adaptability.

Package Style (Meter): GRID ARRAY

Grid array packaging provides efficient routing and connectivity, enhancing signal integrity and performance.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage allows for energy-efficient operation and compatibility with a variety of power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliability and performance even in harsh environments or high-temperature conditions.

Pitch Of Terminal: 1 mm

Having a small pitch between terminals allows for compact design layouts and efficient routing of signals.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Position Of Terminal: BOTTOM

Bottom terminal positioning allows for easier installation and maintenance, reducing the overall footprint of the FPGA.

Maximum Seated Height: 2.87 mm

The low maximum seated height enables compact and low-profile system designs, saving space and reducing overall height.

Width: 23 mm

The width of 23mm provides a balance between compactness and ease of integration, making this FPGA suitable for various applications.

No. of Outputs: 244

Having a high number of outputs allows for versatile connectivity and signal routing options, enhancing the flexibility of this FPGA.

Length: 23 mm

The length of 23mm complements the width and overall dimensions of the FPGA, providing a compact and balanced form factor for integration.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300TLS-FCG484I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

244

No. of Outputs:

244

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2.87 mm

Package Equivalence Code:

BGA484,22X22,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Trade Compliance

MPF300TLS-FCG484I Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20