Loading...

MPF300T-FCG784E

Microchip Technology

MPF300T-FCG784E by Microchip Technology

MPF300T-FCG784E by Microchip Technology is a 300K logic cell FPGA with CMOS technology. It features 388 inputs/outputs, operates b/w 0-100°C, and has a package size of 29x29mm. Ideal for applications requiring high-density programmable logic in compact form factors.

Median Price

$459.775

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2 parts In-Stock

1+ parts

$459.760

100+ parts

$417.960

1k+ parts

$290.370

10k+ parts

-

2

$459.760

$417.960

$290.370

-

DigiKey

USA . 2 parts In-Stock

1+ parts

$459.790

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$459.790

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2 parts In-Stock

1+ parts

$394.070

100+ parts

$362.960

1k+ parts

$336.400

10k+ parts

-

2

$394.070

$362.960

$336.400

-

Digiode

USA . 170 parts In-Stock

1+ parts

$436.800

100+ parts

-

1k+ parts

-

10k+ parts

-

170

$436.800

-

-

-

Vyrian

USA . 8,581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,581

-

-

-

-

Chip Stock

USA . 916 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

916

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 870 parts In-Stock

1+ parts

$378.190

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$378.190

-

-

-

Semicontronic

India . 29 parts In-Stock

1+ parts

$390.820

100+ parts

$381.050

1k+ parts

$379.095

10k+ parts

-

29

$390.820

$381.050

$379.095

-

Corphita

USA . 421 parts In-Stock

1+ parts

$413.811

100+ parts

-

1k+ parts

-

10k+ parts

-

421

$413.811

-

-

-

Montano Global Distributors

Canada . 7,419 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,419

-

-

-

-

NIA Electronics

USA . 7,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,151

-

-

-

-

Ledger Components

France . 7,151 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,151

-

-

-

-

LMD Electronica

Estonia . 1,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,326

-

-

-

-

LOOK Integrated Logistics

Peru . 1,079 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,079

-

-

-

-

Overview

Unlock endless possibilities with the MPF300T-FCG784E by Microchip Technology. This cutting-edge Field Programmable Gate Array boasts 300,000 logic cells and 388 inputs and outputs, making it a versatile solution for a wide range of applications. With a maximum supply voltage of 1.03V and advanced CMOS technology, this FPGA delivers superior performance and reliability. Whether you're designing complex consumer electronics or industrial control systems, this FPGA's precision and flexibility will streamline your development process and elevate your project to new heights. Trust in Microchip Technology's reputation for quality and innovation, and experience the unparalleled value that the MPF300T-FCG784E brings to your next design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the FPGA, ensuring reliable performance in various environmental conditions.

No. of Logic Cells: 300000

With a large number of logic cells, this FPGA can handle complex programmable functions and computations, making it suitable for a wide range of applications requiring high processing power.

Surface Mount: YES

Being surface mountable simplifies the installation and integration of the FPGA onto circuit boards, reducing assembly time and making it suitable for automated production processes.

Maximum Supply Voltage: 1.03 V

The low maximum supply voltage requirement helps in reducing power consumption and heat dissipation, making the FPGA energy-efficient and suitable for portable devices.

Technology Used: CMOS

CMOS technology offers low power consumption, high noise immunity, and scalability, making this FPGA reliable, efficient, and suitable for various digital and mixed-signal applications.

No. of Inputs: 388

Having a high number of inputs allows for versatile connectivity and input options, making this FPGA suitable for applications that require extensive data processing and communication.

Package Shape: SQUARE

The square shape of the package provides uniformity and ease of integration into circuit designs, ensuring a compact layout and efficient use of space on the PCB.

Form Of Terminal: BALL

The use of ball terminals offers reliable connections and easy reworkability, facilitating soldering and assembly processes, making this FPGA suitable for prototype development and testing.

No. of Terminals: 784

A high number of terminals provide ample connectivity options and signal routing capabilities, enabling flexible design configurations and compatibility with various peripheral devices.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field-programmable gate array allows for customization and reprogramming of logic functions, making this FPGA versatile and adaptable to changing design requirements and applications.

Package Style (Meter): GRID ARRAY

The grid array package style offers efficient thermal dissipation and signal integrity, ensuring stable performance and reliability even in complex circuit layouts and high-frequency applications.

Minimum Supply Voltage: 0.97 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources and reduces the risk of overvoltage damage, making this FPGA versatile and flexible in power supply options.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this FPGA can withstand elevated thermal conditions, ensuring reliable performance in harsh environments and industrial applications.

Pitch Of Terminal: 1 mm

The 1mm terminal pitch provides adequate spacing for routing signals and minimizing signal crosstalk and interference, ensuring signal integrity and reliability in high-speed data applications.

Minimum Operating Temperature: 0 °C

With a low minimum operating temperature, this FPGA can operate in cold environments without performance degradation, making it suitable for applications with varying temperature conditions.

Position Of Terminal: BOTTOM

The bottom positioning of terminals allows for easy access and routing of signals on the PCB, simplifying the layout and assembly process and ensuring efficient signal transmission.

Maximum Seated Height: 3.47 mm

With a low maximum seated height, this FPGA can be accommodated in slim and compact devices, making it suitable for applications with space constraints and miniaturized designs.

Width: 29 mm

The compact width of 29mm allows for efficient PCB layout and space optimization, enabling the integration of this FPGA into various electronic systems and devices with limited board space.

No. of Outputs: 388

Having a high number of outputs facilitates extensive signal processing and routing capabilities, enabling complex data transmission and communication protocols, making this FPGA suitable for high-performance applications.

Length: 29 mm

The compact length of 29mm ensures a space-efficient footprint on the PCB, allowing for flexible design configurations and integration into small form factor devices and systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) MPF300T-FCG784E attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of Logic Cells:

300000

No. of Inputs:

388

No. of Outputs:

388

Technology:

CMOS

Additional Features:

It also Operates at 1.05 V nominal supply

Power Characteristics

Nominal Supply Voltage:

1

Minimum Supply Voltage:

.97 V

Maximum Supply Voltage:

1.03 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

29 mm

Width:

29 mm

Maximum Seated Height:

3.47 mm

Package Equivalence Code:

BGA784,28X28,40

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

1 mm

No. of Terminals:

784

Standards

JESD-30 Code:

S-PBGA-B784

Trade Compliance

MPF300T-FCG784E Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.