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5CGXFC9C6F23I7N

Intel

5CGXFC9C6F23I7N by Intel

The Intel 5CGXFC9C6F23I7N is a Field Programmable Gate Array (FPGA) with a max supply voltage of 1.13V and 484 terminals in a square package shape. It is used for applications requiring programmable ICs, featuring a grid array package style and tin silver copper terminal finishing for versatile electronic designs.

Median Price

$704.710

Lifecycle Status

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Mouser Electronics

USA . 71 parts In-Stock

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DigiKey

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Verical

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Digiode

USA . 664 parts In-Stock

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Nova Conductors

Japan . 58 parts In-Stock

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Vyrian

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Chip Stock

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VNN

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AZTECH Wire

Italy . 286 parts In-Stock

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Corohmni

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Modulus Dynamics

Lithuania . 1,003 parts In-Stock

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Texas Native Microelectronics

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Microchip USA

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Semicontronic

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Ampacity Inc.

Singapore . 101 parts In-Stock

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Corphita

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Argo Parts USA

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$709.996

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Continental Prestige Electronics

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Netroflash

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One Stop Electronics

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Authorized Procurement Solutions

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Kenton Components

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Supply Digital

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Qasali Group International

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MARBEL Systems

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Overview

Unlock the limitless possibilities with the Intel 5CGXFC9C6F23I7N Field Programmable Gate Array. Crafted by industry leader Intel, this FPGA offers unparalleled quality and reliability. Whether you're looking to accelerate algorithm development or streamline your data processing, this versatile component delivers unmatched performance and flexibility. With its advanced features and cutting-edge technology, the 5CGXFC9C6F23I7N provides exceptional value and benefits to customers across various industries. Elevate your projects to new heights with Intel's top-of-the-line FPGA.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FPGA, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the FPGA onto a circuit board, saving time and effort during assembly.

Maximum Supply Voltage: 1.13 V

The high maximum supply voltage ensures stable and consistent performance of the FPGA under varying load conditions.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board, enabling compact and streamlined designs.

Nominal Supply Voltage (V): 1.1

The nominal supply voltage indicates the optimal operating voltage for the FPGA, ensuring reliable and efficient functionality.

No. of Terminals: 484

The high number of terminals provides ample connectivity options for interfacing the FPGA with other components, making it versatile and adaptable for various applications.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a FPGA allows for flexibility and customization in programming the device for specific tasks, making it suitable for a wide range of applications.

Package Style (Meter): GRID ARRAY

The grid array package style enables easy alignment and mounting of the FPGA on the circuit board, enhancing the overall reliability and stability of the device.

Minimum Supply Voltage: 1.07 V

The low minimum supply voltage ensures efficient power consumption and extends the operational lifespan of the FPGA, promoting energy savings.

Pitch Of Terminal: 1 mm

The small pitch of the terminals allows for high-density connectivity and compact layout designs, enabling efficient use of space on the circuit board.

Finishing Of Terminal Used: TIN SILVER COPPER

The use of multiple finishing materials on the terminals improves conductivity and corrosion resistance, ensuring reliable performance and longevity of the FPGA.

Position Of Terminal: BOTTOM

The placement of terminals at the bottom facilitates easy and secure connections to the circuit board, enhancing the overall stability and reliability of the FPGA.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level indicates the device's resistance to moisture damage, making it suitable for a variety of operating environments and conditions.

Maximum Seated Height: 2 mm

The low seated height allows for a slim profile of the device, enabling compact and space-efficient designs in electronic applications.

Width: 23 mm

The moderate width of the FPGA provides a balance between compactness and connectivity options, making it a versatile choice for different circuit board layouts.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand high temperatures for a specified duration allows for efficient soldering and assembly processes, ensuring secure and durable connections.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates the device's reliability and durability during manufacturing processes, making it a resilient choice for demanding applications.

Length: 23 mm

The moderate length of the FPGA accommodates the necessary components and connections while maintaining a compact form factor, enabling versatile use in various electronic systems.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CGXFC9C6F23I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Temperature and Environmental Ratings

Peak Reflow Temperature:

260 °C (500 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

23 mm

Width:

23 mm

Maximum Seated Height:

2 mm

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

JESD-609 Code:

e1

Trade Compliance

5CGXFC9C6F23I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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