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A3P250-FGG256I

Microchip Technology

A3P250-FGG256I by Microchip Technology

A3P250-FGG256I by Microchip Technology is a CMOS-based Field Programmable Gate Array (FPGA) with 6144 CLBs and 250000 gates. It operates at a max clock frequency of 350 MHz and has a package style of GRID ARRAY. This FPGA is commonly used in industrial applications requiring high-speed processing and programmability.

Median Price

$31.149

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 65 parts In-Stock

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$26.680

100+ parts

$25.260

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65

$26.680

$25.260

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Microchip Technology

USA . 90 parts In-Stock

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$30.050

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$29.600

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$15.390

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90

$30.050

$29.600

$15.390

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Farnell

UK . 325 parts In-Stock

1+ parts

$31.149

100+ parts

$30.065

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$29.458

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325

$31.149

$30.065

$29.458

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Element14

Singapore . 325 parts In-Stock

1+ parts

$31.999

100+ parts

$30.889

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325

$31.999

$30.889

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Verical

USA . 90 parts In-Stock

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$69.586

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$38.454

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90

$69.586

$38.454

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 3,802 parts In-Stock

1+ parts

$23.261

100+ parts

$20.576

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$19.074

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3,802

$23.261

$20.576

$19.074

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Digiode

USA . 138 parts In-Stock

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$23.294

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138

$23.294

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Nova Conductors

Japan . 10 parts In-Stock

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$31.370

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10

$31.370

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Electro Sonic

Canada . 180 parts In-Stock

1+ parts

$32.780

100+ parts

$29.750

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$29.450

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180

$32.780

$29.750

$29.450

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VNN

France . 4,426 parts In-Stock

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Dan-Mar Components

USA . 3,870 parts In-Stock

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3,870

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Chip Stock

USA . 575 parts In-Stock

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575

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Component Sense

UK . 91 parts In-Stock

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91

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Vyrian

USA . 62 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1 parts In-Stock

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ComSIT USA

USA . 1 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 136 parts In-Stock

1+ parts

$22.068

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136

$22.068

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Semicontronic

India . 138 parts In-Stock

1+ parts

$22.440

100+ parts

$21.879

1k+ parts

$21.767

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138

$22.440

$21.879

$21.767

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Vigor

Singapore . 92,230 parts In-Stock

1+ parts

$23.849

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$23.849

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Corohmni

South Africa . 53 parts In-Stock

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$24.264

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53

$24.264

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Continental Prestige Electronics

USA . 4,558 parts In-Stock

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$26.100

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$25.190

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$26.100

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Microchip USA

USA . 1,252 parts In-Stock

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$30.550

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$30.550

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$60.723

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$57.686

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$57.686

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700

$60.723

$57.686

$57.686

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Aztec Data Supply Inc.

USA . 3,605 parts In-Stock

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$94.829

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$94.829

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Argo Parts USA

USA . 8,570 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$30.743

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$29.802

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$29.174

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$30.743

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$29.174

RC Electronics

USA . 987 parts In-Stock

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$30.420

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$27.770

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$26.930

987

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$30.420

$27.770

$26.930

Robosynatics

Brazil . 943 parts In-Stock

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$76.308

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$74.750

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$74.750

943

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$76.308

$74.750

$74.750

Lucentia Tech

USA . 943 parts In-Stock

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$76.308

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$74.750

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$74.750

943

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$76.308

$74.750

$74.750

Marpe Global Electronics

Taiwan . 683 parts In-Stock

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683

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QualityLine Systems

Poland . 683 parts In-Stock

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683

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XL Components Corporation

Australia . 683 parts In-Stock

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683

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Perfect Parts

USA . 640 parts In-Stock

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640

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Overview

Discover the power of the A3P250-FGG256I by Microchip Technology, a high-quality field programmable gate array (FPGA) that offers unmatched performance and versatility. Engineered with cutting-edge CMOS technology, this FPGA boasts 6144 CLBs and 250000 gates, providing endless possibilities for your next project. With its compact square package and surface mount capability, it's perfect for applications in industrial automation, telecommunications, and automotive systems. Experience the value of Microchip Technology's superior craftsmanship and unlock the potential of your designs with the A3P250-FGG256I.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This product is made with a durable plastic/epoxy material, making it resistant to damage and suitable for various environments.

Surface Mount:

YES - With surface mount capability, this product can easily be attached to circuit boards, saving valuable space.

Maximum Supply Voltage:

1.575 V - This high maximum supply voltage allows for efficient power management and reliable performance.

No. of CLBs:

6144 - With 6144 Configurable Logic Blocks (CLBs), this FPGA offers a high level of flexibility and customization.

Technology Used:

CMOS - Utilizing CMOS technology, this FPGA ensures low power consumption and fast switching speeds.

Package Shape:

SQUARE - The square package shape is compact and space-saving, allowing for efficient integration into circuit design.

Form Of Terminal:

BALL - The ball terminal design provides strong electrical connections and excellent heat dissipation.

No. of Equivalent Gates:

250000 - With a large number of equivalent gates, this FPGA can handle complex logic operations efficiently.

Nominal Supply Voltage (V):

1.5 - The nominal supply voltage of 1.5V ensures stable operation and compatibility with other components.

Packing Method:

TRAY - This product is packaged in a tray, providing easy handling and protection during transportation.

No. of Terminals:

256 - The high number of terminals allows for versatile connections and integration with other circuitry.

Programmable IC Type:

FIELD PROGRAMMABLE GATE ARRAY - Being a field programmable gate array, this product offers flexibility and adaptability for various applications.

Package Style (Meter):

GRID ARRAY - The package style of grid array provides excellent thermal management and reliable electrical connections.

Minimum Supply Voltage:

1.425 V - The low minimum supply voltage ensures reliable performance even in low-power operation.

Maximum Operating Temperature:

100 °C - With a high maximum operating temperature, this FPGA can withstand demanding environmental conditions.

Pitch Of Terminal:

1 mm - The small terminal pitch enables high-density circuit board designs and efficient use of space.

Organization:

6144 CLBs, 250000 GATES - The organization of 6,144 CLBs and 250,000 gates allows for complex and customizable logic functions.

Minimum Operating Temperature:

40 °C - With a low minimum operating temperature, this FPGA can handle extreme temperature environments.

Finishing Of Terminal Used:

TIN SILVER COPPER - The use of tin, silver, and copper finishing ensures reliable electrical connections and corrosion resistance.

Position Of Terminal:

BOTTOM - With the terminal positioned at the bottom, this FPGA can be easily integrated into circuit board designs.

Moisture Sensitivity Level (MSL):

3 - With an MSL of 3, this product can withstand moderate moisture exposure during storage and handling.

Maximum Seated Height:

1.8 mm - The low seated height allows for compact design and easy integration into space-constrained applications.

Width:

17 mm - With a width of 17mm, this FPGA can be easily accommodated in various circuit board layouts.

Maximum Clock Frequency:

350 MHz - This FPGA's high maximum clock frequency enables fast and efficient data processing.

Maximum Time At Peak Reflow Temperature (s):

30 - The ability to withstand the peak reflow temperature for up to 30 seconds ensures proper soldering and reliable connections.

Peak Reflow Temperature °C:

250 - The peak reflow temperature of 250°C allows for efficient soldering during assembly.

Length:

17 mm - With a length of 17mm, this FPGA is compact and suitable for applications with limited space.

Grading Of Temperature:

INDUSTRIAL - This FPGA is designed to withstand the temperature demands of industrial environments, ensuring reliable performance.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3P250-FGG256I attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Maximum Clock Frequency:

350 MHz

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

100 °C (212 °F)

Temperature Grade:

Peak Reflow Temperature:

250 °C (482 °F)

Peak Reflow Time:

30 s

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array

Package Code:

BGA

Package Shape:

Length:

17 mm

Width:

17 mm

Maximum Seated Height:

1.8 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Finish:

Tin Silver Copper

Terminal Pitch:

1 mm

No. of Terminals:

256

Standards

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Qualified:

No

Trade Compliance

A3P250-FGG256I Programmable ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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