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A3P250-VQG100M

Microchip Technology

A3P250-VQG100M by Microchip Technology

A3P250-VQG100M by Microchip Tech: 6144 CLBs, 250000 gates, CMOS tech. Ideal for military applications with -55 to 125 °C operating temp range and 1.425-1.575 V supply voltage. Package style: flatpack, thin profile, fine pitch.

Median Price

$200.920

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 22 parts In-Stock

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$200.920

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$195.960

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Verical

USA . 22 parts In-Stock

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$200.920

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$195.960

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Microchip Technology

USA . 6 parts In-Stock

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$204.920

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$201.720

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$104.960

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Distributors (In-Stock)

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Digiode

USA . 457 parts In-Stock

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NAC Semi

USA . 5 parts In-Stock

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$202.860

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$186.840

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$173.170

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Nova Conductors

Japan . 150 parts In-Stock

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$231.167

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Chip Stock

USA . 5,400 parts In-Stock

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VNN

France . 3,092 parts In-Stock

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Vyrian

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Distributors (Availability)

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AZTECH Wire

Italy . 641 parts In-Stock

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$17.630

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Aztec Data Supply Inc.

USA . 268 parts In-Stock

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$127.293

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Corohmni

South Africa . 794 parts In-Stock

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Microchip USA

USA . 2,039 parts In-Stock

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$141.550

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$140.850

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$140.500

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$140.150

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$140.150

Ampacity Inc.

Singapore . 20 parts In-Stock

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$161.790

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Corphita

USA . 437 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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Continental Prestige Electronics

USA . 6,712 parts In-Stock

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$226.543

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Netroflash

USA . 2,000 parts In-Stock

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$231.167

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Component Stockers USA

USA . 259 parts In-Stock

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$239.940

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Semicontronic

India . 22 parts In-Stock

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$352.130

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$343.327

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Vigor

Singapore . 6,000 parts In-Stock

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Argo Parts USA

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Fulton Briggs Corp.

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Authorized Procurement Solutions

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RC Electronics

USA . 118 parts In-Stock

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$224.560

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Robosynatics

Brazil . 100 parts In-Stock

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$0.407

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Lucentia Tech

USA . 100 parts In-Stock

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the A3P250-VQG100M by Microchip Technology, a top-tier manufacturer known for its high-quality products. This Field Programmable Gate Array offers endless possibilities for applications in various industries, providing customers with unparalleled flexibility and customization. Experience the benefits of advanced CMOS technology and superior performance, all in a compact and durable package. Elevate your projects to new heights with the A3P250-VQG100M and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in electronic components for its durability and insulation properties.

Surface Mount: YES

Allows for easy installation on a circuit board without the need for additional mounting hardware.

Maximum Supply Voltage: 1.575 V

Provides a stable voltage input for reliable performance.

No. of CLBs: 6144

High number of Configurable Logic Blocks allows for complex logic functions to be implemented efficiently.

Technology Used: CMOS

CMOS technology offers low power consumption and high noise immunity.

Package Shape: SQUARE

Square shape allows for efficient use of space on a circuit board.

Form Of Terminal: GULL WING

Gull wing terminals provide a reliable connection to the circuit board.

No. of Equivalent Gates: 250000

Large number of equivalent gates allows for complex logic operations to be implemented.

Nominal Supply Voltage (V): 1.5

Standard supply voltage for compatibility with other components.

Packing Method: TRAY

Tray packing ensures safe transport and storage of the FPGA.

No. of Terminals: 100

Sufficient number of terminals for connecting to other components on the circuit board.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

FPGA allows for reprogramming of the logic functions, making it versatile for different applications.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

Compact package style makes the FPGA suitable for applications with limited space.

Minimum Supply Voltage: 1.425 V

Low minimum supply voltage allows for flexibility in power requirements.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliable performance in various environments.

Pitch Of Terminal: 0.5 mm

Fine pitch terminals allow for high density connections on the circuit board.

Organization: 6144 CLBS, 250000 GATES

Organized structure of CLBs and gates allows for efficient implementation of logic functions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in extreme cold conditions.

Position Of Terminal: QUAD

Quad position terminals offer a secure connection to the circuit board.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the FPGA can withstand some exposure to moisture during assembly.

Maximum Seated Height: 1.2 mm

Low seated height allows for a compact design of the circuit board.

Width: 14 mm

Compact width allows for efficient use of space on the circuit board.

Length: 14 mm

Square shape with a length of 14 mm offers a balanced design for the FPGA.

Grading Of Temperature: MILITARY

Military-grade temperature rating ensures reliable performance in harsh environments.

Technical Specifications

Field Programmable Gate Arrays (FPGA) A3P250-VQG100M attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Microchip Technology

IC Features

Programmable IC Type:

No. of CLBs:

6144

No. of Equivalent Gates:

250000

Technology:

CMOS

Organization:

6144 CLBS, 250000 Gates

Power Characteristics

Nominal Supply Voltage:

1.5

Minimum Supply Voltage:

1.425 V

Maximum Supply Voltage:

1.575 V

Temperature and Environmental Ratings

Minimum Operating Temperature:

-55 °C (-67 °F)

Maximum Operating Temperature:

125 °C (257 °F)

Temperature Grade:

Moisture Sensitivity Level (MSL):

3

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Flatpack, Thin Profile, Fine Pitch

Package Code:

Package Shape:

Length:

14 mm

Width:

14 mm

Maximum Seated Height:

1.2 mm

Packing Method:

Tray

Terminal Characteristcs

Terminal Position:

Quad

Terminal Style:

Terminal Pitch:

.5 mm

No. of Terminals:

100

Standards

JESD-30 Code:

S-PQFP-G100

Trade Compliance

A3P250-VQG100M Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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